JPH0470752U - - Google Patents
Info
- Publication number
- JPH0470752U JPH0470752U JP1990113810U JP11381090U JPH0470752U JP H0470752 U JPH0470752 U JP H0470752U JP 1990113810 U JP1990113810 U JP 1990113810U JP 11381090 U JP11381090 U JP 11381090U JP H0470752 U JPH0470752 U JP H0470752U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package structure
- case
- metal base
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990113810U JP2505068Y2 (ja) | 1990-10-30 | 1990-10-30 | 半導体装置のパッケ―ジ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990113810U JP2505068Y2 (ja) | 1990-10-30 | 1990-10-30 | 半導体装置のパッケ―ジ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0470752U true JPH0470752U (US20100154137A1-20100624-C00004.png) | 1992-06-23 |
| JP2505068Y2 JP2505068Y2 (ja) | 1996-07-24 |
Family
ID=31861426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990113810U Expired - Lifetime JP2505068Y2 (ja) | 1990-10-30 | 1990-10-30 | 半導体装置のパッケ―ジ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505068Y2 (US20100154137A1-20100624-C00004.png) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051560A (ja) * | 2001-08-03 | 2003-02-21 | Fuji Electric Co Ltd | 半導体装置のパッケージ |
| JP2008147234A (ja) * | 2006-12-06 | 2008-06-26 | Denso Corp | 半導体基板のキャップ固着方法 |
| JP2011096750A (ja) * | 2009-10-28 | 2011-05-12 | Shizuki Electric Co Inc | コンデンサ |
| JP2011205270A (ja) * | 2010-03-25 | 2011-10-13 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
| WO2018055667A1 (ja) * | 2016-09-20 | 2018-03-29 | 三菱電機株式会社 | 半導体装置 |
| JP2019096797A (ja) * | 2017-11-27 | 2019-06-20 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
| JP2020088141A (ja) * | 2018-11-26 | 2020-06-04 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS553617A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Metallic base for hybrid integrated circuit |
| JPS63100842U (US20100154137A1-20100624-C00004.png) * | 1986-12-19 | 1988-06-30 | ||
| JPH01165145A (ja) * | 1987-12-21 | 1989-06-29 | Mitsubishi Electric Corp | 半導体装置 |
| JPH02109418A (ja) * | 1988-10-19 | 1990-04-23 | Toshiba Corp | 計時回路 |
-
1990
- 1990-10-30 JP JP1990113810U patent/JP2505068Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS553617A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Metallic base for hybrid integrated circuit |
| JPS63100842U (US20100154137A1-20100624-C00004.png) * | 1986-12-19 | 1988-06-30 | ||
| JPH01165145A (ja) * | 1987-12-21 | 1989-06-29 | Mitsubishi Electric Corp | 半導体装置 |
| JPH02109418A (ja) * | 1988-10-19 | 1990-04-23 | Toshiba Corp | 計時回路 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051560A (ja) * | 2001-08-03 | 2003-02-21 | Fuji Electric Co Ltd | 半導体装置のパッケージ |
| JP4710194B2 (ja) * | 2001-08-03 | 2011-06-29 | 富士電機システムズ株式会社 | 半導体装置のパッケージ |
| JP2008147234A (ja) * | 2006-12-06 | 2008-06-26 | Denso Corp | 半導体基板のキャップ固着方法 |
| JP2011096750A (ja) * | 2009-10-28 | 2011-05-12 | Shizuki Electric Co Inc | コンデンサ |
| JP2011205270A (ja) * | 2010-03-25 | 2011-10-13 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
| WO2018055667A1 (ja) * | 2016-09-20 | 2018-03-29 | 三菱電機株式会社 | 半導体装置 |
| JPWO2018055667A1 (ja) * | 2016-09-20 | 2019-02-28 | 三菱電機株式会社 | 半導体装置 |
| CN109716516A (zh) * | 2016-09-20 | 2019-05-03 | 三菱电机株式会社 | 半导体装置 |
| US10748830B2 (en) | 2016-09-20 | 2020-08-18 | Mitsubishi Electric Corporation | Semiconductor device |
| CN109716516B (zh) * | 2016-09-20 | 2023-05-23 | 三菱电机株式会社 | 半导体装置 |
| JP2019096797A (ja) * | 2017-11-27 | 2019-06-20 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
| JP2020088141A (ja) * | 2018-11-26 | 2020-06-04 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2505068Y2 (ja) | 1996-07-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |