JPH0474001A - Package for semiconductor integrated circuit package - Google Patents

Abstract

PURPOSE:To minimize the length required for the connection to the utmost by forming a signal line with a strip line and connecting the strip line and a coaxial cable as an external circuit in a way of plug-socket connection. CONSTITUTION:A core wire 5 of a semi-rigid cable 6 is plugged into and connected to a core wire receptacle 7 and a ground 6a of the cable 6 is connected electrically to a ground plane 8 of a strip line 2 in the very vicinity of the plug-socket connection with a microstrip line 2. The ground 6a and a base 3 are soldered by supplying solder through a hole 3a of a semi-rigid cable base 3. On the other hand, solder is coated in advance in the inside of the recessed part of the core wire base 7, the core wire 5 is inserted to the recessed part of the base 7 and heated by a solder iron and they are soldered by molten the solder.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a package for a semiconductor integrated circuit, and particularly to a package mounting a high frequency LSI.

[Conventional technology]

Conventionally, connections between high-frequency semiconductor integrated circuit devices or connections with the outside have been made via coaxial cables in order to adjust the phase of high-frequency signals. To connect the signal line lead of the semiconductor integrated circuit device and the coaxial cable, as shown in FIG. The ground of the semi-rigid cable 25 was connected to a ground 27 separately provided outside the package body 22 by soldering.

[Problem to be solved by the invention]

Conventional connections require extra length for the core wires of semi-rigid cables, such as licks, swords, and 7-millimeter wires that connect the core wires of semi-rigid cables to the leads outside the package body.

Figures 4 (a) to (d) show TDR waveforms obtained by TDR measurements in a 50Ω system when the input amplitude is 200mV and the length of the connection varies within the range of 1 to 4. It is. As shown in FIG. 4(a), in the conventional connection method, when the length of the contact portion is 1-, the impedance of the connecting portion is 61Ω, and as shown in FIG. 4(b).

As is clear from (C), the impedance increases as the length increases to 2Ω or 3Ω, and as shown in Figure 4(d), when the length becomes 4−, the impedance increases to 83Ω. This caused signal reflection due to impedance mismatch at the connection.

An object of the present invention is to provide a semiconductor package that eliminates impedance mismatch.

[Means for Solving the Problems] In order to achieve the above object, in the semiconductor package according to the present invention, the signal IIA#! A package for a semiconductor integrated circuit device comprising a strip line, in which at least one connection part with an external circuit has a structure in which a strip line in the package body and a core wire of a coaxial cable are connected in a concave-convex manner. The ground of the coaxial cable is connected to the ground plane of the strip line.

Further, the connection portion has a concave portion on the strip line side,
The core side of the coaxial cable has a convex part and the connecting part has a convex part, and the core side of the coaxial cable has a concave part, and the connecting part has a convex part, and the core part of the coaxial cable has a concave part, and has a concave part and a concave part, and has a concave part and a concave part. .

[Effect]

The signal line is composed of a strip line, and the strip line and a coaxial cable serving as an external circuit are coupled in a concave-convex manner. Thereby, the length required for connection can be shortened as much as possible.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

(Example 1) FIG. 1 is a structural diagram showing a first embodiment of the present invention.

In the figure, a microstrip line 2 is built inside a package body 1 and is connected to a concave 7 mm cable core receiver 7 whose inside is coated with solder in advance. The package body 1 has leads 4 and a hollow 7 mm cable receiver 3 on the outside. 9.
10 indicates one side of the package.

The hollow semi-rigid cable receiver 3 is connected to the ground plane 8 of the microstrip line 2.

The 7 millimeter cable 6 as a coaxial cable has a core wire 5 on its axis, and a ground 6a coaxially with the core wire 5.
The core wire 5 protrudes forward from the cut end surface of the semi-rigid cable 6.

In the semi-rigid cable 6, the core wire 5 is concave-convexly coupled to the 7-millimeter cable core receiver 7, and the ground 6a is concave-convexly coupled to the 7-millimeter cable receiver 3. The ground 6a of the semi-rigid cable 6 is electrically connected to the ground plane 8 of the strip line 2 in the vicinity of the concave-convex joint between the semi-rigid cable 6 and the microstrip line 2. The ground 6a and the semi-rigid cable receiver 3 are fixed by flowing solder through the hole 3a of the semi-rigid cable receiver 3. On the other hand, the inside of the recess of the 7-millimeter cable core receiver 7 is coated with solder in advance, and after the core wire 5 of the 7-millimeter cable 6 is inserted into the recess of the semi-rigid cable core receiver 7, the package body 1 is soldered. Heat with a iron or hot plate to melt and fix the solder coated on the inside of the recess.

(Example 2) No. 251 is a structural diagram showing Example 2 of the present invention.

In the figure, a microstrip line 2 connected to a convex semi-rigid cable core receiver 7a is built inside a package body 1. The package body 1 has leads 4 and a semicircular 7 mm cable receiver 13 whose upper surface is coated with solder in advance on the outside of the package body 1. The 7 millimeter cable receiver 13 is connected to the ground plane 8 of the microstrip line 2.

A metal cap 12 is connected in advance to the tip of the core wire 5 of the semi-rigid cable 6 by soldering. # to cable core 5
Connect the continuous cap 12 to the semi-rigid cable core receiver 7
This is done by fitting a into the concave and convex portions.

The ground 6a of the 7 mm cable 6 is placed on the semi-rigid cable receiver 13, and the 7 mm cable receiver 1
Heat 3 with a soldering iron or the like to melt the coated solder and connect.

FIG. 5 shows a waveform obtained by TDR measurement in a 50Ω system with the input 111g being 200mV.

By using the method of the present invention, the length of the connection between the lead of the semiconductor package and the core wire of the 7 millimeter cable is structurally O-, and its impedance is reduced to 53Ω as shown in FIG. Signal reflection due to impedance mismatching is less likely to occur, and signal reflection due to impedance mismatching can be reduced to about 30Ω to 8Ω.

〔Effect of the invention〕

As explained above, the present invention enables impedance matching to be achieved by structurally setting the length of the connection part to 0- in a semiconductor package having a 7 millimeter cable connection part made of a microstrip line, thereby preventing signal reflection. It has the effect of suppressing

[Brief explanation of drawings]

Fig. 1 is a structural diagram showing Embodiment 1 of the present invention, Fig. 2 is a structural diagram showing Embodiment 2 of the present invention, and Fig. 3 is a connection between the core wire of a conventional 7 mm cable and the lead of the package. Fig. 4(a) is a structural diagram showing the part. (b), (C), and (d) are TDR waveform diagrams showing the waveforms when the length of the connection part varies in the range of 1- to 4- in the conventional example, and Fig. 5 is the TDR waveform diagram according to the method of the present invention. TDR
FIG. 1...Package body 2...Microstrip line 3...Semi-rigid cable receiver 4...Lead 5...7 millimeter cable core 6...7 millimeter cable 6a-7 millimeter cable Grand 7.7a...
・Semi-rigid cable core receiver 8...Ground plane of microstrip line 12...Cap Patent applicant NEC Corporation Representative Patent attorney Kayano Naka 1 (No. (α) 4 Figure 3)

Claims (3)

[Claims] (1) A package for a semiconductor integrated circuit device in which the signal line inside the package body is composed of a strip line, and at least one connection with an external circuit is between the strip line inside the package body and a coaxial cable. What is claimed is: 1. A package for a semiconductor integrated circuit device, characterized in that the package has a structure in which the core wires of the coaxial cable are coupled in a concave-convex manner, and a ground of the coaxial cable is connected to a ground plane of the strip line. (2) The connection portion has a concave portion on the strip line side,
2. The package for a semiconductor integrated circuit device according to claim 1, wherein the core wire side of the coaxial cable has a convex portion and is connected in a concave-convex manner. (3) The connection part has a convex part on the strip line side,
2. The package for a semiconductor integrated circuit device according to claim 1, wherein the core wire side of the coaxial cable has a concave portion and a convex-concave bonding structure.