JPH046847A - Picking-up apparatus of chip-shaped component - Google Patents

Abstract

PURPOSE:To obtain an apparatus by which the loss of an irradiation light quantity is small and whose structure is simple while ultraviolet rays are irradiated simultaneously with an in parallel with the pushing-up operation of a pushing-up pin by a method wherein an energy-beam irradiation mean is provided with a semireflecting mirror and a total-reflecting mirror in the light path of a light source so as to sandwich the pushing-up pin. CONSTITUTION:At a picking-up apparatus, the following are provided: an energy-beam irradiation means by which a chip-fixing tape T constituted so as to lower its adhesive power by irradiation with an energy beam can be irradiated with an energy beam L from its rear side; and a pushing-up pin 4 which pushes up a chip-shaped component C from the rear side of the tape T via the tape T. In addition, a light source 9 of the energy-beam irradiation means is installed on the side of the pushing-up pin 4. At the picking-up apparatus, the energy beam irradiation means is provided with a semireflecting mirror 7 and a total-reflecting mirror 8 in the light path of the light source 9 so as to sandwich the pushing-up pin 4; the semireflecting mirror 7 is constituted in such a way that nearly half of the energy beam incident form the light source 9 can be reflected toward the tape T; the total-reflecting mirror 8 is constituted in such a way that nearly residual half of the energy beam can be reflected toward the tape T.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a method for peeling off chip-shaped parts such as semiconductor chips, chip capacitors, and chip resistors adhesively fixed to a chip-fixing tape from the chip-fixing tape. The present invention relates to a pickup device for picking up chip-shaped parts.

[Conventional technology]

Semiconductor chips and the like are supplied adhered onto a chip fixing tape during the manufacturing process, so when mounting them, it is necessary to pick up the chips one by one from the chip fixing tape.

For example, the pickup device shown in FIG. 2 is known as this pickup device. This device includes a collet 22 located above a chip fixing tape 21 to which a plurality of chips 20 are adhered, and a peeling device 23 located below. The collet 22 has its suction port 22a connected to the vacuum pump 22.
The chip 20 can be picked up by vacuum suction and transported to a predetermined position. The peeling device 23 includes a push-up pin 26 attached to a holding case 25, a bundle-shaped optical fiber 27, an ultraviolet light source 28 and a lens 29 that introduce light into the optical fiber 27. The ultraviolet rays emitted from the ultraviolet light source 28 are converged by a lens 29 and then passed through the optical fiber 2.
7 and is irradiated onto the back surface of the chip fixing tape 21.

The adhesive surface of the chip fixing tape 21 is configured so that its adhesive strength decreases when it receives ultraviolet rays, and when the chip fixing tape 21 is irradiated with ultraviolet rays from the back side as described above, the ultraviolet rays pass through the tape body and the adhesive strength is reduced. As a result, the adhesive strength of the chip fixing tape 21 at that portion is reduced. Therefore, the chip 20 becomes easily peeled off.

That is, in this pickup device, as shown in FIG. 2(a), the chip 20 is made easy to peel off by irradiation with ultraviolet rays, and the chip 20 is pushed up over the chip fixing tape 21 using the push-up pin 26. After floating, the collet 22 is attracted to the suction port 22a and picked up.

On the other hand, the optical fiber 27 is configured to bend the ultraviolet rays emitted from the ultraviolet light source 28 located on the side of the push-up pin 26 in a substantially orthogonal direction and irradiate the back surface of the chip fixing tape 21 with the ultraviolet rays. In this case, the push-up pin 26 that moves up and down to the center of the ultraviolet irradiation area and the ultraviolet light source 28 do not interfere with each other, so the irradiation of ultraviolet rays and the push-up of the push-up pin 26 can be performed simultaneously. It is now possible to do so.

Further, as shown in FIG. 2(C), this optical fiber 27 is branched into four at the base on the light source side, and is evenly distributed in all four directions around the push-up pin 26 at the tip on the irradiation side. , the UV irradiation area can be uniformly irradiated with UV rays.

[Problem to be solved by the invention]

In this way, in the above-mentioned pickup device, a bundle-like bundle of a plurality of optical fibers 27 is used, and each optical fiber 27 is branched at the base of the bundle, and the optical fibers 27 are uniformly distributed in the circumferential direction of the push-up pin 26. The following problems occurred because the characters were cast in the same way.

In other words, the optical fiber 27 as a light guide can effectively propagate ultraviolet rays only when the ultraviolet rays enter from its core, and even if a large number of optical fibers 27 are used in a bundle, there is a limit to the propagation efficiency of ultraviolet rays. Therefore, the amount of ultraviolet light that can be introduced into the irradiation area is insufficient.

In addition, the optical fiber 27 itself is extremely thin, and branching it out and arranging its tips evenly in the circumferential direction requires considerable precision, which complicates the structure of the device and makes it difficult to manufacture and expensive. It had become.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pick-up device for chip-shaped parts that is capable of simultaneously performing ultraviolet irradiation and pushing up of push-up pins, has little loss in the amount of irradiation light, and has a simple structure. .

[Means to solve the problem]

In order to achieve the above object, the present invention provides an energy source capable of irradiating energy rays from the back side of a chip fixing tape configured such that the adhesive force for adhesively fixing chip-like parts is reduced by irradiation with energy rays. ray irradiation means;
A chip-shaped component comprising a push-up pin that pushes up the chip-shaped component from the back side of the chip-fixing tape through the chip-fixing tape prior to pickup, and a light source of the energy ray irradiation means is provided on the side of the push-up pin. In this pickup device, the energy ray irradiation means includes a half-reflection mirror and a total reflection mirror on the optical path of the light source, sandwiching the push-up pin, and the half-reflection mirror directs approximately half of the energy rays incident from the light source onto the chip. The total reflection mirror is configured to be able to reflect the remaining half of the energy beam toward the chi-knob fixing tape.

[Effect]

Approximately half of the energy rays incident on the semi-reflecting mirror from the light source are reflected by the semi-reflecting mirror, and the remaining approximately half are transmitted through the semi-reflecting mirror and reflected by the total reflecting mirror.

The energy rays reflected by both mirrors are emitted from both mirrors toward the chip fixing tape, and are irradiated onto the back surface of the chip fixing tape. This irradiation reduces the adhesive strength of the surface of the chip fixing tape, making it easier for the chip to peel off from the chip fixing tape. At this time, if the push-up pin is pushed up from below, the chip will gradually peel off from the periphery of the chip fixing tape.

In this way, if the energy beam incident from the side of the push-up pin is emitted upward from both sides of the push-up pin by sandwiching the push-up pin between a semi-reflection mirror and a total reflection mirror, the energy beam will be emitted from the back side of the chip fixing tape. Enables uniform energy ray irradiation without creating shadows from the push-up pins. Further, the push-up pin that moves up and down and the energy ray light source do not interfere with each other.

Furthermore, although there is a reflection loss of the energy rays due to the reflection mirror, all of the incident energy rays are emitted toward the chip fixing tape, so it is possible to reduce the loss of the amount of light. Moreover, it has an extremely simple structure with the main parts being a reflecting mirror and a semi-reflecting mirror.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip-shaped component pickup device according to a first embodiment of the present invention will be specifically described below with reference to FIG.

This pick-up device 1 picks up a semiconductor chip C as a chip-shaped component from a chip fixing tape T. The chip fixing tape T is supplied with a plurality of semiconductor chips C adhesively fixed to its adhesive surface Ta. A feature of this chip fixing tape T is that its adhesive is made of a photocurable resin, and its adhesive strength is reduced by irradiation with ultraviolet rays.

On the other hand, the pickup device 1 includes a peeling device consisting of a collet 2 positioned above with the chip fixing tape T sandwiched therebetween, and an ultraviolet ray irradiation means 3 which is an energy beam irradiation means and a push-up pin 4 positioned below. The ultraviolet irradiation means 3 and the push-up pins 4 make it easy to peel off the semiconductor chip C from the chip fixing tape T, and the collet 2 picks it up.

A suction port 2a of the collet 2 is communicated with an external vacuum device 5, and the semiconductor chip C is vacuum suctioned and picked up by the suction port 2a. The picked up semiconductor chip C is conveyed to a desired position by the collet 2.

The push-up pin 4 is adapted to be moved up and down as appropriate by a drive means (not shown), and its upper end is shaped into a sharp point as shown in FIG. The central portion of the semiconductor chip C can be pushed up from below. As a result, the semiconductor chip C floats up and is easily picked up by the collet 2.

