JPH0465295A - Ic card assembling apparatus - Google Patents

Abstract

PURPOSE:To enhance the product accuracy of an IC card by providing a peeling inspection apparatus to an assembling table and removing the IC card whose IC module is judged to be certainly fixed to a recessed part. CONSTITUTION:When the surface, rear and directionality of the IC module 3 arranged to a module table 12 are judged to be abnormal, this abnormality is immediately displayed from a main control apparatus to stop the module table and, therefore, the IC module 3 concerned can be arranged at an accurate position over again. A card 2 whose recessed part 2a is judged to be not normally formed by a recessed part inspection apparatus, an IC card 1 judged to be not uniform in height by a cooling apparatus 32 and the IC card 1 whose IC module 3 is judged not to be certainly fixed to the recessed part 2a by a peeling inspection apparatus in an assembling table 14 are stored in the main control apparatus and discharged to the outside on the basis of these data by an NG discharge apparatus 35.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Application!Ff) The present invention relates to an IC card assembly device for producing an IC card.

(Prior Art) In recent years, various studies have been carried out regarding IC cards called chip cards, memory cards, microcomputer cards, or electronic cards equipped with IC chips such as microcomputers and memories.

Compared to conventional magnetic cards, such IC cards have
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, and credit cards are considering storing transaction history such as shopping.

As shown in FIG. 7, the IC card 1 includes an IC module 3 on which an IC chip is mounted, and a card 2 in which a recess 2a for mounting the IC module is formed. Further, a primer 4 is applied to the back side of the IC module 3, and an adhesive sheet 5 is placed in the recess 2a of the card 2. Note that the shape of the adhesive sheet 5 is similar to that of the recess 2.
The size is such that it can be placed on the middle step part 7 of the portion a.

By the way, the IC card 1 as shown in FIG.
A primer is applied to the back side of the module 3, an adhesive sheet 5 is installed in the recess 2a formed in advance on the card 2, an IC modular 3 is installed on the adhesive sheet 5 in the recess 2a, and the IC module 3 is heated. It can be assembled by pressing.

However, the reality is that conventional IC card assembly processes have been manually performed by humans.

(Problems to be Solved by the Invention) As mentioned above, the actual situation is that IC card assembly is done manually and takes a long time.

By the way, in order to quickly assemble an IC card from a card and an IC module, it has been considered to automatically assemble the IC card using an IC card assembly device. In such a case,
If it is possible to check in advance whether the cards and IC modules before being assembled and the IC cards after being assembled are in proper use, it is convenient because expensive IC modules can be recovered without waste.

The present invention has been made in consideration of these points,
We inspect cards and IC modules before assembly, and inspect IC cards after assembly to improve product accuracy.We also inspect parts such as expensive IC modules, cards with recesses, and adhesive sheets due to assembly defects. To provide an IC card assembly device that can be collected and reused without wasting it.

[Structure of the invention]

(Means for Solving the Problems) The present invention includes a module table in which IC modules with the front and back sides facing upward are sequentially arranged and rotated, a module table for applying a primer to the IC modules, and a card in which a recess is formed in advance is sequentially arranged. an assembly module that sequentially attaches IC modules with the adhesive and front side facing upward in the recess of the card, heats and presses the IC modules; This IC card assembly apparatus is characterized in that it is equipped with a peel inspection device that performs a peel inspection of an IC module fixed therein.

(Function) According to the present invention, the peel inspection device of the assembly table determines whether the IC module is securely fixed in the recess, and the card or IC module is recovered and reused without being assembled defectively. be able to.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

1 to 6 are diagrams showing an embodiment of an IC card assembly apparatus according to the present invention. Of these, Fig. 1 is a schematic system diagram of the IC card assembly device, Fig. 2 is a cross-sectional view taken along the line ■-■ in Fig. 1, and Fig. 3 is a cross-sectional view taken along the line m-■ in Fig. 1.
4 is a cross-sectional view taken along the line ■--■ in FIG. 1, FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 1, and FIG. 6 is a plan view of the IC card assembly apparatus.

