JPS6015352Y2 - Electronic components for mounting on printed circuit boards - Google Patents

Electronic components for mounting on printed circuit boards

Info

Publication number
JPS6015352Y2
JPS6015352Y2 JP1977009885U JP988577U JPS6015352Y2 JP S6015352 Y2 JPS6015352 Y2 JP S6015352Y2 JP 1977009885 U JP1977009885 U JP 1977009885U JP 988577 U JP988577 U JP 988577U JP S6015352 Y2 JPS6015352 Y2 JP S6015352Y2
Authority
JP
Japan
Prior art keywords
electronic component
printed circuit
circuit board
mounting
electrode surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977009885U
Other languages
Japanese (ja)
Other versions
JPS53104354U (en
Inventor
稔 玉田
朝之 山本
宏一郎 岡田
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP1977009885U priority Critical patent/JPS6015352Y2/en
Publication of JPS53104354U publication Critical patent/JPS53104354U/ja
Application granted granted Critical
Publication of JPS6015352Y2 publication Critical patent/JPS6015352Y2/en
Expired legal-status Critical Current

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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Resistors (AREA)

Description

【考案の詳細な説明】 この考案はプリント基板取付用電子部品に関し、特に例
えば磁器コンデンサ、負特性サーミスタ、正特性サーミ
スタ、バリスタ等の電子部品に取着されるリード線の取
り付は強度を改良したプリント基板取付用電子部品に関
するものである。
[Detailed description of the invention] This invention relates to electronic components for mounting on printed circuit boards, and in particular improves the strength of lead wires attached to electronic components such as ceramic capacitors, negative temperature thermistors, positive temperature thermistors, and varistors. This invention relates to electronic components for mounting on printed circuit boards.

例えば、磁器コンデンサ、負特性サーミスタ、正特性サ
ーミスタ、バリスタ等の電子部品においては、プリント
基板に装着し易くするために、導電材料から成るリード
線が電子部品と一体化して形威される。
For example, in electronic components such as ceramic capacitors, negative characteristic thermistors, positive characteristic thermistors, and varistors, lead wires made of conductive material are integrated with the electronic components in order to facilitate mounting on printed circuit boards.

第1図は従来のプリント基板取付用電子部品の一例の図
解図であり、第1図aはその斜視図を示し、第1図すは
その側面図を示す。
FIG. 1 is an illustrative view of an example of a conventional electronic component for mounting on a printed circuit board, in which FIG. 1a shows a perspective view thereof, and FIG. 1A shows a side view thereof.

図に示したプリント基板取付用電子部品10は、例えば
磁器コンデンサ、負特性サーミスタ、正特性サーミスタ
、バリスタ等の電子部品11の両面11aおよびllb
の全面に電極を形威し、その両面の電極に当接してリー
ド線12.12’を半田付は等で固着して構成していた
The illustrated electronic component 10 for mounting on a printed circuit board includes both surfaces 11a and llb of an electronic component 11 such as a magnetic capacitor, a negative characteristic thermistor, a positive characteristic thermistor, or a varistor.
Electrodes were formed on the entire surface of the electrode, and lead wires 12 and 12' were attached to the electrodes on both sides by soldering or the like.

すなわち、従来では、リード線12.12’の一方端を
電子部品10の電極面に当接し、かつ該電子部品10の
電極面とリード線12.12’との接触部分を半田付は
等で固着し、両リード線12.12’の他方端は電子部
品11の厚さだけ離れて相対して伸びるように構成され
ていた。
That is, conventionally, one end of the lead wire 12.12' is brought into contact with the electrode surface of the electronic component 10, and the contact portion between the electrode surface of the electronic component 10 and the lead wire 12.12' is not soldered, etc. The other ends of both lead wires 12 and 12' were configured to extend toward each other with a distance equal to the thickness of the electronic component 11.

ところが、電子部品11をプリント基板へ装着する場合
、リード線12.12’の他方端(すなわち脚部)が平
行して真っ直ぐ伸びているため、プリント基板(後述の
第2図で説明する)と該電子部品11との間隔を一定長
さに保って装着するのが困難であった。
However, when mounting the electronic component 11 on a printed circuit board, the other ends (i.e., the legs) of the lead wires 12 and 12' extend straight in parallel, so that the electronic component 11 is not connected to the printed circuit board (described in FIG. 2 below). It was difficult to maintain the distance between the electronic component 11 and the electronic component 11 at a constant length.

すなわちリード線が直線的なため、電子部品11の下部
がプリント基板に直接接触し易く、電子部品11が発熱
を伴う正特性サーミスタ等の場合には、その発生熱によ
ってプリント基板を過熱してしまい、その部分を炭化し
てしまうという問題点があった。
In other words, since the lead wire is straight, the lower part of the electronic component 11 tends to come into direct contact with the printed circuit board, and if the electronic component 11 is a positive temperature coefficient thermistor or the like that generates heat, the generated heat may overheat the printed circuit board. , there was a problem that the part would be carbonized.

第2図は従来のプリント基板取付用電子部品の他の例の
斜視図である。
FIG. 2 is a perspective view of another example of the conventional electronic component for mounting on a printed circuit board.

図において、このプリント基板取付用電子部品20は、
前述の第1図に示すプリント基板取付用電子部品10の
問題点を解消するために、電子部品11の電極に接着す
るリード線22.22’の脚部に、該電子部品11とプ
リント基板PLとを所望の間隔に保って係止するための
湾曲部22aを形成したものであり、その他の部分は第
1図と同様に構成される。
In the figure, this electronic component 20 for mounting on a printed circuit board is
In order to solve the problem of the electronic component 10 for mounting on a printed circuit board shown in FIG. A curved portion 22a is formed to maintain and lock the two at a desired interval, and the other parts are constructed in the same manner as in FIG.

しかしながら、第1図および第2図に示すプリント基板
取付用電子部品10.20は、電子部品11の電極面に
当接してリード線の一方端を固着し、かつ該リード線の
脚部(他方端)の電極面から離れる部分13を電極面に
沿って直線的に形成するため、電子部品11をプリント
基板PLに装着するときや、装着した後電子部品11の
傾斜を矯正するとき等に加えられる外力が、前記部分1
3に集中し、ついにはリード線が電子部品から剥脱して
しまうという問題点を含んでいた。
However, the printed circuit board mounting electronic component 10.20 shown in FIGS. 1 and 2 has one end of the lead wire fixed to the electrode surface of the electronic component 11, and Since the portion 13 away from the electrode surface of the end) is formed linearly along the electrode surface, it can be used in addition to when mounting the electronic component 11 on the printed circuit board PL or when correcting the inclination of the electronic component 11 after mounting. The external force applied to the portion 1
3, which included the problem that the lead wires would eventually come off from the electronic components.

すなわち、リード線と電子部品11との接着部分13に
亀裂が生じ易く、引張強度が弱いという問題点を含む。
That is, there are problems in that the adhesive portion 13 between the lead wire and the electronic component 11 is likely to crack, and its tensile strength is low.

この問題点は、第2図に示すように、プリント基板PL
から電子部品11を浮かせて取付けるもの、つまりリー
ド線22.22’の脚部に係止用の湾曲部22aを設け
たものにおいてより顕著であった。
This problem is caused by the printed circuit board PL as shown in FIG.
This problem was more noticeable when the electronic component 11 was mounted floating from the ground, that is, when the leg portions of the lead wires 22 and 22' were provided with the curved portions 22a for locking.

すなわち、リード線22.22’の脚部に湾曲部22a
を有するものは、電子部品11の下端とプリント基板P
Lの表面との距離が長くなるため、支点となる部分13
に第1図のものより大きな力が加わるためである。
That is, the curved portion 22a is formed on the leg portion of the lead wire 22, 22'.
The lower end of the electronic component 11 and the printed circuit board P
Since the distance from the surface of L is longer, the part 13 that becomes the fulcrum
This is because a larger force is applied than that in Figure 1.

また、リード線の脚部に形成する係止部として、相対的
に小さな湾曲形状にすると、リード線が折れ易い問題点
をも含む。
Furthermore, if the locking portions formed on the leg portions of the lead wires are formed into relatively small curved shapes, there is a problem in that the lead wires are likely to break.

それゆえに、この考案の主たる目的は、上述のような問
題点を解消し得る電子部品とリード線との引張り強度が
大きく、プリント基板への装着が容易なプリント基板取
付用電子部品を提供することである。
Therefore, the main purpose of this invention is to provide an electronic component for mounting on a printed circuit board that can solve the above-mentioned problems, has a high tensile strength between the electronic component and the lead wire, and is easy to attach to the printed circuit board. It is.

