JPS6291435U - - Google Patents

Info

Publication number
JPS6291435U
JPS6291435U JP1985183820U JP18382085U JPS6291435U JP S6291435 U JPS6291435 U JP S6291435U JP 1985183820 U JP1985183820 U JP 1985183820U JP 18382085 U JP18382085 U JP 18382085U JP S6291435 U JPS6291435 U JP S6291435U
Authority
JP
Japan
Prior art keywords
insulating
insulating substrate
pellets
holes
mounting agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985183820U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985183820U priority Critical patent/JPS6291435U/ja
Publication of JPS6291435U publication Critical patent/JPS6291435U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68Shapes or dispositions thereof
    • H10W70/681Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP1985183820U 1985-11-28 1985-11-28 Pending JPS6291435U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985183820U JPS6291435U (enExample) 1985-11-28 1985-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985183820U JPS6291435U (enExample) 1985-11-28 1985-11-28

Publications (1)

Publication Number Publication Date
JPS6291435U true JPS6291435U (enExample) 1987-06-11

Family

ID=31130904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985183820U Pending JPS6291435U (enExample) 1985-11-28 1985-11-28

Country Status (1)

Country Link
JP (1) JPS6291435U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842940B2 (ja) * 1979-01-24 1983-09-22 株式会社日立メデイコ 電離箱型x線検出器及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842940B2 (ja) * 1979-01-24 1983-09-22 株式会社日立メデイコ 電離箱型x線検出器及びその製造方法

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