JPH0465441U - - Google Patents

Info

Publication number
JPH0465441U
JPH0465441U JP1990109943U JP10994390U JPH0465441U JP H0465441 U JPH0465441 U JP H0465441U JP 1990109943 U JP1990109943 U JP 1990109943U JP 10994390 U JP10994390 U JP 10994390U JP H0465441 U JPH0465441 U JP H0465441U
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
conductive adhesive
electrically connected
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990109943U
Other languages
English (en)
Japanese (ja)
Other versions
JP2513872Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990109943U priority Critical patent/JP2513872Y2/ja
Publication of JPH0465441U publication Critical patent/JPH0465441U/ja
Application granted granted Critical
Publication of JP2513872Y2 publication Critical patent/JP2513872Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
JP1990109943U 1990-10-19 1990-10-19 半導体装置 Expired - Fee Related JP2513872Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990109943U JP2513872Y2 (ja) 1990-10-19 1990-10-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990109943U JP2513872Y2 (ja) 1990-10-19 1990-10-19 半導体装置

Publications (2)

Publication Number Publication Date
JPH0465441U true JPH0465441U (enExample) 1992-06-08
JP2513872Y2 JP2513872Y2 (ja) 1996-10-09

Family

ID=31857210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990109943U Expired - Fee Related JP2513872Y2 (ja) 1990-10-19 1990-10-19 半導体装置

Country Status (1)

Country Link
JP (1) JP2513872Y2 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577164A (en) * 1978-12-07 1980-06-10 Nec Corp Semiconductor device
JPS62256446A (ja) * 1986-04-30 1987-11-09 Toshiba Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577164A (en) * 1978-12-07 1980-06-10 Nec Corp Semiconductor device
JPS62256446A (ja) * 1986-04-30 1987-11-09 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JP2513872Y2 (ja) 1996-10-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees