JPH0467336U - - Google Patents
Info
- Publication number
- JPH0467336U JPH0467336U JP1990110941U JP11094190U JPH0467336U JP H0467336 U JPH0467336 U JP H0467336U JP 1990110941 U JP1990110941 U JP 1990110941U JP 11094190 U JP11094190 U JP 11094190U JP H0467336 U JPH0467336 U JP H0467336U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- slit
- width
- tip
- adjustment jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990110941U JPH0467336U (enrdf_load_stackoverflow) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990110941U JPH0467336U (enrdf_load_stackoverflow) | 1990-10-23 | 1990-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0467336U true JPH0467336U (enrdf_load_stackoverflow) | 1992-06-15 |
Family
ID=31858348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990110941U Pending JPH0467336U (enrdf_load_stackoverflow) | 1990-10-23 | 1990-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0467336U (enrdf_load_stackoverflow) |
-
1990
- 1990-10-23 JP JP1990110941U patent/JPH0467336U/ja active Pending
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