In FIG. 1, an IC card assembly device 10 includes a module table 12 on which IC modules 3 with their back sides facing upward are sequentially arranged and rotated, and an assembly table 14 on which cards 2 are sequentially arranged and rotated. .

Further, a tray 18 in which a large number of IC modules 3 are stored in advance is arranged on the right side of the module table 12, and between the tray 18 and the module table 12, a tray 18 is provided.
A module take-out device 20 for taking out the IC module 3 in the IC module 8 and placing it on the module table 12 is provided. Further, on the module table 12, a primer coating device 2 for coating a primer on the back surface of the IC module 3 is provided.
2 is provided.

Further, between the module table 12 and the assembly table 14, the IC modules 3 are successively nested (mounting table) 6.
2g, 62b, 62c, and a module transfer device 26 for drying the primer applied to the module 3;
A reversing device 24 for reversing the IC module 3 transferred by the module transfer device 26 by 180°, and an IC
A module supply device 25 is provided for supplying the module 3 to the card 2 on the assembly table 14 and for mounting the IC module 3 into the recess 2a of the card 2.

On the other hand, on the left side of the assembly table 14, there is a card supply/discharge device that supplies the cards 2 stored in the cart stocker 38 to the assembly table 14 side and discharges the IC cards 1 assembled by the assembly table 14 to the discharge conveyor 40 side. 36 are arranged.

Also, the assembly table 14 has a card supply/discharge device 3.
6 (on the downstream side in the rotational direction), the recess 2 of the card 2
An adhesive sheet supply device 28 for loading adhesive sheet 5 of a predetermined shape is disposed within a.

Further, on the downstream side of this adhesive sheet supplying device 28, there is a module supplying device 25 for mounting the IC module 3 on the adhesive sheet 5 in the recess 2a, and an IC module installed in the recess 2a.
A thermal bonding device 30 heats and presses the C module 3 from above, a cooling device 32 cools the IC module 3, a peel inspection device 34 inspects the IC module 3 for peeling from the card 2, and detects defective IC cards 1. NG to be discharged outside
A discharge device 35 is sequentially arranged.

Among these, the peel inspection device 34 is used to peel off the terminal surface of the IC module 3 by adsorption with a constant force, and inspect whether a predetermined adhesive strength is obtained.

Next, each component will be explained in more detail with reference to FIG.

As shown in FIG. 6, the trays 18 near the module table 12 are supplied from a ζ real tray magazine 42. As shown in FIG. Further, the used trays 18 are stored in an empty tray magazine 48.

Furthermore, a module take-out device 20 for taking out IC modules from the tray 18 has a module take-out section 20a. Moreover, this module take-out part 20a is movable in the XY directions by the XY robot 21.

Further, the IC module 3 placed on the module table 12 is observed from above, and it is determined whether the back side of the IC module 3 (the side to which the primer is applied) is facing upward. A front/back discrimination device 70 is provided. This front/back discrimination device i70 projects light and discriminates between front and back based on the difference in the amount of reflected and received light.

Furthermore, a primer coating device 22 is disposed downstream of this front/back discriminating device 70.

The primer coating device 22 has a primer tank 44 in which a primer such as polyurethane resin is stored. Then, by this primer coating device 22, a portion (seventh
Primer 4 is applied to the area shown in the figure.

Further, on the downstream side of the primer coating device 22, an image sensor 45 is arranged to determine whether or not the IC module 3 arranged on the module table 12 is oriented in a predetermined direction. That is, as shown in FIG. 1, for example, the IC modules 3 are arranged on the module table 12 with the D side facing outward, but the image sensor 45 determines whether all the IC modules 3 are facing in this direction. It will be judged.

Further, a module transfer device 26 provided on the downstream side of the image sensor 45 transfers the Ic module 3 on the module table 12 to a plurality of, for example, three nests (mounting tables) 62a provided on the side of the module table 12. , 62
b, 62c.

Further, a reversing device 24 for reversing the IC module 3 by 180 degrees is disposed between the final nest 62c and the module supply device 25. The reversing device 24 allows the IC module 3 to have its front surface facing upward. Furthermore, the module supply device 25
It has a module supply section 25a that is movable in the XY force directions by the robot 50.

On the other hand, the card supply/discharge device 36 provided on the assembly table 14 has a cross-shaped planar shape and is rotatable about a rotation shaft 37. That is, the card supply/discharge device 3
One leg 36a of the card stocker 38 holds the card 2 in the card stocker 38 by suction, and the other leg 36b holds the card 2 on the assembly table 14.
By suctioning and holding the upper IC card 1 and rotating it clockwise in this state, insert a new card 2 onto the assembly table 1.
4, and the assembled IC card 1 can be discharged to the discharge conveyor 40 side.

Further, on the downstream side of the card supply/discharge device 36, a recess inspection device 46 and an adhesive sheet supply device 28 are sequentially arranged. Among these, the recess inspection device 46 irradiates the object with LED light, forms an image of the reflected light on the optical position detection element, and measures the displacement of the object based on the displacement of the spot.

The adhesive sheet supply device 28 includes a supply roll 58 that supplies a strip-shaped adhesive sheet of unsaturated polyester or the like, and a take-up roll 52 that winds up the strip-shaped adhesive sheet. Further, between the supply roll 58 and the take-up roll 52, there is an adhesive sheet supply section 56 that punches out a band-shaped adhesive sheet to form an adhesive sheet of a predetermined shape and inserts this adhesive sheet into the recess 2a of the card 2. is installed.

Furthermore, the adhesive sheet supply section 56 has a punching die (not shown) for punching out the band-shaped adhesive sheet, and a suction section (not shown) for sucking and holding the punched adhesive sheet. Note that the adhesive sheet supply section 56 is movable in the XY force directions by the XY robot 54.

Also, on the assembly table 14, an adhesive sheet supply device 28 is provided.
A module supply device 25 and a thermal bonding device 3 are installed on the downstream side of the
0 are arranged sequentially.

Among these, the heat bonding device 30 is used to heat the IC module 3 mounted in the recess 2a of the card 2 from above using a heating rod (not shown).
The Ic module is heated and pressed to melt the adhesive sheet 5 and fix the Ic module in the recess 2a.

Furthermore, on the downstream side of the thermal bonding device 30, a cooling device 32 for cooling the IC module 3 within the recess 2a is provided. This cooling device 32 cools the IC module 3 by bringing a cooling rod (not shown) into contact with the IC module 3 from above. Furthermore, the cooling device 32 also has a function of determining whether the surface of the card 2 and the surface of the IC module 3 are coincident with each other.

Further, on the downstream side of the cooling device 32, a peeling inspection device 34 and an NG discharge device 35 are arranged.

Next, the operation of this embodiment having such a configuration will be explained.

First, the tray 18 is taken out from the actual tray magazine 42. Next, a large number of IC modules 3 stored in the tray 18 are sucked and held by the module take-out device 20 and taken out.
are arranged sequentially on top.

In this case, the IC module 3 is arranged with the back side (the side to which the primer is applied) facing upward, and the four directions of the rc module 3 are A, B, and C.

When it is set as the D direction, it is arranged with the D direction facing outward.

Next, the IC module 3 is checked by the front/back discrimination device 70.
It is determined whether the back side is correctly facing upward.

That is, since the primer 4 is applied to the back side of the IC module 3 on the module table 12 as described later, if the back side of the IC module 3 is not facing upward, the front/back discrimination device 70 immediately detects this. do. This abnormality signal is then input to the main controller 80,
The module table 12 is stopped.

At the same time, if the back side of the IC module 3 is not facing upward, the main controller 80 displays this abnormality.

Next, the IC module 3 is coated with the primer coater 22.
Primer 4 is applied to the back surface side of the adhesive sheet 5 in contact with the adhesive sheet 5. As mentioned above, the primer 4 is made of polyurethane resin or the like, and improves the adhesion between the IC module 3 and the adhesive sheet 5 made of unsaturated polyester or the like.

