JPH0472633U - - Google Patents
Info
- Publication number
- JPH0472633U JPH0472633U JP1990116179U JP11617990U JPH0472633U JP H0472633 U JPH0472633 U JP H0472633U JP 1990116179 U JP1990116179 U JP 1990116179U JP 11617990 U JP11617990 U JP 11617990U JP H0472633 U JPH0472633 U JP H0472633U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- notch
- package
- seal member
- metal seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990116179U JPH0472633U (fr) | 1990-11-07 | 1990-11-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990116179U JPH0472633U (fr) | 1990-11-07 | 1990-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0472633U true JPH0472633U (fr) | 1992-06-26 |
Family
ID=31863997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990116179U Pending JPH0472633U (fr) | 1990-11-07 | 1990-11-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0472633U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109140A (ja) * | 2008-10-30 | 2010-05-13 | Nec Electronics Corp | 電子装置およびリッド |
-
1990
- 1990-11-07 JP JP1990116179U patent/JPH0472633U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010109140A (ja) * | 2008-10-30 | 2010-05-13 | Nec Electronics Corp | 電子装置およびリッド |