The ultraviolet irradiation means 3 includes a holding member 6 having an insertion opening 6a for the push-up pin 4 at the center of the upper part, a semi-reflection mirror 7 and a total reflection mirror 8 disposed on both sides of the holding member 6, and a protrusion. A double total reflection mirror 7 located on the side of the raising pin 4
．． The device is equipped with an ultraviolet lamp 9 which is an ultraviolet light source capable of emitting ultraviolet rays substantially horizontally toward 8.

The holding member 6 is made of resin, glass, etc. through which ultraviolet rays can pass, and the upper insertion opening 6a can be inserted without blocking ultraviolet rays.
It is configured so that the push-up pin 4 can be guided by.

The half-reflection mirror 7 and the total reflection mirror 8 are connected to the push-up pin 4
They are respectively disposed on the optical path of the ultraviolet lamp 9 on both sides thereof, and are held by holding means (not shown). The semi-reflecting mirror 7 reflects approximately half of the incident ultraviolet rays and transmits approximately the remaining half. The total reflection mirror 8 is designed to reflect all of the remaining approximately half of the ultraviolet rays mentioned above. Therefore, approximately half of the ultraviolet rays incident approximately horizontally from the ultraviolet lamp 9 is reflected by the semi-reflecting mirror 7 and emitted toward the chip fixing tape T, and the remaining approximately half is reflected by the total reflecting mirror 8. It is designed to be ejected toward the chip fixing tape T. This double-reflection mirror 7.8 has a semi-reflection layer 7a and a total reflection layer 8a on its surface, and these are formed by, for example, coating with a reflection film, vapor deposition of a metal such as aluminum or silver, or metal plating. be done.

A condensing lens 10 is interposed between the ultraviolet lamp 9 and the semi-reflecting mirror 7, and the ultraviolet rays from the ultraviolet lamp 9 are converged by the condensing lens 10 and incident on the semi-reflecting mirror 7. In addition, the ultraviolet rays that are converged and reflected by the semi-reflective mirror 7 and the fully reflective mirror 8 are irradiated from two diagonal directions only to that part of the chip fixing tape T to which the desired semiconductor chip C is adhered. ing. That is, the ultraviolet rays are applied to the chip fixing tape T so that only the desired semiconductor chip C can be peeled off, and the adhesive force of the chip fixing tape T can be reduced in that portion for each semiconductor chip C.

The ultraviolet lamp 9 is disposed on the side of the push-up pin 4 so that the push-up pin 4 and its driving device (not shown), etc., and the ultraviolet lamp 9 do not interfere with each other.

Next, the operation of the pickup device 1 according to the above embodiment will be briefly explained with reference to FIGS. 1(a) and 1(b).

The semiconductor chips C are supplied on a chip fixing tape T in a state where they are individually divided. When the desired semiconductor chip C reaches a predetermined position between the collet 2 and the stripping device (or when the collet 2 and the stripping device reach the desired semiconductor chip C), first the ultraviolet lamp 9 is turned on ( (See Figure 1(a)).

The ultraviolet rays from the ultraviolet lamp 9 are converged by a condenser lens 10 and incident on a semi-reflecting mirror 7, where half of the ultraviolet rays are reflected and emitted toward the chip fixing tape T. On the other hand, the remaining half of the ultraviolet light is incident on the following total reflection mirror 8, reflected there, and emitted toward the chip fixing tape T.

The ultraviolet rays emitted from both reflecting mirrors 7.8 are irradiated onto the back surface of the chip fixing tape T to which a desired semiconductor chip C is adhered. At the same time as this irradiation, the push-up pin 4
rises and pushes up the semiconductor chip C, causing it to float. Since the adhesive strength of the chip fixing tape T is reduced by irradiation with ultraviolet rays, the semiconductor chip C is peeled off from its peripheral portion by the push-up pins 4. Furthermore, in parallel with this operation, the collet 2 descends, and its suction port 2a comes into close contact with the semiconductor chip C, vacuum suctioning it (see Fig. 1(b)).
. Next, when the collet 2 rises, the semiconductor chip C is completely peeled off from the chip fixing tape T, and is smoothly pulled away from the chip fixing tape T and held by the collet 2. Thereafter, the semiconductor chip C is die-bonded to a predetermined substrate or the like, or is housed in a predetermined tray. Then, such operations are sequentially repeated for each semiconductor chip C adhesively fixed on the chip fixing tape T.

