JPH047165Y2 - - Google Patents
Info
- Publication number
- JPH047165Y2 JPH047165Y2 JP8594987U JP8594987U JPH047165Y2 JP H047165 Y2 JPH047165 Y2 JP H047165Y2 JP 8594987 U JP8594987 U JP 8594987U JP 8594987 U JP8594987 U JP 8594987U JP H047165 Y2 JPH047165 Y2 JP H047165Y2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- film
- metal
- base material
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 49
- 239000000919 ceramic Substances 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 238000005260 corrosion Methods 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 102200082816 rs34868397 Human genes 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8594987U JPH047165Y2 (enrdf_load_stackoverflow) | 1987-06-02 | 1987-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8594987U JPH047165Y2 (enrdf_load_stackoverflow) | 1987-06-02 | 1987-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195553U JPS63195553U (enrdf_load_stackoverflow) | 1988-12-15 |
| JPH047165Y2 true JPH047165Y2 (enrdf_load_stackoverflow) | 1992-02-26 |
Family
ID=30941817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8594987U Expired JPH047165Y2 (enrdf_load_stackoverflow) | 1987-06-02 | 1987-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH047165Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-06-02 JP JP8594987U patent/JPH047165Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63195553U (enrdf_load_stackoverflow) | 1988-12-15 |
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