JPH0474460U - - Google Patents
Info
- Publication number
- JPH0474460U JPH0474460U JP11813490U JP11813490U JPH0474460U JP H0474460 U JPH0474460 U JP H0474460U JP 11813490 U JP11813490 U JP 11813490U JP 11813490 U JP11813490 U JP 11813490U JP H0474460 U JPH0474460 U JP H0474460U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pellet
- island
- bonding
- bent portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118134U JP2518247Y2 (ja) | 1990-11-09 | 1990-11-09 | リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118134U JP2518247Y2 (ja) | 1990-11-09 | 1990-11-09 | リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0474460U true JPH0474460U (US20030199744A1-20031023-C00003.png) | 1992-06-30 |
| JP2518247Y2 JP2518247Y2 (ja) | 1996-11-27 |
Family
ID=31866043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990118134U Expired - Lifetime JP2518247Y2 (ja) | 1990-11-09 | 1990-11-09 | リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2518247Y2 (US20030199744A1-20031023-C00003.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012195502A (ja) * | 2011-03-17 | 2012-10-11 | Yazaki Corp | モジュールの端子構造 |
| CN111916420A (zh) * | 2019-05-08 | 2020-11-10 | 三菱电机株式会社 | 半导体装置及其制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5460563A (en) * | 1977-10-21 | 1979-05-16 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
-
1990
- 1990-11-09 JP JP1990118134U patent/JP2518247Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5460563A (en) * | 1977-10-21 | 1979-05-16 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012195502A (ja) * | 2011-03-17 | 2012-10-11 | Yazaki Corp | モジュールの端子構造 |
| CN111916420A (zh) * | 2019-05-08 | 2020-11-10 | 三菱电机株式会社 | 半导体装置及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2518247Y2 (ja) | 1996-11-27 |