In addition, according to an experiment using an ultra-high pressure mercury lamp as the ultraviolet lamp 9 and a transparent plastic as the holding member 6, it was found that the adhesive strength of the chip fixing tape T could be increased from 20 g/-■2 to Ig/l 1 m2 or less in a very short time. was able to reduce it to.

As described above, according to this embodiment, since the ultraviolet lamp 9 can be disposed on the side of the push-up pin 4, there is no interference between the push-up pin 4, which moves up and down, and the ultraviolet lamp 9. Therefore, the irradiation with ultraviolet rays using the ultraviolet lamp 9 and the peeling operation using the push-up pins 4 can be performed in parallel or continuously, and the time required for the pick-up operation can be shortened.

Moreover, since the push-up pin 4 is sandwiched between the two reflecting mirrors 7.8 and the chip fixing tape T is irradiated with ultraviolet rays from diagonally both sides, the shadow of the push-up pin 4 is hardly formed and the ultraviolet rays are irradiated sufficiently and uniformly. The chip fixing tape T is sufficiently photocured so that no adhesive remains attached to the bottom surface of the semiconductor chip C. This prevents pickup errors and improves reliability during die bonding.

In addition, since the ultraviolet rays incident from the ultraviolet lamp 9 are simply reflected by the double-reflection mirrors 7.8,
The ultraviolet rays incident on both reflecting mirrors 7.8 are irradiated onto the chip fixing tape T without waste, and the loss of light amount can be extremely reduced. Moreover, the main part is a semi-reflective mirror 7.
It has an extremely simple structure consisting of a total reflection mirror 8 and a total reflection mirror 8, and can be easily manufactured.

Note that instead of the semi-reflecting mirror 7 and the total reflecting mirror 8, a semi-reflecting concave mirror and a totally reflecting concave mirror may be used to condense the ultraviolet rays. In this case, the chip fixing tape T can be irradiated with high-density ultraviolet rays.

Furthermore, in both of the above-mentioned embodiments, ultraviolet rays are used as energy rays, but if the adhesive of the chip fixing tape T is one whose adhesive strength decreases when irradiated with infrared rays, it is preferable to irradiate it with infrared rays. It's okay.

〔Effect of the invention〕

As described above, according to the present invention, since the light source is disposed on the side of the push-up bin, there is no interference between the push-up bin that moves up and down and the energy ray light source. Therefore, the energy ray irradiation by the energy ray irradiation means and the peeling operation by the push-up bin can be performed on the chip component simultaneously or continuously, and the time required for picking up the chip component can be shortened. In addition, the introduced energy rays are efficiently reflected and emitted from the semi-reflection mirror and the total reflection mirror, making it possible to irradiate uniformly with extremely little loss of light quantity, allowing for smooth peeling and pickup of chip components. , the yield of chip components can be improved. Furthermore, the main structural parts are an extremely simple structure consisting of a semi-reflection mirror and a total reflection mirror, which has the advantage of being easy and inexpensive to manufacture.

[Brief explanation of drawings]

Figure 181 is a partially cutaway side view showing the first embodiment of the pickup device according to the present invention, Figures m2 (a) and (b) are partially cutaway side views showing a conventional pickup device, and Figure 2 (
C) is a plan view of the peeling device portion. 1... Pick-up device, 3... Ultraviolet irradiation means,
4... Push-up bottle, 7... Semi-reflective mirror, 8...
Total reflection mirror 9...UV lamp, C...semiconductor chip, T...chip fixing tape, L...ultraviolet light.

Claims (1)

[Scope of Claims] Energy beam irradiation means capable of irradiating energy rays from the back side of a chip fixing tape configured such that the adhesive force for adhesively fixing chip-like parts is reduced by irradiation with energy rays. , a push-up pin that pushes up the chip-like component from the back side of the chip-fixing tape through the chip-fixing tape prior to pickup;
In a chip-like component pickup device in which a light source of the energy ray irradiation means is provided on the side of the push-up pin, the energy ray irradiation means performs single reflection on the optical path of the light source across the push-up pin. a mirror and a total reflection mirror, the total reflection mirror is configured to be able to reflect approximately half of the energy rays incident from the light source toward the chip fixing tape, and the total reflection mirror reflects approximately half of the energy rays incident from the light source toward the chip fixing tape; A pick-up device for a chip-shaped component, characterized in that the remaining half is configured to be able to be reflected toward the chip fixing tape.