JPH0472746A - Cooling of electronic equipment - Google Patents
Cooling of electronic equipmentInfo
- Publication number
- JPH0472746A JPH0472746A JP18435590A JP18435590A JPH0472746A JP H0472746 A JPH0472746 A JP H0472746A JP 18435590 A JP18435590 A JP 18435590A JP 18435590 A JP18435590 A JP 18435590A JP H0472746 A JPH0472746 A JP H0472746A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- peltier element
- cooling
- current
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 20
- 238000010521 absorption reaction Methods 0.000 claims abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、電子機器の冷却方法に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a method for cooling electronic equipment.
〈従来の技術〉
近来、電子装置の小型化の要求に伴い、電子装置内に組
み込まれる電子部品の実装密度がますます増加しつつあ
り、これにともなって、電子部品からの発熱量の増加が
問題となっている。特に電力消費の大きい部品に対して
は、放熱・冷却対策が必要である。<Conventional technology> In recent years, with the demand for miniaturization of electronic devices, the packaging density of electronic components incorporated into electronic devices has been increasing more and more, and with this, the amount of heat generated from electronic components has increased. This has become a problem. Particularly for parts with large power consumption, heat dissipation and cooling measures are required.
〈発明が解決しようとする課題〉
しかしながら、従来は、発熱する電子部品を積極的に冷
却する手段をとらずに、冷却用のフィンを設けて自然放
熱に依存しているのが殆どであるから、冷却が不十分に
なってフィンや基板の大型化を招き、電子装置の小型化
を達成することができないという問題があった。<Problem to be solved by the invention> However, in the past, most electronic components that generate heat have not been actively cooled down, but have relied on natural heat dissipation by providing cooling fins. However, there was a problem in that cooling became insufficient, leading to an increase in the size of the fins and the board, making it impossible to downsize the electronic device.
このような問題を解決する手段として、例えば特開昭６
３−２９９９９号公報には、内部に電子回路部品を備え
たモジュールをペルチェ素子の吸熱側端面に接触させ、
ペルチェ素子の発熱側端面を高放熱体に接触させるよう
にした電子装置モジュール冷却構造が提案されている。As a means to solve such problems, for example,
No. 3-29999 discloses a method in which a module having an electronic circuit component therein is brought into contact with an end surface on the endothermic side of a Peltier element,
An electronic device module cooling structure has been proposed in which the heat generating side end face of the Peltier element is brought into contact with a high heat dissipation body.
しかし、この場合では、電子機器本体とはまったく独立
に冷却するものを構築することになるので、電子部品で
発生する熱量（ｉｌｌ力量）の如何にかかわらず冷却の
ための電流を流すことになるため、冷却する必要がない
時には無駄な電流を流し続けるという欠点があった。However, in this case, a device that cools the electronic device is constructed completely independently of the main body of the electronic device, so current for cooling must be passed regardless of the amount of heat (ill capacity) generated by the electronic component. Therefore, there was a drawback that unnecessary current continued to flow when there was no need for cooling.
一方、上記のような無駄な電流を流さないようにするた
めには、例えば特開昭６１−１８４３７２号公報に開示
されているような温度調節機能を付加するようにすれば
可能であるが、しかし装置が大型化してしまい、所期の
目的である小型化の要求を満たすことができないのであ
る。On the other hand, in order to prevent the above-mentioned wasteful current from flowing, it is possible to add a temperature control function as disclosed in JP-A-61-184372, for example. However, the device becomes large and cannot meet the desired goal of miniaturization.
本発明は、上記のような課題を解決すべくしてなされた
ものであって、電子機器の効率を大きく損なうことなく
小型化を実現し得る電子機器の冷却方法を提供すること
を目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a cooling method for electronic equipment that can realize miniaturization without significantly impairing the efficiency of the electronic equipment.
〈課題を解決するための手段〉
本発明は、電子機器の発熱部品をベルチェ素子の吸熱側
端面に熱接触させ、前記ベルチェ素子の発熱側端面に高
放熱体を熱接触させて前記発熱部品の発生熱を前記ベル
チェ素子を介して前記高放熱体に放熱する電子機器の冷
却方法において、前記ベルチェ素子に流す電流を前記発
熱部品における熱発生にともなってベルチェ素子に吸収
される際に消費される電力量に対応した量だけ流すよう
に制御することを特徴とする電子機器の冷却方法である
。<Means for Solving the Problems> The present invention brings a heat-generating component of an electronic device into thermal contact with an end surface on the heat-absorbing side of a Beltier element, and brings a high heat radiator into thermal contact with the end surface on the heat-generating side of the Beltier element. In a method for cooling an electronic device in which generated heat is radiated to the high heat dissipation body via the Beltier element, the current flowing through the Beltier element is consumed when absorbed by the Beltier element as heat is generated in the heat generating component. This is a cooling method for electronic equipment characterized by controlling the amount of electricity to flow in accordance with the amount of electricity.
〈作 用〉
本発明によれば、発熱部品の熱発生に見合った電流をベ
ルチェ素子に流すように制御するので、無駄がなく効率
のよい冷却を実現することができる。<Function> According to the present invention, since the current is controlled to flow through the Vertier element in accordance with the heat generation of the heat generating component, efficient cooling without waste can be realized.
〈実施例〉
以下に、本発明の実施例について、図面を参照して詳し
く説明する。<Examples> Examples of the present invention will be described in detail below with reference to the drawings.
本発明のベルチェ素子による発熱部品冷却の基本的な構
成は、第１図に示すように、電子機器の発熱部品（例え
ばスイッチングトランジスタとかダイオードなど）１を
搭載した基板２をベルチェ素子３の吸熱側端面３ａに熱
接触させ、このベルチェ素子３の発熱側端面３ｂに高放
熱体４を熱接触させて発熱部品１を冷却するのである。The basic configuration of cooling heat-generating components using the Beltier element of the present invention is as shown in FIG. The heat-generating component 1 is cooled by bringing it into thermal contact with the end surface 3a, and by bringing the high heat dissipation body 4 into thermal contact with the heat-generating end surface 3b of the Bertier element 3.
その冷却の際、ベルチェ素子３に流す電流は、第２図の
ブロック図に示すように、直流！＃５がらサーモモジュ
ールドライハロを介して供給するようにする。During cooling, the current flowing through the Beltier element 3 is a direct current, as shown in the block diagram of Fig. 2! #5 will be supplied through the thermo module dry harrow.
このとき、サーモモジュールドライバ６は、制御装置７
によって発熱部品１での熱発生にともなってベルチェ素
子３によって吸収される際に消費される電力量に対応す
る電流量だけ流すように制御される。At this time, the thermo module driver 6 controls the control device 7.
Control is performed so that only the amount of current corresponding to the amount of power consumed when heat is generated in the heat generating component 1 and absorbed by the Bertier element 3 is caused to flow.
ここで、このベルチェ素子３に流す電流量（を力量）に
ついては、発熱部品１で発生する発熱量や発熱部品１か
らベルチェ素子３を含む周囲への熱の放散の総括熱伝達
係数、あるいは外界温度などを考慮して決定されるが、
一般には発熱部品１で発生する電力量の５０％ないし９
０％の範囲で選択される。Here, the amount of current (competency) flowing through this Beltier element 3 is determined by the amount of heat generated in the heat generating component 1, the overall heat transfer coefficient of heat dissipation from the heat generating component 1 to the surroundings including the Beltier element 3, or the external environment. It is determined by considering temperature etc.
Generally, 50% to 9 of the power generated by heat generating component 1
Selected in the range of 0%.
なお、高放熱体４としては、熱伝導性のよい銅やアルミ
、鉄などの金属以外にセラミックや慴脂などの基板を用
いてもよく、また放熱フィンを設けるようにしてもよい
。Note that as the high heat dissipation body 4, a substrate made of ceramic, resin, etc. may be used in addition to metals with good thermal conductivity such as copper, aluminum, and iron, and heat dissipation fins may be provided.
また、ベルチェ素子３の吸熱側端面３ａ、発熱側端面３
ｂとの熱接触を良好にするため、例えばペーストを塗布
するとかボルト締めなどの手段を講するのが望ましい。In addition, the end face 3a on the heat absorption side and the end face 3 on the heat generation side of the Beltier element 3
In order to improve thermal contact with b, it is desirable to take measures such as applying a paste or tightening bolts.
〈発明の効果〉
以上説明したように、本発明によれば、発熱部品での熱
発生にともなってベルチェ素子によって吸収される際に
消費される電力量に対応する１を流量だけをベルチェ素
子に流すように制御するので、効率のよい冷却を実現す
ることができる。<Effects of the Invention> As explained above, according to the present invention, only the flow rate 1 corresponding to the amount of power consumed when absorbed by the Beltier element as heat is generated in the heat generating component is transferred to the Beltier element. Since it is controlled to flow, efficient cooling can be achieved.
