JPH0472680U - - Google Patents

Info

Publication number
JPH0472680U
JPH0472680U JP11698990U JP11698990U JPH0472680U JP H0472680 U JPH0472680 U JP H0472680U JP 11698990 U JP11698990 U JP 11698990U JP 11698990 U JP11698990 U JP 11698990U JP H0472680 U JPH0472680 U JP H0472680U
Authority
JP
Japan
Prior art keywords
layer
wiring board
printed wiring
conductive hole
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11698990U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11698990U priority Critical patent/JPH0472680U/ja
Publication of JPH0472680U publication Critical patent/JPH0472680U/ja
Pending legal-status Critical Current

Links

JP11698990U 1990-11-06 1990-11-06 Pending JPH0472680U (US07652168-20100126-C00068.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11698990U JPH0472680U (US07652168-20100126-C00068.png) 1990-11-06 1990-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11698990U JPH0472680U (US07652168-20100126-C00068.png) 1990-11-06 1990-11-06

Publications (1)

Publication Number Publication Date
JPH0472680U true JPH0472680U (US07652168-20100126-C00068.png) 1992-06-26

Family

ID=31864854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11698990U Pending JPH0472680U (US07652168-20100126-C00068.png) 1990-11-06 1990-11-06

Country Status (1)

Country Link
JP (1) JPH0472680U (US07652168-20100126-C00068.png)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622697A (ja) * 1985-06-26 1987-01-08 ゼネラル　セラミツクス　インコ−ポレイテツド 多層セラミツク回路盤とその製法
JPS6226896A (ja) * 1985-07-26 1987-02-04 日本電気株式会社 電子回路パツケ−ジ
JPS6337693A (ja) * 1986-08-01 1988-02-18 日本電気株式会社 多層配線基板の製造方法
JPS6480524A (en) * 1987-09-24 1989-03-27 Matsushita Electric Works Ltd Multi-layer printed wiring board
JPH01100996A (ja) * 1987-10-14 1989-04-19 Canon Inc 多層プリント配線基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622697A (ja) * 1985-06-26 1987-01-08 ゼネラル　セラミツクス　インコ−ポレイテツド 多層セラミツク回路盤とその製法
JPS6226896A (ja) * 1985-07-26 1987-02-04 日本電気株式会社 電子回路パツケ−ジ
JPS6337693A (ja) * 1986-08-01 1988-02-18 日本電気株式会社 多層配線基板の製造方法
JPS6480524A (en) * 1987-09-24 1989-03-27 Matsushita Electric Works Ltd Multi-layer printed wiring board
JPH01100996A (ja) * 1987-10-14 1989-04-19 Canon Inc 多層プリント配線基板

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