JPH0468550U - - Google Patents

Info

Publication number
JPH0468550U
JPH0468550U JP1990111622U JP11162290U JPH0468550U JP H0468550 U JPH0468550 U JP H0468550U JP 1990111622 U JP1990111622 U JP 1990111622U JP 11162290 U JP11162290 U JP 11162290U JP H0468550 U JPH0468550 U JP H0468550U
Authority
JP
Japan
Prior art keywords
board
jig
vacuum
flange
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990111622U
Other languages
English (en)
Japanese (ja)
Other versions
JP2505200Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990111622U priority Critical patent/JP2505200Y2/ja
Publication of JPH0468550U publication Critical patent/JPH0468550U/ja
Application granted granted Critical
Publication of JP2505200Y2 publication Critical patent/JP2505200Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990111622U 1990-10-26 1990-10-26 基板リ―ク試験用治具 Expired - Lifetime JP2505200Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990111622U JP2505200Y2 (ja) 1990-10-26 1990-10-26 基板リ―ク試験用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990111622U JP2505200Y2 (ja) 1990-10-26 1990-10-26 基板リ―ク試験用治具

Publications (2)

Publication Number Publication Date
JPH0468550U true JPH0468550U (US20030220297A1-20031127-C00033.png) 1992-06-17
JP2505200Y2 JP2505200Y2 (ja) 1996-07-24

Family

ID=31859090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990111622U Expired - Lifetime JP2505200Y2 (ja) 1990-10-26 1990-10-26 基板リ―ク試験用治具

Country Status (1)

Country Link
JP (1) JP2505200Y2 (US20030220297A1-20031127-C00033.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101380429B1 (ko) * 2012-12-17 2014-04-01 한국항공우주연구원 포트플레이트 기밀시험용 치구 및 포트플레이트 기밀시험방법

Also Published As

Publication number Publication date
JP2505200Y2 (ja) 1996-07-24

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