JPH0467358U - - Google Patents
Info
- Publication number
- JPH0467358U JPH0467358U JP11135790U JP11135790U JPH0467358U JP H0467358 U JPH0467358 U JP H0467358U JP 11135790 U JP11135790 U JP 11135790U JP 11135790 U JP11135790 U JP 11135790U JP H0467358 U JPH0467358 U JP H0467358U
- Authority
- JP
- Japan
- Prior art keywords
- monitor photodiode
- light
- laser device
- semiconductor laser
- convex lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11135790U JPH0467358U (de) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11135790U JPH0467358U (de) | 1990-10-23 | 1990-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0467358U true JPH0467358U (de) | 1992-06-15 |
Family
ID=31858795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11135790U Pending JPH0467358U (de) | 1990-10-23 | 1990-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0467358U (de) |
-
1990
- 1990-10-23 JP JP11135790U patent/JPH0467358U/ja active Pending