JPH0470267U - - Google Patents
Info
- Publication number
- JPH0470267U JPH0470267U JP10976090U JP10976090U JPH0470267U JP H0470267 U JPH0470267 U JP H0470267U JP 10976090 U JP10976090 U JP 10976090U JP 10976090 U JP10976090 U JP 10976090U JP H0470267 U JPH0470267 U JP H0470267U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- preheater
- automatic
- printed circuit
- fluxer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂ，ｃはこの考案の第１の実施例を
示すもので、第１図ａは側面図、第１図ｂは、第
１図ａの要部を示す平面図、第１図ｃは、第１図
ｂの正面図、第２図ａ，ｂはこの考案の第２の実
施例を示すもので、第２図ａは平面図、第２図ｂ
は正面図、第３図ａ，ｂはこの考案の第３の実施
例を示すもので、第３図ａは平面図、第３図ｂは
、第３図ａの−線による断面図、第４図は従
来の自動はんだ付け装置を示す断面図である。
図中、１はプリント基板、２は電子部品、１２
はコンベア、１３はフラクサ、１５ははんだ槽、
３１は自動はんだ付け装置、３２はプリヒータ、
３３は移動装置、３４は台車、３７，４３はシリ
ンダ、３８は接続金具、３９ははんだ付けライン
、４１は遮蔽装置、４２は遮蔽板、４４はロツド
である。
Figures 1a, b, and c show a first embodiment of this invention; Figure 1a is a side view, Figure 1b is a plan view showing the main parts of Figure 1a, Figure c is a front view of Figure 1b, Figures 2a and b show a second embodiment of this invention, Figure 2a is a plan view, Figure 2b
3A and 3B show a third embodiment of the invention, FIG. 3A is a plan view, FIG. 3B is a sectional view taken along the - line of FIG. FIG. 4 is a sectional view showing a conventional automatic soldering device. In the figure, 1 is a printed circuit board, 2 is an electronic component, 12
is a conveyor, 13 is a fluxer, 15 is a solder bath,
31 is an automatic soldering device, 32 is a preheater,
33 is a moving device, 34 is a cart, 37 and 43 are cylinders, 38 is a connecting fitting, 39 is a soldering line, 41 is a shielding device, 42 is a shielding plate, and 44 is a rod.
Claims (1)
くともフラクサと、プリヒータと、はんだ槽とを
備えたはんだ付けライン上で、搬送手段により搬
送しながらはんだ付けを行う自動はんだ付け装置
において、前記搬送手段の非常停止時に前記プリ
ヒータを前記はんだ付けライン上から遠ざける移
動装置を設けたことを特徴とする自動はんだ付け
装置。 (2) 電子部品を装着したプリント基板を、少な
くともフラクサと、プリヒータと、はんだ槽とを
備えたはんだ付けライン上で、搬送手段により搬
送しながらはんだ付けを行う自動はんだ付け装置
において、前記プリヒータから放出する輻射熱を
遮る遮蔽板を設け、この遮蔽板を前記搬送手段の
非常停止時に前記プリント基板と前記プリヒータ
との間を遮蔽する遮蔽装置を設けたことを特徴と
する自動はんだ付け装置。[Scope of Claim for Utility Model Registration] (1) An automatic method for soldering printed circuit boards mounted with electronic components while being transported by a transport means on a soldering line equipped with at least a fluxer, a preheater, and a soldering bath. An automatic soldering apparatus, characterized in that the automatic soldering apparatus is provided with a moving device that moves the preheater away from the soldering line when the conveyance means is stopped in an emergency. (2) In an automatic soldering device that carries out soldering while conveying a printed circuit board with electronic components mounted thereon by a conveying means on a soldering line equipped with at least a fluxer, a preheater, and a soldering bath, from the preheater to An automatic soldering apparatus characterized in that a shielding plate is provided to shield emitted radiant heat, and a shielding device is provided to shield the shielding plate from between the printed circuit board and the preheater when the conveyance means is stopped in an emergency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990109760U JPH0741573Y2 (en) | 1990-10-22 | 1990-10-22 | Automatic soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990109760U JPH0741573Y2 (en) | 1990-10-22 | 1990-10-22 | Automatic soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0470267U true JPH0470267U (en) | 1992-06-22 |
| JPH0741573Y2 JPH0741573Y2 (en) | 1995-09-27 |
Family
ID=31857011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990109760U Expired - Lifetime JPH0741573Y2 (en) | 1990-10-22 | 1990-10-22 | Automatic soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741573Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61200657U (en) * | 1985-06-07 | 1986-12-16 |
-
1990
- 1990-10-22 JP JP1990109760U patent/JPH0741573Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61200657U (en) * | 1985-06-07 | 1986-12-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741573Y2 (en) | 1995-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH09505947A (en) | Device for automatically mounting SMD components on the upper and lower surfaces of a printed circuit board | |
| EP0946087A3 (en) | Apparatus for mounting electronic components on circuit boards | |
| JPH0470267U (en) | ||
| GB1534116A (en) | Automatic soldering apparatus for soldering components to printed circuit boards | |
| JPS6113161Y2 (en) | ||
| JPS59158361U (en) | Printed wiring board solder melting equipment | |
| JPH034436Y2 (en) | ||
| JPS6325259U (en) | ||
| JPS6234478Y2 (en) | ||
| JP2889388B2 (en) | Soldering equipment | |
| JPH03106265U (en) | ||
| JPH0395682U (en) | ||
| JPS6218074Y2 (en) | ||
| JPS61200657U (en) | ||
| JPH0137825Y2 (en) | ||
| JPS6330777B2 (en) | ||
| JPS5922933Y2 (en) | soldering equipment | |
| JPS61200647U (en) | ||
| JPH0486609U (en) | ||
| JPS63177078U (en) | ||
| JPS6256273U (en) | ||
| JPH0397969U (en) | ||
| JPH0397970U (en) | ||
| JPH0447861U (en) | ||
| JP2003188525A (en) | Reflow furnace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |