JPH0471240A - Oxidizing method - Google Patents

Oxidizing method

Info

Publication number
JPH0471240A
JPH0471240A JP18480190A JP18480190A JPH0471240A JP H0471240 A JPH0471240 A JP H0471240A JP 18480190 A JP18480190 A JP 18480190A JP 18480190 A JP18480190 A JP 18480190A JP H0471240 A JPH0471240 A JP H0471240A
Authority
JP
Japan
Prior art keywords
water vapor
ozone
oxidation
oxidizing
quartz tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18480190A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
誠一 岩松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP18480190A priority Critical patent/JPH0471240A/en
Publication of JPH0471240A publication Critical patent/JPH0471240A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve low temperature and high speed wet-oxidation by oxidizing an object to be oxidized by adding ozone to water vapor or hydrogen peroxide water vapor. CONSTITUTION:In a quartz tube, a silicon wafer is grounded on a jig; through a bubbler, water vapor or hydrogen peroxide water vapor or water vapor by pyrogenic oxyhydrogen combustion is introduced in the quartz tube; ozone is made to pass through the bubbler or independently introduced in the quartz tube at the same time as the water vapor. Thereby oxidizing speed is improved, and oxidizing temperature is more decreased. A wet-oxide film wherein ozone is added has little defect, and the interface level density can be reduced. Hence the quality of an oxide film can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は主としてシリコン半導体の酸化法に関する。[Detailed description of the invention] [Industrial application field] The present invention primarily relates to a method for oxidizing silicon semiconductors.

〔従来の技術〕[Conventional technology]

従来、シリコンの酸化法としては、ドライ酸化とウェッ
ト酸化の2通りがあり、ドライ酸化は、酸素ガス雰囲気
又はオゾン雰囲気(S、C,Chao et ajl 
、  J、Electroches、Soc、Vol 
136.No、9.P、2751(1989))中にて
加熱して酸化する方法であり、ウェット酸化は、水蒸気
又は過酸化水素水蒸気中にて酸化する方法である。
Conventionally, there are two methods of oxidizing silicon: dry oxidation and wet oxidation.
, J. Electroches, Soc., Vol.
136. No, 9. P, 2751 (1989)), and wet oxidation is a method of oxidizing in water vapor or hydrogen peroxide vapor.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記、従来技術によると、ドライ酸化では酸素ガス雰囲
気による酸化よりオゾン雰囲気による酸化の方がより低
温で、あるいはより高速に酸化できる事が判って居り、
ウェット酸化では水蒸気中での酸化より過酸化水蒸気中
の酸化の方がより低温で、あるいはより高速に酸化でき
る事も判っては居るが、ウェット酸化による一層の低温
化あるいは高速化が生産性の向上あるいは品質の向上が
望まれている。
According to the above-mentioned conventional technology, it is known that in dry oxidation, oxidation in an ozone atmosphere can be performed at a lower temperature or faster than oxidation in an oxygen gas atmosphere.
In wet oxidation, it is known that oxidation in steam peroxide can be performed at a lower temperature or faster than oxidation in water vapor, but the lower temperature or higher speed by wet oxidation will improve productivity. Improvement or quality improvement is desired.

本発明はかかるウェット酸化の低温化及び高速化を一層
計るための新しい酸化法を提供する事を[1的とする。
The first object of the present invention is to provide a new oxidation method for further reducing the temperature and speed of such wet oxidation.

〔課題を解決するだめの手段〕[Failure to solve the problem]

上記課題を解決する為に、本発明は、酸化法に関し、水
蒸気又は過酸化水素水蒸気にオゾンを添加して被酸化物
を酸化する手段を取る。
In order to solve the above problems, the present invention relates to an oxidation method, and takes a method of adding ozone to water vapor or hydrogen peroxide vapor to oxidize an oxidized substance.

〔実 施 例〕〔Example〕

以下、実施例により本発明を詳述する。 Hereinafter, the present invention will be explained in detail with reference to Examples.

いま、石英管内にシリコン・ウェーハを治具上に設置し
、前記石英管にバブラーを通して水蒸気か過酸化水素水
蒸気あるいはパイロ・ジェニックによる酸水素燃焼によ
る水蒸気を導入すると共に、前記バブラー中にオゾンを
通すかあるいは、前記石英管に、別途にオゾンを同時に
導入する等することにより、酸化速度の向上あるいは、
酸化温度の一層の低温化を工]る事が出来ると共に、オ
ゾンを添加したウェット酸化膜は、欠陥が少なく、界面
準位密度も小さくできる等、酸化膜の品質を向上するこ
とができる。
Now, a silicon wafer is placed in a quartz tube on a jig, and water vapor, hydrogen peroxide vapor, or water vapor produced by oxyhydrogen combustion using a pyrogenic substance is introduced into the quartz tube through a bubbler, and ozone is passed through the bubbler. Alternatively, by simultaneously introducing ozone into the quartz tube, the oxidation rate can be improved or
In addition to being able to further lower the oxidation temperature, the wet oxide film to which ozone is added can improve the quality of the oxide film, such as having fewer defects and lowering the interface state density.

〔発明の効果〕〔Effect of the invention〕

本発明により、シリコン酸化膜等の酸化膜の成長速度の
向上および酸化温度の低温化、および酸化膜の品質の向
上を計る事ができる等の効果がある。
The present invention has effects such as increasing the growth rate of an oxide film such as a silicon oxide film, lowering the oxidation temperature, and improving the quality of the oxide film.

以上that's all

Claims (1)

【特許請求の範囲】[Claims]  水蒸気又は過酸化水素水蒸気雰囲気にオゾンを添加し
て被酸化物を酸化する事を特徴とする酸化法。
An oxidation method characterized by adding ozone to a water vapor or hydrogen peroxide vapor atmosphere to oxidize the oxidized substance.
JP18480190A 1990-07-12 1990-07-12 Oxidizing method Pending JPH0471240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18480190A JPH0471240A (en) 1990-07-12 1990-07-12 Oxidizing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18480190A JPH0471240A (en) 1990-07-12 1990-07-12 Oxidizing method

Publications (1)

Publication Number Publication Date
JPH0471240A true JPH0471240A (en) 1992-03-05

Family

ID=16159535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18480190A Pending JPH0471240A (en) 1990-07-12 1990-07-12 Oxidizing method

Country Status (1)

Country Link
JP (1) JPH0471240A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1037484C (en) * 1988-09-13 1998-02-25 武田药品工业株式会社 Dispersive in water and gatherable on water surface solid pesticide preparation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1037484C (en) * 1988-09-13 1998-02-25 武田药品工业株式会社 Dispersive in water and gatherable on water surface solid pesticide preparation

Similar Documents

Publication Publication Date Title
JPH08143398A (en) Preparation of semiconductor thin film of defectless compound on dielectric thin film
JPH0471240A (en) Oxidizing method
JPS5998726A (en) Formation of oxide film
JPS5717125A (en) Manufacture of semiconductor device
US3501336A (en) Method for etching single crystal silicon substrates and depositing silicon thereon
US3518115A (en) Method of producing homogeneous oxide layers on semiconductor crystals
JPH04114431A (en) Oxidization process
JPS5975636A (en) Forming method for oxide film
JP2533078B2 (en) Impurity diffusion method
JP2640828B2 (en) Method for removing native oxide film on semiconductor substrate surface
JPH03116727A (en) Manufacture of semiconductor device
JPH0722410A (en) Method for oxidizing semiconductor wafer
JPH04114428A (en) Cleaning process
US3671309A (en) Process for making tetragonal germanium dioxide
SU686556A1 (en) Method for making p-n-p-n structures
JPH05152309A (en) Heat treatment method for semiconductor substrate
JPS6435929A (en) Manufacture of semiconductor device
JPS6019139B2 (en) Etching method and mixture gas for plasma etching
JPH04290219A (en) Method of forming polycrystalline silicon film
SU1371456A1 (en) A METHOD FOR CREATING THIN LAYERS OF SILICON OXIDE
JPS57188827A (en) Manufacture of semiconductor device
JPH0396235A (en) Oxidizing apparatus
JPS60194527A (en) Heat treating device
JPS6366050B2 (en)
JPS624327A (en) Manufacture of semiconductor device