JPH0472724U - - Google Patents

Info

Publication number
JPH0472724U
JPH0472724U JP1990116801U JP11680190U JPH0472724U JP H0472724 U JPH0472724 U JP H0472724U JP 1990116801 U JP1990116801 U JP 1990116801U JP 11680190 U JP11680190 U JP 11680190U JP H0472724 U JPH0472724 U JP H0472724U
Authority
JP
Japan
Prior art keywords
light emitting
light
semiconductor relay
emitting diodes
optical coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116801U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116801U priority Critical patent/JPH0472724U/ja
Publication of JPH0472724U publication Critical patent/JPH0472724U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Electronic Switches (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す半導体リレー
の構造図、第２図は第１図に示す半導体リレーの
回路図、第３図ａ〜ｃはそれぞれ第２図における
光結合部の動作を時系列で表わした回路図および
第３図ｄはその波形図、第４図は従来の一例を示
す半導体リレーの構造図、第５図ａ，ｂはそれぞ
れ第４図に示す半導体リレーの回路図およびその
波形図である。 １，２……発光ダイオード、３，４……光結合
部、５，６……ＭＯＳＦＥＴスイツチ、７……光
反射樹脂、８……リード端子、９……ワイヤーボ
ンデイング、１０……モールド型パツケージ。 Fig. 1 is a structural diagram of a semiconductor relay showing an embodiment of the present invention, Fig. 2 is a circuit diagram of the semiconductor relay shown in Fig. 1, and Figs. A circuit diagram and a waveform diagram of FIG. 3 d are shown in chronological order, FIG. 4 is a structural diagram of a semiconductor relay showing a conventional example, and FIGS. 5 a and b are circuits of the semiconductor relay shown in FIG. 4, respectively. FIG. 2 is a diagram and its waveform diagram. 1, 2... Light emitting diode, 3, 4... Optical coupling section, 5, 6... MOSFET switch, 7... Light reflective resin, 8... Lead terminal, 9... Wire bonding, 10... Molded package .

Claims (1)

【実用新案登録請求の範囲】 １ 入力電流に応じ発光ダイオードから生じる光
が光結合素子を介してＭＯＳＦＥＴを駆動する半
導体リレーにおいて、設置位置の異なる複数の発
光ダイオードの光伝達時間差を利用してコンテニ
アス駆動化したことを特徴とする半導体リレー。 ２ リードフレーム上に固着される複数の発光ダ
イオードと複数の光結合部および複数のＭＯＳＦ
ＥＴスイツチ素子とを有し、前記複数の発光ダイ
オードが同一入力信号により発光し、それぞれ別
の光伝達系を通つて対応する前記複数の光結合部
に光が到達し、更に対応する前記ＭＯＳＦＥＴス
イツチ素子を或る時間差をもつて開閉させる構造
を有することを特徴とする半導体リレー。[Claims for Utility Model Registration] 1. In a semiconductor relay in which light generated from a light emitting diode in response to an input current drives a MOSFET via an optical coupling element, continuous transmission is achieved by utilizing the difference in light transmission time between a plurality of light emitting diodes installed at different locations. A semiconductor relay characterized by being driven. 2 Multiple light emitting diodes, multiple optical coupling parts, and multiple MOSFs fixed on a lead frame
ET switch element, wherein the plurality of light emitting diodes emit light in response to the same input signal, the light reaches the corresponding plurality of optical coupling parts through separate optical transmission systems, and the corresponding MOSFET switch element. A semiconductor relay characterized by having a structure in which elements are opened and closed with a certain time difference.
JP1990116801U 1990-11-07 1990-11-07 Pending JPH0472724U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116801U JPH0472724U (en) 1990-11-07 1990-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116801U JPH0472724U (en) 1990-11-07 1990-11-07

Publications (1)

Publication Number Publication Date
JPH0472724U true JPH0472724U (en) 1992-06-26

Family

ID=31864640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116801U Pending JPH0472724U (en) 1990-11-07 1990-11-07

Country Status (1)

Country Link
JP (1) JPH0472724U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006134996A (en) * 2004-11-04 2006-05-25 Hitachi Displays Ltd Illuminator, its manufacturing method and display device using illuminator

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297915A (en) * 1988-05-26 1989-12-01 Matsushita Electric Works Ltd Semiconductor relay circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297915A (en) * 1988-05-26 1989-12-01 Matsushita Electric Works Ltd Semiconductor relay circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006134996A (en) * 2004-11-04 2006-05-25 Hitachi Displays Ltd Illuminator, its manufacturing method and display device using illuminator

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