JPH02114943U - - Google Patents

Info

Publication number
JPH02114943U
JPH02114943U JP1989022554U JP2255489U JPH02114943U JP H02114943 U JPH02114943 U JP H02114943U JP 1989022554 U JP1989022554 U JP 1989022554U JP 2255489 U JP2255489 U JP 2255489U JP H02114943 U JPH02114943 U JP H02114943U
Authority
JP
Japan
Prior art keywords
semiconductor element
base metal
resin
mounting structure
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989022554U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989022554U priority Critical patent/JPH02114943U/ja
Publication of JPH02114943U publication Critical patent/JPH02114943U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989022554U 1989-02-28 1989-02-28 Pending JPH02114943U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989022554U JPH02114943U (fr) 1989-02-28 1989-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989022554U JPH02114943U (fr) 1989-02-28 1989-02-28

Publications (1)

Publication Number Publication Date
JPH02114943U true JPH02114943U (fr) 1990-09-14

Family

ID=31240778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989022554U Pending JPH02114943U (fr) 1989-02-28 1989-02-28

Country Status (1)

Country Link
JP (1) JPH02114943U (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012248658A (ja) * 2011-05-27 2012-12-13 Aisin Seiki Co Ltd 半導体装置
JP2013536585A (ja) * 2010-08-25 2013-09-19 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気回路の製造方法および電気回路
WO2015037072A1 (fr) * 2013-09-11 2015-03-19 三菱電機株式会社 Dispositif semi-conducteur et méthode de fabrication de celui-ci

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013536585A (ja) * 2010-08-25 2013-09-19 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電気回路の製造方法および電気回路
JP2012248658A (ja) * 2011-05-27 2012-12-13 Aisin Seiki Co Ltd 半導体装置
WO2015037072A1 (fr) * 2013-09-11 2015-03-19 三菱電機株式会社 Dispositif semi-conducteur et méthode de fabrication de celui-ci
JPWO2015037072A1 (ja) * 2013-09-11 2017-03-02 三菱電機株式会社 半導体装置及びその製造方法

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