Next, the IC module 3 is determined by the image sensor 45 whether the D direction of the IC module 3 is correctly facing outward, and then reaches the position of the module moving device 26 (FIGS. 1 and 5). . Image sensor 4
The determination based on No. 5 is necessary in order to mount the IC module 3 on the card 2 in the recess 2a in the correct direction as described later. Therefore, when it is determined by the image sensor 45 that the direction of the IC module 3 is wrong, this abnormality signal is input to the main controller 80, and the module table 12 is immediately stopped. At the same time, the main controller 80 displays this abnormal condition.

Next, the module transfer device 26 transfers the IC module 3 on the module table 12 to the module table 1.
Two lateral nests 62a, 62b.

62c. The transfer device 26 uses a suction unit (not shown) to suction and hold the part of the back surface of the IC module 3 on which the primer is not applied, and the nests 62a, 6
2b and 62C.

The primer 4 applied to the IC module 3 can be dried during the sequential transfer to the nests 62a, 62b, and 62c in this manner.

Next, the IC module 3 that has reached the final nest 62c is reversed by 180 degrees by the reversing device 24 and sent to the module supplying device 25 side with the front side facing upward. continue,
The IC module 3 with its front side facing upward is held by suction by the module supply section 25a of the module supply device 25. In this state, the module supply section 25a
moves toward the assembly table 14, and the IC module 3 is mounted in the recess 2a of the card 2 on the assembly table 14 (FIGS. 1 and 4). In this case, IC module 3
This is because the IC module 3 has been inspected in advance by the image sensor 45, and the IC module 3 is mounted with the C direction facing outward from the card 2.

On the other hand, the card 2 stored in the card stocker 38 and having the recess 2a formed in advance is held by suction by one leg 36g of the card supply/discharge device 36. When the card supply/discharge device 36 rotates clockwise about the rotation shaft 37, the card 2 is sucked into the leg 36a.
is placed on the assembly table 14.

Next, the card 2 is checked by a recess inspection device 46 to determine whether the recess 2a is previously formed in a regular shape.
Figures 1 and 2). If it is determined that the concave portion 2a is not formed in a regular shape, this abnormality signal is input to the main controller 80. In this case, the main controller 80
stores a card 2 in which the concave portion 2a does not have a regular shape, and also stops the module supply device 25 from supplying the IC module 3 to this card 2.

The card 2 then reaches the adhesive sheet supply device 28.

In the adhesive sheet supply device 28 , the strip-shaped adhesive sheet supplied from the supply roll 58 is punched into a predetermined shape by the punching die of the adhesive sheet supply section 56 , and the punched contact sheet 5 is passed through the suction section of the adhesive sheet supply section 56 . It is retained by adsorption. In this state, the adhesive sheet supply unit 56 is moved horizontally by the XY robot 54, and the adhesive sheet 5 is placed in the recess 2a of the card 2 (see FIGS. 1 and 3).
figure).

The shape of the adhesive sheet 5 is such that it is placed on the intermediate step 7 of the recess 2a of the card 2.

Further, the band-shaped adhesive sheet after being punched out is placed on a winding roll 5.
It is wound up on the second side.

Next, the card 2 with the adhesive sheet 5 placed inside the recess 2a
is sent to the module supply device 25, and the module supply device i! is sent to the module supply device 25 as described above. ff125, the IC module 3 with its surface facing upward is attached to the adhesive sheet 5 in the recess 2a.
(Figs. 1 and 4).

Next, the card 2 with the IC modular 3 attached thereto is transferred to the thermal bonding device 30. Then, the heating rod of the thermal bonding device 30 heats and presses the IC module 3 from above (150
℃ 5 seconds). In this case, the adhesive sheet 5 is melted, the IC module 3 is fixed in the recess 2a of the card 2, and the IC card 1 is assembled in this way.

Subsequently, the IC module 3 fixed in the recess 2a is
It comes into contact with the metal rod of the cooling device 32 and is cooled. at the same time,
The cooling device 32 determines whether the heights of the surface of the card 2 and the surface of the IC module 3 match.

The height is determined by the cooling device 32 as follows. That is, the electric linear gauge measurement element attached coaxially with the cooling device 32 comes into contact with the surface of the card 2 first, and the metal rod comes into contact with the terminal surface of the IC module 3. The unevenness of the IC module terminal from the surface of the card 2 is measured by measuring the amount of movement during that time using a gauge.

If the heights of the front surface of the card 2 and the surface of the Ic module 3 do not match, this abnormal signal is input to the main controller 80, and the main controller 80 stores the card 2 whose heights do not match.

Next, the IC card l is transferred to the peel inspection device 34,
Here, the peeling of the IC module 3 from the card 2 is inspected, that is, it is inspected whether the IC module 3 is securely fixed in the recess 2a.

If it is determined that the IC module 3 is not securely fixed, this abnormality signal is manually sent to the main controller 80.

At the same time, the peeling inspection device 34 of the assembly table 14 and the
The defective IC card 1 and the defective card 2 are discharged to the outside by the NG discharge device 35 located on the circumference based on the information stored in the main control device 80.

In other words, the card 2 and the cooling device 32 for which the recess inspection device 46 determines that the recess 2a is not properly formed
IC cards 1 whose heights are determined to be mismatched by Zugi NG discharge device 3
5 and is discharged to the outside. Subsequently, the IC card 1 determined to be a good product is discharged to the discharge conveyor 40 side by the card feeding/discharging device 36.

As described above, according to this embodiment, the module table 12
If it is determined that the front and back sides and orientation of the placed IC module 3 are abnormal, this abnormality is immediately displayed from the main controller 80 and the module table is stopped, so that the corresponding IC module 3 can be placed in the correct position. You can do it again. Therefore, the expensive IC module 3 can be effectively used without being assembled defectively. Further, in the assembly table 14, cards 2 with defective card recess shapes and defective assembled IC cards 1 are discharged to the outside by the NG discharge device 35, thereby improving the product accuracy of the IC cards 1. be able to. In addition, if the shape of the recess 2a of the card 2 is defective,
Since the supply of the C module 3 is stopped, the expensive IC module 3 is not wasted.

〔Effect of the invention〕

As described above, according to the present invention, by removing an IC card whose IC module is determined not to be securely fixed in the recess, it is possible to improve the product accuracy of the IC card.

[Brief explanation of the drawing]

FIG. 1 is a schematic system diagram of an IC card assembly apparatus according to the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a sectional view taken along the line ■-■ in FIG. Figure 4 is Figure 1 IV-
5 is a sectional view taken along the line V-V in FIG. 1, FIG. 6 is a plan view of the IC card assembly device, and FIG. 7 is a sectional view of the IC card. DESCRIPTION OF SYMBOLS 1... IC card, 2... Card, 2a... Recessed part, 3... IC module, 4... Primer, 5...
・Adhesive sheet, 12...Module table, 14・
... Assembly table, 22 ... Primer coating device, 24
... Reversing device, 25 ... Module supply device, 28
... Adhesive sheet supply device, 30 ... Heat bonding device, 32
···Cooling system. 34... Peeling inspection device, 35... NG discharge device, 4
5... Image sensor, 46... Recess inspection device, 7
0... Front/back discrimination device, 80... Main control device. Applicant's agent Mr. Sato

Claims (3)

[Claims] 1. IC modules with their back sides facing upward are sequentially arranged and rotated, and a module table applies a primer to the IC modules, and a card in which a recess is formed in advance is sequentially arranged and rotated to fill the recess of the card. an assembly table for sequentially mounting an adhesive sheet and the IC modules with the front side facing upward and heating and pressing the IC modules; and a peeling test for performing a peel inspection of the IC module fixed in the recess on the assembly table. An IC card assembly device characterized by being equipped with an inspection device. 2. 2. The IC card assembly apparatus according to claim 1, wherein the assembly table is provided with a recess device for inspecting the presence or absence of a recess in the card. 3. 2. The IC card assembling apparatus according to claim 1, wherein the module table is provided with a front/back discriminating device for discriminating front/back sides of the IC module.