この考案の上述の目的およびその他の目的と特徴は図面
を参照して行なう以下の詳細な説明から一層明らかとな
ろう。
The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.

第3図はこの考案の一実施例のプリント基板取付用電子
部品30の図解図であり、特に第3図aはその斜視図を
示し、第3図すはその側面図を示す。
FIG. 3 is an illustrative view of an electronic component 30 for mounting on a printed circuit board according to an embodiment of the invention, in particular, FIG. 3a shows a perspective view thereof, and FIG. 3 shows a side view thereof.

第4図はこの実施例のプリント基板取付用電子部品30
をプリント基板に装着した場合の詳細図である。
Figure 4 shows an electronic component 30 for mounting on a printed circuit board in this embodiment.
FIG. 3 is a detailed view of the device mounted on a printed circuit board.

次に第3図および第4図を参照してこの実施例の構成を
説明する。
Next, the configuration of this embodiment will be explained with reference to FIGS. 3 and 4.

電子部品11の両面には電極が形成されていて、その電
子部品の領域内の電極面に電子部品11をプリント基@
)Lに装着するためのリード線32.32の一方端が当
接して半田33付等で固着される。
Electrodes are formed on both sides of the electronic component 11, and the electronic component 11 is printed on the electrode surfaces within the area of the electronic component.
) One end of the lead wires 32 and 32 to be attached to L is brought into contact and fixed with solder 33 or the like.

このリード線32.32’の他方端(すなわち脚部)は
、電極面の接着端部32aから電極面と離れるように持
ち上げられ、相対的に短かい長さく32a−32b間)
だけ離れた部分32bから電極面に対向して成る長さだ
け離れて伸びるように形成される。
The other end (i.e., the leg) of this lead wire 32, 32' is lifted up from the adhesive end 32a of the electrode surface to separate it from the electrode surface, and has a relatively short length (between 32a and 32b).
It is formed so as to extend away from the portion 32b by a length opposite to the electrode surface.

すなわち、リード線32.32’は電極面の領域内側で
固着されて1くヨの字形状に曲げて形成され、成る長さ
く32a−32b間)だけ電極面から離れた部分32b
で逆1く、の字形状に曲げて形成される。
That is, the lead wires 32 and 32' are fixed inside the area of the electrode surface and bent into a dogleg shape, and have a length 32b separated from the electrode surface by a distance between 32a and 32b.
It is formed by bending it into an inverted 1 shape.

このリード線32.32’の電極面との当接部分および
電極面からの持ち上げ部分の周囲は半田付けされて固着
される。
This lead wire 32, 32' is fixed by soldering around the portion that contacts the electrode surface and the portion that lifts from the electrode surface.

つまりこの場合半田33は、電極面の領域内で当接され
ているリード線32,32′の部分(32aより先端側
)では、これを被覆するようにして固着するとともに、
リード線の持ち上げ部分32の基部においてもこの基部
が露出することのないように全周に亘って半田33がま
わり込みその取着力を高めている。
In other words, in this case, the solder 33 covers and adheres to the parts of the lead wires 32, 32' that are in contact within the area of the electrode surface (on the tip side from 32a), and
The solder 33 wraps around the entire circumference of the base of the raised portion 32 of the lead wire to prevent the base from being exposed, thereby increasing its attachment strength.

このように構成することによって、リード線32.32
’に加えられる引張力は、広範囲の半田におよぶことに
なり、その引張り強度が向上できる。
With this configuration, the lead wires 32, 32
The tensile force applied to ' will spread over a wide range of solder, and its tensile strength can be improved.

なお、リード線32.32’と電子部品11の電極面と
の持ち上げ部分32aを持ち上げ角度aは、好ましくは
20°〜90° (鋭角)に選ばれる。
Note that the lifting angle a of the lifting portion 32a between the lead wire 32, 32' and the electrode surface of the electronic component 11 is preferably selected to be 20° to 90° (an acute angle).

