JPH0466270A - Soldering iron - Google Patents

Abstract

PURPOSE:To efficiently execute heating work with the same soldering iron regardless of structure and heat capacity of a heating objective material by fitting an iron tip part as expandable at tip part of the soldering iron. CONSTITUTION:With the tip part 2 heated with a heater part 1 in the soldering iron, the soldering tip expanding part 3 is connected through a spring 4 and heat in the iron tip part 2 is transferred to the iron tip expanding part 3. By this constitution, in the case area of the heating objective material is wide, this is used under expanding condition of the spring 4 (under condition of positioning the iron tip expanding part 1 at the most end part of iron tip) and the heating objective material is quickly heated. Further, in the case the structure of heating objective material is fine and the fine work is necessary, by using under shrinking condition of the spring 4 (under condition of shifting the iron tip expanding part to the root side of iron tip), the iron tip can be used under fine condition.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the shape of the tip of a soldering iron used for soldering work, solder removal work, and the like.

[Conventional technology]

Traditionally, soldering irons have been available with high or low wattage, or with thick or thin tips, and these were used depending on the type of work being done.

For example, if the object to be heated is difficult to heat,
Irons with a high wattage and thick tips were used to make the contact area between the object to be heated and the iron tip as wide as possible to make heating easier.

On the other hand, when the object to be heated has a small shape, a soldering iron with a thin tip is used.

[Problem to be solved by the invention]

However, with conventional soldering irons, work cannot be done unless the object to be heated has a fine structure and a fine tip.However, if the object to be heated is large in area or otherwise difficult to heat. To do this, heat the soldering iron with a high wattage and a thin tip for a long time, or heat the soldering iron with a high wattage and a thick tip, then quickly remove the tip. There was a problem in that the user had to switch to a thinner soldering iron and continue working.

Therefore, in order to solve these conventional problems, the present invention aims to provide a soldering iron that can quickly and freely change the contact area of the iron tip with the object to be heated, that is, the thickness of the iron tip. purpose.

[Means to solve the problem]

In order to solve the above-mentioned problems, the soldering iron of the present invention is characterized in that a retractable iron tip portion is attached to the soldering iron.

[Effect]

When using a soldering iron configured as described above, if the object to be heated is difficult to heat due to its fine structure and large surface area, the soldering iron should first be heated with a thick tip. When you move on to detailed work, you can move the expandable tip to make it thinner and continue working quickly.

〔Example〕

Embodiments of the present invention will be described below based on the drawings. FIG. 1(a) is a side view showing an embodiment of the present invention, and FIG. 1(b) is a side view showing an embodiment of the present invention.
) is a side sectional view showing an embodiment of the present invention, and in FIG.
A soldering iron tip portion 2 is heated by a heater portion 1 of the soldering iron. The iron tip part 2 and the iron tip extensible part 3 are connected via a spring 4.

The heat of the iron tip portion 2 is transmitted to the iron tip expandable portion 3 through the contact point between the two.

When the area of the object to be heated is large, if the spring 4 is extended, i.e., the telescopic part 3 of the tip is located at the very tip side of the tip, the object to be heated and the tip will be separated. The contact area is wide and heating can be done quickly.

On the other hand, when the object to be heated has a fine structure and delicate work is required, use the iron with the spring 4 compressed, that is, with the tip elastic part 3 moved toward the base of the iron. Then, you can use the iron with a thin tip.

FIG. 2 is a side sectional view showing a solder removal operation on an electronic circuit board as a specific example of use of the soldering iron of the present invention.

It is assumed that the electronic circuit board 5 shown in FIG. 2 is a cross section of a portion including a copper foil pattern 6, which is a pattern having a relatively large area, on the board. The component mounting hole 8 is filled with solder 7, and in order to remove this solder 7, conventionally, the area around the component mounting hole 8 was heated with a soldering iron with a thick tip to melt the solder 7. . However, since the heat applied around the component mounting hole 8 is transmitted not only to the solder 7 but also to the copper foil pattern 6, a considerably long heating time is required to melt the solder 7 evenly.

Therefore, using the soldering iron of the present invention, first, the area around the component mounting hole 8 is quickly heated with a thick iron tip, and the solder 7 is easily removed from the component mounting hole 8. The solder 7, which has a thin tip and is buried in the component mounting hole 8, is directly heated with the iron tip to melt it evenly, and the melted solder is removed using a solder sucker or the like.

By doing this, the heating time can be shortened and the solder buried in the hole can be reliably melted and removed.

〔Effect of the invention〕

As explained above, the present invention has the effect that by attaching an expandable soldering iron tip part, work can be performed efficiently with the same soldering iron regardless of the structure and heat capacity of the object to be heated. be.

FIG. 1(b) is a sectional view of the soldering iron of the present invention.

FIG. 2 is a sectional view of an electronic circuit board and a soldering iron, showing a specific usage example of the soldering iron of the present invention.

1... Part of the heater 2...Soldering iron tip 3...Tip expandable part 4...Spring 5...Electronic circuit board 6...Copper foil pattern 7...Solder 8...Parts mounting hole that's all Applicant: Seiko Epson Corporation Agent: Patent attorney Kisanbe Suzuki (1 person)

[Brief explanation of drawings]

FIG. 1(a) is a side view of the soldering iron of the present invention, FIG.
α) Figure 1(b)

Claims (1)

[Claims] A soldering iron characterized by having a retractable iron tip attached thereto.