JPS6015352Y2 - Electronic components for mounting on printed circuit boards - Google Patents

Description

[Detailed description of the invention] This invention relates to electronic components for mounting on printed circuit boards, and in particular improves the strength of lead wires attached to electronic components such as ceramic capacitors, negative temperature thermistors, positive temperature thermistors, and varistors. This invention relates to electronic components for mounting on printed circuit boards.

For example, in electronic components such as ceramic capacitors, negative characteristic thermistors, positive characteristic thermistors, and varistors, lead wires made of conductive material are integrated with the electronic components in order to facilitate mounting on printed circuit boards.

FIG. 1 is an illustrative view of an example of a conventional electronic component for mounting on a printed circuit board, in which FIG. 1a shows a perspective view thereof, and FIG. 1A shows a side view thereof.

The illustrated electronic component 10 for mounting on a printed circuit board includes both surfaces 11a and llb of an electronic component 11 such as a magnetic capacitor, a negative characteristic thermistor, a positive characteristic thermistor, or a varistor.
Electrodes were formed on the entire surface of the electrode, and lead wires 12 and 12' were attached to the electrodes on both sides by soldering or the like.

That is, conventionally, one end of the lead wire 12.12' is brought into contact with the electrode surface of the electronic component 10, and the contact portion between the electrode surface of the electronic component 10 and the lead wire 12.12' is not soldered, etc. The other ends of both lead wires 12 and 12' were configured to extend toward each other with a distance equal to the thickness of the electronic component 11.

However, when mounting the electronic component 11 on a printed circuit board, the other ends (i.e., the legs) of the lead wires 12 and 12' extend straight in parallel, so that the electronic component 11 is not connected to the printed circuit board (described in FIG. 2 below). It was difficult to maintain the distance between the electronic component 11 and the electronic component 11 at a constant length.

In other words, since the lead wire is straight, the lower part of the electronic component 11 tends to come into direct contact with the printed circuit board, and if the electronic component 11 is a positive temperature coefficient thermistor or the like that generates heat, the generated heat may overheat the printed circuit board. , there was a problem that the part would be carbonized.

FIG. 2 is a perspective view of another example of the conventional electronic component for mounting on a printed circuit board.

In the figure, this electronic component 20 for mounting on a printed circuit board is
In order to solve the problem of the electronic component 10 for mounting on a printed circuit board shown in FIG. A curved portion 22a is formed to maintain and lock the two at a desired interval, and the other parts are constructed in the same manner as in FIG.

However, the printed circuit board mounting electronic component 10.20 shown in FIGS. 1 and 2 has one end of the lead wire fixed to the electrode surface of the electronic component 11, and Since the portion 13 away from the electrode surface of the end) is formed linearly along the electrode surface, it can be used in addition to when mounting the electronic component 11 on the printed circuit board PL or when correcting the inclination of the electronic component 11 after mounting. The external force applied to the portion 1
3, which included the problem that the lead wires would eventually come off from the electronic components.

That is, there are problems in that the adhesive portion 13 between the lead wire and the electronic component 11 is likely to crack, and its tensile strength is low.

This problem is caused by the printed circuit board PL as shown in FIG.
This problem was more noticeable when the electronic component 11 was mounted floating from the ground, that is, when the leg portions of the lead wires 22 and 22' were provided with the curved portions 22a for locking.

That is, the curved portion 22a is formed on the leg portion of the lead wire 22, 22'.
The lower end of the electronic component 11 and the printed circuit board P
Since the distance from the surface of L is longer, the part 13 that becomes the fulcrum
This is because a larger force is applied than that in Figure 1.

Furthermore, if the locking portions formed on the leg portions of the lead wires are formed into relatively small curved shapes, there is a problem in that the lead wires are likely to break.

Therefore, the main purpose of this invention is to provide an electronic component for mounting on a printed circuit board that can solve the above-mentioned problems, has a high tensile strength between the electronic component and the lead wire, and is easy to attach to the printed circuit board. It is.

The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.

FIG. 3 is an illustrative view of an electronic component 30 for mounting on a printed circuit board according to an embodiment of the invention, in particular, FIG. 3a shows a perspective view thereof, and FIG. 3 shows a side view thereof.

Figure 4 shows an electronic component 30 for mounting on a printed circuit board in this embodiment.
FIG. 3 is a detailed view of the device mounted on a printed circuit board.

Next, the configuration of this embodiment will be explained with reference to FIGS. 3 and 4.

Electrodes are formed on both sides of the electronic component 11, and the electronic component 11 is printed on the electrode surfaces within the area of the electronic component.
) One end of the lead wires 32 and 32 to be attached to L is brought into contact and fixed with solder 33 or the like.

The other end (i.e., the leg) of this lead wire 32, 32' is lifted up from the adhesive end 32a of the electrode surface to separate it from the electrode surface, and has a relatively short length (between 32a and 32b).
It is formed so as to extend away from the portion 32b by a length opposite to the electrode surface.

That is, the lead wires 32 and 32' are fixed inside the area of the electrode surface and bent into a dogleg shape, and have a length 32b separated from the electrode surface by a distance between 32a and 32b.
It is formed by bending it into an inverted 1 shape.

This lead wire 32, 32' is fixed by soldering around the portion that contacts the electrode surface and the portion that lifts from the electrode surface.

In other words, in this case, the solder 33 covers and adheres to the parts of the lead wires 32, 32' that are in contact within the area of the electrode surface (on the tip side from 32a), and
The solder 33 wraps around the entire circumference of the base of the raised portion 32 of the lead wire to prevent the base from being exposed, thereby increasing its attachment strength.

With this configuration, the lead wires 32, 32
The tensile force applied to ' will spread over a wide range of solder, and its tensile strength can be improved.

Note that the lifting angle a of the lifting portion 32a between the lead wire 32, 32' and the electrode surface of the electronic component 11 is preferably selected to be 20° to 90° (an acute angle).

In the present invention, in such an electronic component, the legs of the lead wires 32 and 32' can be attached to the printed circuit board PL while maintaining a desired distance 1 between the printed circuit board PL and the lower end of the electronic component 11. As shown in the figure, a straight lower part 32c is bent inward along the plane of the printed circuit board PL, and a lower part 32d corresponding to the electrode surface of the electronic component 11 is bent inward by a certain length from the lower part 32c. can be bent along.

That is, the noteworthy feature is that one end of the lead wire 32° 32' is fixed inside the area of the electrode surface of the electronic component 11, and the leg on the other side is bent in a stepped shape away from the electrode surface. , and the other end is straightened as it is, and the leg portion attached to the print board fL is bent inward in a stepped manner.

In the illustrated example, the other end of the lead wires 32, 32' (on the printed circuit board PL side) is bent at a portion 32d along the lower side facing the electrode surface of the electronic component 11. , it may be placed along the lower part corresponding to the center of the electronic component 11 in the thickness direction.

This is suitable when the electronic component 11 is relatively thick.

As described above, this invention provides the following unique effects.

In other words, even though the legs of the lead wire are formed with stepped parts so that they can be mounted floating on the printed circuit board, one end of the lead wire and the inside area of the electrode surface of the electronic component may stick to the electrode. , and the other end of the lead wire is lifted from the fixed part of the electrode surface and formed to face away from the electrode surface, so the tensile force of the lead wire is applied to the entire base of the lifted part, increasing the tensile strength. .

Therefore, the electronic component and the lead wire can be prevented from peeling off even in response to an external force applied when mounting the electronic component on the printed circuit board or when correcting the inclination after mounting.

Furthermore, since the stepped portion is formed on the leg of the lead wire, even if an external force is applied to the electronic component from the left or right side as shown in FIG. It can be used as a fulcrum, and tilting of electronic components can be better prevented.

This greatly reduces the frequency of correcting the tilt of electronic components mounted on printed circuit boards, and minimizes the number of steps required to apply undesired external force during correction, which can cause lead wires to peel off from electronic components. It can be done.

Furthermore, the stepped portions formed on the leg portions of the lead wires to separate them from the electrode surface and to place them on the printed circuit board can be formed in a single process, resulting in excellent productivity.

This makes it easy to attach it to a printed circuit board.

As described above, according to this invention, it is possible to obtain an electronic component for mounting on a printed circuit board, which has a high tensile strength between the electronic component and the lead wire, and is easy to attach to the printed circuit board.

[Brief explanation of the drawing]

FIGS. 1 and 2 are illustrative views of conventional electronic components for mounting on printed circuit boards. FIG. 3 is an illustrative view of an electronic component for mounting on a printed circuit board according to an embodiment of this invention. FIG. 4 is a detailed view of the printed circuit board mounting electronic component of this embodiment mounted on the printed circuit board. In the figure, 10 and 20 are conventional electronic components for mounting on a printed circuit board, 30 is an electronic component for mounting on a printed circuit board of this invention, 11 is an electronic component, 32 and 32' are lead wires of this invention, and PL is a printed circuit board. .

Claims (1)

[Scope of utility model registration request] It consists of an electronic component with electrodes formed on both sides, and lead wires that are attached to the electrodes on both sides of the electronic component in order to mount the electronic component on a printed circuit board, and the lead wire has a blade end that is The electrode surface of the electronic component is brought into contact with the electrode surface of the electronic component within the region where the electrode is formed, and the other end is
It is lifted up a predetermined length away from the contact surface of the electronic component, extends opposite the surface of the electronic component by a length that correlates to the mounting interval between the electronic component and the printed circuit board, and then bends inward. It extends in a curved manner, and extends parallel to the surface of the electronic component so as to be inserted into the hole of the printed circuit board, and the entire area in contact with the electrode surface and the electronic component. An electronic component for mounting on a bullet board, characterized in that the entire circumference of the base lifted from the contact surface is fixed by soldering.