JPH0741574Y2 - Mounting IC chip removal trowel - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a trowel used for removing a flat IC chip mounted on a substrate and a mounted flat IC chip removing head mounted on a gas burner.

[0002]

2. Description of the Related Art Since a flat IC chip mounted on a board by soldering has a large number of terminals, which are provided in four directions, soldered to the board, it is not possible to remove it with a commonly used solder sucker. Have difficulty.

[0003] Therefore, if the flat IC chip becomes defective, a situation of is replaced by a substrate, is very uneconomical.

In addition, when a prototype circuit is assembled, it is often desired to replace the flat IC chip with another one in the middle. In such a case, the soldered flat IC chip is removed by using an expensive special removing device. Since it cannot be executed except for the above, it is a problem that a substrate much more expensive than a flat IC chip has to be wasted.

[0005] Recently, Neppushiki of flat IC chip removal machine has been developed, in order to require a compressor, there is between problem in ease of use in large-sized as a removal tool.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a user-friendly tool capable of easily and quickly removing a flat IC chip mounted on a substrate, as well as electric parts such as resistors and capacitors. It is what

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is a material in which a detachable or fixed bracket is provided on the crater of a gas burner, and solder is hard to adhere to the tip portion thereof. , A heating element made of, for example, brass or stainless is provided, and an IC chip is inserted into the end of the heating element.
The recesses H are provided, and the IC chip terminal heating / clip portions are provided on the four sides of the recesses H.

[0008]

[Function] The crater of the gas burner is adjusted to heat the heating element of the head to an appropriate temperature, and the heating / combining clip portion provided at the tip is pressed against the terminal of the flat IC chip mounted on the substrate to heat and melt the solder. The flat IC chip can be removed from the substrate by pulling up the head.

[0009]

Embodiment 1 FIG. 1 shows Embodiment 1 of the present invention.
(A) is a side view and (b) is a plan view of the head.

In FIG . 1, 1 is a gas burner, 2 is an ignition button, and 3 is a heating power adjusting knob.

[0011] A is the head, crater 1a of the gas burner 1
The mounting portion 4 has a tubular shape, and is fixed to the crater 1a of the gas burner 1 by a set screw 7.

The bracket portion 5 is bent outward so as not to be heated as much as possible by the heat generated by the flame of the gas burner 1.

The heating element 6 has a cylindrical shape and is integrally formed with the mounting portion 4 and the bracket portion 6. In this embodiment, the heating element 6 is made of a material to which solder is unlikely to adhere, such as a brass plate or a stainless plate.

Reference numeral 8 denotes a brass-made flame shield installed in the tubular heating element 6 so as to prevent the flame of the gas burner 1 from directly hitting the flat IC chip, and through the flame shield 8. The heating body 6 is heated by the heat treatment, and the concave portion H is formed at the tip.

Reference numeral 9 denotes a clip portion which is integrally provided at the tip (green) of the tubular heating element 6 and which also serves as a terminal heating terminal of the flat IC chip.

[0016] Referring now to their use, firstly, by pressing the ignition button 2 ignites, adjust the heating power by adjusting the knob 3.

The heating element 6 is heated by the flame of the gas burner 1, and the tip of the clip portion 9 melts the solder at a temperature of 250.
It becomes ℃ -300 ℃.

[0018] Therefore, as shown the clip portion 9 in FIG. 2, as pressed lightly terminal flat IC chip B, pulling up watching solder that melts, flat IC chip B is attached to the clip portion 9 The flat IC chip is detached from the substrate C, and the flat IC chip is detached from the head A by lightly shaking the head or hitting the edge of a recovery box or the like, which is very easy to handle.

FIG . 3 shows a second embodiment of the present invention. In the first embodiment, the whole head A is formed by bending a brass plate, whereas a heating body 61 separately manufactured by press working is crimped to the bracket 51. The handling and the function are the same as those in the first embodiment.

Although the clip portions 9 and 91 are of a fixed type, when the head A is pressed against the flat IC chip and the solder is melted, the terminals of the flat IC chip bend and enter the recess H of the heating element, so that it is just flat. When the IC chip is clipped and the head A is raised, the flat IC chip is removed from the substrate, and the IC chip is removed from the head A by gently shaking the head or hitting the edge of the recovery box or the like.

[0021] 2 shown in (a different embodiment) FIGS. 1 and 3
In one embodiment, the head A is detachable,
The head A may be integrally attached to the crater of the gas burner.

[0022]

As described above, according to the present invention, the flat IC can be easily removed from the substrate C by lightly pressing the tip of the head A so as to fit the flat IC chip B.
The chip B can be removed, it does not require tweezers unlike the hot air type, and it can be provided at a low cost instead of the expensive and expensive device as in the past. It is excellent.

[Brief description of drawings]

FIG. 1 shows Example 1 in which (a) is a side view showing a state in which a head is attached to a gas burner, and (b) is a plan view of the head.

FIG. 2 is an explanatory diagram of how to use the first embodiment.

FIG. 3 is a side view of the second embodiment.

[Explanation of symbols]

 1 Gas Burner 2 Ignition Button 3 Knob for Adjusting Thermal Power 4 Mounting Part 5,51 Bracket Part 6,61 Heating Body 7 Set Screw 8 Flame Shielding Plate 9,91 Clip Part A Head B Flat IC Chip C Board H Recess

Claims (2)

[Scope of utility model registration request] 1. A only set the heating body solder at its distal end provided with a removable or fixed bracket to the crater of the gas burner made of hard material deposition, IC chip to the end of the heating body
A mounting IC removal trowel characterized in that a recess (H) into which a clip is inserted is provided, and a clip that also serves as a heating for an IC chip terminal is provided at the four edges 2. A heating body made of a material to which solder is unlikely to adhere is provided at the other end of a bracket having a mounting portion to the crater of a gas burner at one end, and an IC chip is provided at the end of the heating body.
There are recesses (H) to enter, and ICs are attached to the edges of all four sides.
A mounted IC chip removing iron head, which is provided with a heating / clipping portion for a chip terminal.