JPH0321861U - - Google Patents
Info
- Publication number
- JPH0321861U JPH0321861U JP8130589U JP8130589U JPH0321861U JP H0321861 U JPH0321861 U JP H0321861U JP 8130589 U JP8130589 U JP 8130589U JP 8130589 U JP8130589 U JP 8130589U JP H0321861 U JPH0321861 U JP H0321861U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- light receiving
- chip
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8130589U JPH0321861U (de) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8130589U JPH0321861U (de) | 1989-07-11 | 1989-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321861U true JPH0321861U (de) | 1991-03-05 |
Family
ID=31627129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8130589U Pending JPH0321861U (de) | 1989-07-11 | 1989-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321861U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5089010B2 (ja) * | 2000-12-21 | 2012-12-05 | 北越紀州製紙株式会社 | エアフィルタ用濾材巻取り製品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211784A (en) * | 1975-07-17 | 1977-01-28 | Matsushita Electric Ind Co Ltd | Photo semiconductor device |
| JPS63255926A (ja) * | 1987-04-13 | 1988-10-24 | Nec Corp | 受光動作型混成集積回路装置 |
-
1989
- 1989-07-11 JP JP8130589U patent/JPH0321861U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211784A (en) * | 1975-07-17 | 1977-01-28 | Matsushita Electric Ind Co Ltd | Photo semiconductor device |
| JPS63255926A (ja) * | 1987-04-13 | 1988-10-24 | Nec Corp | 受光動作型混成集積回路装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5089010B2 (ja) * | 2000-12-21 | 2012-12-05 | 北越紀州製紙株式会社 | エアフィルタ用濾材巻取り製品 |