第１図は本発明に係る電子機器の発熱部品冷却の基本的
な構成を示す模式図、第２図はベルチェ素子への電流制
御系を示すブロック図である。
ｌ・・・発熱部品、 ２・・・基板、 ３・・・ペ
ルチェ素子、 ３ａ・・・吸熱側端面、 ３ｂ・
・・発熱側端面。
４・・・高放熱体、 ５・・・直流を源、 ６・・
・サーモモジュールドライバ、 ７・・・制御装置。
特許出願人 川崎製鉄株式会社FIG. 1 is a schematic diagram showing the basic configuration of cooling heat-generating components of an electronic device according to the present invention, and FIG. 2 is a block diagram showing a current control system for a Vertier element. l... Heat generating component, 2... Substrate, 3... Peltier element, 3a... End face on the endothermic side, 3b.
...Heat-generating side end face. 4... High heat dissipation body, 5... Direct current source, 6...
-Thermo module driver, 7...control device. Patent applicant: Kawasaki Steel Corporation
Claims (1)
接触させ、前記ペルチェ素子の発熱側端面に高放熱体を
熱接触させて前記発熱部品の発生熱を前記ペルチェ素子
を介して前記高放熱体に放熱する電子機器の冷却方法に
おいて、前記ペルチェ素子に流す電流を前記発熱部品に
おける熱発生にともなってペルチェ素子に吸収される際
に消費される電力量に対応した量だけ流すように制御す
ることを特徴とする電子機器の冷却方法。A heat generating component of an electronic device is brought into thermal contact with an end surface on the heat absorption side of a Peltier element, and a high heat radiator is brought into thermal contact with the end surface of the heat generating side of the Peltier element, so that the heat generated by the heat generating component is transferred to the high heat radiator through the Peltier element. In a cooling method for an electronic device that dissipates heat, the current flowing through the Peltier element is controlled to flow in an amount corresponding to the amount of electric power consumed when the heat generated in the heat generating component is absorbed by the Peltier element. A cooling method for electronic equipment characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18435590A JPH0472746A (en) | 1990-07-13 | 1990-07-13 | Cooling of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18435590A JPH0472746A (en) | 1990-07-13 | 1990-07-13 | Cooling of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472746A true JPH0472746A (en) | 1992-03-06 |
Family
ID=16151800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18435590A Pending JPH0472746A (en) | 1990-07-13 | 1990-07-13 | Cooling of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472746A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476483B1 (en) * | 1999-10-20 | 2002-11-05 | International Business Machines Corporation | Method and apparatus for cooling a silicon on insulator device |
| US7276814B2 (en) | 2002-01-02 | 2007-10-02 | Ruggedcom Inc. | Environmentally hardened ethernet switch |
-
1990
- 1990-07-13 JP JP18435590A patent/JPH0472746A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476483B1 (en) * | 1999-10-20 | 2002-11-05 | International Business Machines Corporation | Method and apparatus for cooling a silicon on insulator device |
| US7276814B2 (en) | 2002-01-02 | 2007-10-02 | Ruggedcom Inc. | Environmentally hardened ethernet switch |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080229759A1 (en) | Method and apparatus for cooling integrated circuit chips using recycled power | |
| JP5114092B2 (en) | Method for generating voltage and system for regulating the temperature of at least one thermoelectric module | |
| JP2000091884A (en) | Electronic circuit device | |
| JP2004319658A (en) | Electronic cooler | |
| KR20170003663U (en) | Electric transformer | |
| JPH0472746A (en) | Cooling of electronic equipment | |
| JPS5664289A (en) | Cooler | |
| JP2005136212A (en) | Heat exchanger | |
| CN208385396U (en) | Central Processor Module, electronic equipment, mobile phone | |
| JP2000058746A (en) | Device for cooling inside of module | |
| JPH0846095A (en) | Cooling device with cooling-power variable mechanism | |
| JP2002353668A (en) | Electronic component cooling unit and cooling system | |
| CN212113700U (en) | Heat radiation structure and radiator | |
| JP2013143792A (en) | Electric power generation system | |
| KR20100008311A (en) | Apparatus for protection against heat of power supply unit | |
| EP0766308A3 (en) | Reduced thermal cycling of water cooled power electronic devices | |
| JP2001230584A (en) | Cooling method for component mounted on printed wiring board utilizing thermoelectric cooling element | |
| JP4325026B2 (en) | Cooling device and electronic equipment | |
| JP2002190687A (en) | Cooling device for electronic equipment | |
| JP2004200428A (en) | Cooling device | |
| JP3590325B2 (en) | Cooling device for electronic components | |
| JP2705657B2 (en) | Satellite thermal control system | |
| JPS5857679B2 (en) | electronic heat exchange unit | |
| JP2541518Y2 (en) | Solar air conditioner | |
| CN108507226A (en) | A kind of electronic equipment radiating module |