本考案においてはこのような電子部品において、さらに
リード線32.32’の脚部をプリント基板PLと電子
部品11の下端部との間を所望の間隔1だけ保ってプリ
ント基板PLに装着できるように、図示のように真っ直
ぐ伸びた下方の部分32cからプリント基板PLの平面
に沿って内側へ曲げられ、当該部分32cと一定長さだ
け内側の部分32dで電子部品11の電極面に相当する
下方に沿って曲げられる。
In the present invention, in such an electronic component, the legs of the lead wires 32 and 32' can be attached to the printed circuit board PL while maintaining a desired distance 1 between the printed circuit board PL and the lower end of the electronic component 11. As shown in the figure, a straight lower part 32c is bent inward along the plane of the printed circuit board PL, and a lower part 32d corresponding to the electrode surface of the electronic component 11 is bent inward by a certain length from the lower part 32c. can be bent along.

すなわち、注目すべき特徴は、リード線32゜32′の
一方端を電子部品11の電極面の領域内側に固着し、他
方側の脚部を電極面から離れるように段状に曲げて構成
し、かつその他方端をそのまま真っ直ぐ伸ばしてプリン
ト基fLに装着する脚部を内側へ段状に曲げて構成した
ことである。
That is, the noteworthy feature is that one end of the lead wire 32° 32' is fixed inside the area of the electrode surface of the electronic component 11, and the leg on the other side is bent in a stepped shape away from the electrode surface. , and the other end is straightened as it is, and the leg portion attached to the print board fL is bent inward in a stepped manner.

なお図示の例においては、リード線32,32′の他方
先端部(プリント基板PL側)が、電子部品11の電極
面に相対する下方に沿う部分32dで曲げられているが
、この部分32dを、電子部品11の厚み方向の中心に
相当する下方に沿わせてもよい。
In the illustrated example, the other end of the lead wires 32, 32' (on the printed circuit board PL side) is bent at a portion 32d along the lower side facing the electrode surface of the electronic component 11. , it may be placed along the lower part corresponding to the center of the electronic component 11 in the thickness direction.

これは電子部品11が比較的肉厚なものの場合に好適で
ある。
This is suitable when the electronic component 11 is relatively thick.

以上のように、この考案によれば、次のような特有の効
果が奏される。
As described above, this invention provides the following unique effects.

すなわち、リード線の脚部に段状部を形成しプリント基
板上に浮かせて取付けられるようにしているにもかかわ
らず、リード線の一方端と電子部品の電極面の内側領域
で電極と固着し、かつリード線の他方端を電極面の固着
部分から持ち上げ電極面から離れて対向するように形成
するため、リード線の引張り力は持ち上げ部分の基部全
体に加わり、引張り強度を大きくすることができる。
In other words, even though the legs of the lead wire are formed with stepped parts so that they can be mounted floating on the printed circuit board, one end of the lead wire and the inside area of the electrode surface of the electronic component may stick to the electrode. , and the other end of the lead wire is lifted from the fixed part of the electrode surface and formed to face away from the electrode surface, so the tensile force of the lead wire is applied to the entire base of the lifted part, increasing the tensile strength. .

従って、電子部品をプリント基板に装着するときや装着
した後の傾斜の矯正に際して加えられる外力に対しても
、電子部品とリード線とが剥がれることを防止できる。
Therefore, the electronic component and the lead wire can be prevented from peeling off even in response to an external force applied when mounting the electronic component on the printed circuit board or when correcting the inclination after mounting.

また、リード線の脚部に段状部を形成しているので、た
とえば第4図に示す左側または右側から電子部品に外力
が加わったとしても、その力を主として段状部の下端外
側32cを支点として受止めることができ、電子部品の
傾斜をより良好に防止できる。
Furthermore, since the stepped portion is formed on the leg of the lead wire, even if an external force is applied to the electronic component from the left or right side as shown in FIG. It can be used as a fulcrum, and tilting of electronic components can be better prevented.

これにより、プリント基板上に載置した電子部品の傾斜
の矯正頻度を大幅に減少でき、電子部品からリード線が
剥がれる要因となる、矯正に際する不所望な外力の印加
、という工数を極力削減できるのである。
This greatly reduces the frequency of correcting the tilt of electronic components mounted on printed circuit boards, and minimizes the number of steps required to apply undesired external force during correction, which can cause lead wires to peel off from electronic components. It can be done.

さらに、電極面からの離隔とプリント基板上へ載置のた
めに、リード線の脚部に形成された段状部が一度の加工
によって行なえるため、生産性にも優れている。
Furthermore, the stepped portions formed on the leg portions of the lead wires to separate them from the electrode surface and to place them on the printed circuit board can be formed in a single process, resulting in excellent productivity.

これによって、プリント基板への装着が容易に行える。This makes it easy to attach it to a printed circuit board.

以上のように、この考案によれば、電子部品とリード線
との引張り強度が大きく、プリント基板への装着が容易
なプリント基板取付用電子部品が得られる。
As described above, according to this invention, it is possible to obtain an electronic component for mounting on a printed circuit board, which has a high tensile strength between the electronic component and the lead wire, and is easy to attach to the printed circuit board.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は従来のプリント基板取付用電子部
品の図解図である。 第3図はこの考案の一実施例のプリント基板取付用電子
部品の図解図である。 第4図はこの実施例のプリント基板取付用電子部品をプ
リント基板に装着した場合の詳細図である。 図において、10および20は従来のプリント基板取付
用電子部品、30はこの考案のプリント基板取付用電子
部品、11は電子部品、32,32′はこの考案のリー
ド線、PLはプリント基板を示す。
FIGS. 1 and 2 are illustrative views of conventional electronic components for mounting on printed circuit boards. FIG. 3 is an illustrative view of an electronic component for mounting on a printed circuit board according to an embodiment of this invention. FIG. 4 is a detailed view of the printed circuit board mounting electronic component of this embodiment mounted on the printed circuit board. In the figure, 10 and 20 are conventional electronic components for mounting on a printed circuit board, 30 is an electronic component for mounting on a printed circuit board of this invention, 11 is an electronic component, 32 and 32' are lead wires of this invention, and PL is a printed circuit board. .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面に電極が形威された電子部品と、前記電子部品をプ
リント基板に装着するために電子部品の両面の電極にそ
れぞれ取り付けられるリード線とからなり、前記リード
線は、その−刃端が、前記電子部品の電極の形成された
領域内で電子部品の電極面に当接され、その他方端が、
電子部品の当接面から予め定める長さだけ離れるように
持ち上げられ、かつ電子部品と前記プリント基板との装
着間隔に相関する長さだけ電子部品の面に対向して延び
、次に内側に折れ曲って延び、さらに前記プリント基板
の孔内に挿通されるように電子部品の面と平行となるよ
うに延びて形威されており、かつ前記電極面に当接され
た全領域および電子部品の当接面から持ち上げられた基
部全周域で半田付けによって固着されていることを特徴
とする、ブリット基板取付用電子部品。
It consists of an electronic component with electrodes formed on both sides, and lead wires that are attached to the electrodes on both sides of the electronic component in order to mount the electronic component on a printed circuit board, and the lead wire has a blade end that is The electrode surface of the electronic component is brought into contact with the electrode surface of the electronic component within the region where the electrode is formed, and the other end is
It is lifted up a predetermined length away from the contact surface of the electronic component, extends opposite the surface of the electronic component by a length that correlates to the mounting interval between the electronic component and the printed circuit board, and then bends inward. It extends in a curved manner, and extends parallel to the surface of the electronic component so as to be inserted into the hole of the printed circuit board, and the entire area in contact with the electrode surface and the electronic component. An electronic component for mounting on a bullet board, characterized in that the entire circumference of the base lifted from the contact surface is fixed by soldering.
JP1977009885U 1977-01-28 1977-01-28 Electronic components for mounting on printed circuit boards Expired JPS6015352Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977009885U JPS6015352Y2 (en) 1977-01-28 1977-01-28 Electronic components for mounting on printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977009885U JPS6015352Y2 (en) 1977-01-28 1977-01-28 Electronic components for mounting on printed circuit boards

Publications (2)

Publication Number Publication Date
JPS53104354U JPS53104354U (en) 1978-08-22
JPS6015352Y2 true JPS6015352Y2 (en) 1985-05-14

Family

ID=28821467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977009885U Expired JPS6015352Y2 (en) 1977-01-28 1977-01-28 Electronic components for mounting on printed circuit boards

Country Status (1)

Country Link
JP (1) JPS6015352Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5168785A (en) * 1974-12-11 1976-06-14 Murata Manufacturing Co Denshibuhinno denkyokuhetanshiotoritsukeruhoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5168785A (en) * 1974-12-11 1976-06-14 Murata Manufacturing Co Denshibuhinno denkyokuhetanshiotoritsukeruhoho

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JPS53104354U (en) 1978-08-22

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