JPH0466041U - - Google Patents

Info

Publication number
JPH0466041U
JPH0466041U JP10922490U JP10922490U JPH0466041U JP H0466041 U JPH0466041 U JP H0466041U JP 10922490 U JP10922490 U JP 10922490U JP 10922490 U JP10922490 U JP 10922490U JP H0466041 U JPH0466041 U JP H0466041U
Authority
JP
Japan
Prior art keywords
terminal group
silver
group
conductive film
front substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10922490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10922490U priority Critical patent/JPH0466041U/ja
Publication of JPH0466041U publication Critical patent/JPH0466041U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例の要部断面図、
第2図は本考案の第2の実施例の要部断面図、第
3図は従来のPDPの一例の要部断面図である。 1……前面基板、2……樹脂、3……FPC、
4,14……絶縁体膜、5……銀端子、6……異
方性導電膜、7……後面基板、8……封止材。
FIG. 1 is a sectional view of the main parts of the first embodiment of the present invention,
FIG. 2 is a sectional view of a main part of a second embodiment of the present invention, and FIG. 3 is a sectional view of a main part of an example of a conventional PDP. 1...Front board, 2...Resin, 3...FPC,
4, 14... Insulator film, 5... Silver terminal, 6... Anisotropic conductive film, 7... Rear substrate, 8... Sealing material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電極群を形成した前面基板と、電極群を形成し
た後面基板とを相対向させて気密封止し、内部の
前記電極群のそれぞれに接続し外部から電圧を印
加するための銀端子群を前記前面基板と前記後面
基板の周縁部に有し、外部回路から前記銀端子群
に電圧を供給するための回路線を有するフレキシ
ブルプリントサーキツトの端子群と前記銀端子群
とのそれぞれを異方性導電膜を介して接続するプ
ラズマデイスプレイパネルにおいて、少なくとも
前記銀端子群の前記前面基板と前記後面基板の封
着部に沿つた部分および周縁部に沿つた部分を絶
縁体膜で被覆し、かつ、前記異方性導電膜と前記
絶縁体膜とが重なり合うようにして前記異方性導
電膜と前記銀端子群とを接続したことを特徴とす
るプラズマデイスプレイパネル。
The front substrate on which the electrode group is formed and the rear substrate on which the electrode group is formed are opposed to each other and hermetically sealed, and a group of silver terminals are connected to each of the electrode groups inside and for applying a voltage from the outside. Each of the terminal group and the silver terminal group of a flexible printed circuit having a circuit line for supplying voltage from an external circuit to the silver terminal group, which is provided at the peripheral edge of the front substrate and the rear substrate, is anisotropic. In a plasma display panel connected via a conductive film, at least a portion of the silver terminal group along the sealing portion of the front substrate and the rear substrate and a portion along the peripheral edge thereof are covered with an insulating film, and A plasma display panel characterized in that the anisotropic conductive film and the silver terminal group are connected so that the anisotropic conductive film and the insulating film overlap each other.
JP10922490U 1990-10-18 1990-10-18 Pending JPH0466041U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10922490U JPH0466041U (en) 1990-10-18 1990-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10922490U JPH0466041U (en) 1990-10-18 1990-10-18

Publications (1)

Publication Number Publication Date
JPH0466041U true JPH0466041U (en) 1992-06-10

Family

ID=31856390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10922490U Pending JPH0466041U (en) 1990-10-18 1990-10-18

Country Status (1)

Country Link
JP (1) JPH0466041U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288750A (en) * 1998-03-31 1999-10-19 Casio Comput Co Ltd Joint structure of flexible wiring board
JP2003295786A (en) * 2002-02-01 2003-10-15 Matsushita Electric Ind Co Ltd Method of manufacturing plasma display device
JP2006171764A (en) * 2004-12-17 2006-06-29 Lg Electron Inc Plasma display apparatus
JP2008116956A (en) * 2006-10-31 2008-05-22 Samsung Sdi Co Ltd Plasma display device
JP2008311411A (en) * 2007-06-14 2008-12-25 Panasonic Corp Electrode bonding structure and electrode bonding method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288750A (en) * 1998-03-31 1999-10-19 Casio Comput Co Ltd Joint structure of flexible wiring board
JP2003295786A (en) * 2002-02-01 2003-10-15 Matsushita Electric Ind Co Ltd Method of manufacturing plasma display device
JP2006171764A (en) * 2004-12-17 2006-06-29 Lg Electron Inc Plasma display apparatus
JP2008116956A (en) * 2006-10-31 2008-05-22 Samsung Sdi Co Ltd Plasma display device
JP4564039B2 (en) * 2006-10-31 2010-10-20 三星エスディアイ株式会社 Plasma display device
US8174822B2 (en) 2006-10-31 2012-05-08 Samsung Sdi Co., Ltd. Plasma display device
JP2008311411A (en) * 2007-06-14 2008-12-25 Panasonic Corp Electrode bonding structure and electrode bonding method

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