JPH0462986A - Metal base wiring board with resistor - Google Patents
Metal base wiring board with resistorInfo
- Publication number
- JPH0462986A JPH0462986A JP17275190A JP17275190A JPH0462986A JP H0462986 A JPH0462986 A JP H0462986A JP 17275190 A JP17275190 A JP 17275190A JP 17275190 A JP17275190 A JP 17275190A JP H0462986 A JPH0462986 A JP H0462986A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit
- resistor
- resistance
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 49
- 239000002184 metal Substances 0.000 title claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 238000009966 trimming Methods 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 239000011888 foil Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、機械工業や電気・電子機器工業などの分野に
おいて半導体素子等を搭載して用いられる抵抗付き金属
ベース配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal base wiring board with a resistor, which is used in the fields of machinery industry, electric/electronic equipment industry, etc. by mounting semiconductor elements and the like.
セラミックス配線板の場合、酸化ルテニウム系の抵抗ペ
ーストをセラミックス基板上に印刷し、抵抗を形成後レ
ーザやサンドブラスト等でトリミングを行い、抵抗調整
することが一般的に行われている。In the case of ceramic wiring boards, it is common practice to print a ruthenium oxide-based resistance paste on a ceramic substrate, form a resistance, and then perform trimming using a laser, sandblasting, etc. to adjust the resistance.
一方、金属ベース配線板に抵抗を形成する方法として、
特開昭５０−３６５号公報や特開昭５９２２０９８７号
公報に示されているように、樹脂系の抵抗ペーストを金
属ベース上に設けられた絶縁層上に印刷する方法がある
。また、特開昭５１−１２９６７７号公報や特開昭６３
−３０８９９５号公報に示されているように金属ベース
上に設けられた絶縁層上に、めっき法やスパッタ法で形
成した金属薄層を抵抗として用いる方法がある。On the other hand, as a method of forming a resistor on a metal-based wiring board,
As shown in Japanese Unexamined Patent Publications No. 50-365 and No. 59220987, there is a method of printing a resin-based resistance paste on an insulating layer provided on a metal base. Also, JP-A-51-129677 and JP-A-63
As shown in Japanese Patent No. 308995, there is a method in which a thin metal layer formed by plating or sputtering is used as a resistor on an insulating layer provided on a metal base.
しかし、従来の樹脂、樹脂とガラス布、樹脂と無機フィ
ラー、樹脂とアルミナペーパ等を絶縁層に用いた金属ベ
ース配線板の場合、特開昭５０３６５号公報、特開昭５
９−２２０９８７号公報、特開昭５１−１２９６７７号
公報、特開昭６３３０８９９５号公報等に示される方法
では、絶縁層上に抵抗を形成することはできるものの、
形成された抵抗をセラミックス配線板において一般的手
法であるトリミングを用いて抵抗値調整をすると、絶縁
層が傷つき、回路と金属ベース間の耐電圧が低下すると
いう問題があった。このため、金属ベース配線板に実際
に抵抗回路が形成されることは少なく、また、抵抗回路
を形成したとしてもトリミングを行うことができないた
め、高精度な抵抗値を得ることができず、実用的でなか
った。However, in the case of conventional metal-based wiring boards using resin, resin and glass cloth, resin and inorganic filler, resin and alumina paper, etc. for the insulating layer, Japanese Patent Laid-Open No. 50365,
Although the methods disclosed in JP-A No. 9-220987, JP-A-51-129677, JP-A-63308995, etc. can form a resistor on an insulating layer,
If the resistance value of the formed resistor is adjusted by trimming, which is a common method for ceramic wiring boards, there is a problem in that the insulating layer is damaged and the withstand voltage between the circuit and the metal base is reduced. For this reason, it is rare that a resistor circuit is actually formed on a metal-based wiring board, and even if a resistor circuit is formed, it cannot be trimmed, making it impossible to obtain highly accurate resistance values, making it difficult to put it into practical use. It wasn't on point.
本発明は、トリミングにより抵抗回路の抵抗値調整をす
ることが可能であり、高精度な抵抗値を有する抵抗付き
金属ベース配線板を提供するものである。The present invention provides a metal base wiring board with a resistor that allows the resistance value of a resistor circuit to be adjusted by trimming and has a highly accurate resistance value.
〔課題を解決するための手段〕
本発明者は前記課題を解決するために鋭意研究を重ねた
結果、特定の絶縁層を有する金属ベース配線板に抵抗回
路を形成することにより、その目的が達成されることを
見出し、この知見に基づいて本発明を完成するに至った
。[Means for Solving the Problems] As a result of extensive research in order to solve the above problems, the inventor of the present invention has achieved the object by forming a resistance circuit on a metal base wiring board having a specific insulating layer. Based on this knowledge, the present invention was completed.
すなわち本発明は、金属板、該金属板上に設けられた絶
縁樹脂層、該絶縁樹脂層上に設けられたセラミックス層
並びに該セラミックス層上に設けられた導体回路及び抵
抗回路からなることを特徴とする抵抗付き金属ベース配
線板を提供するものである。That is, the present invention is characterized by comprising a metal plate, an insulating resin layer provided on the metal plate, a ceramic layer provided on the insulating resin layer, and a conductor circuit and a resistance circuit provided on the ceramic layer. The present invention provides a metal base wiring board with a resistor.
以下、第１図を用いて本発明の説明を行なう。The present invention will be explained below using FIG.
第１図は、本発明の抵抗付き金属ベース配線板の一例の
部分断面を表す斜視図である。FIG. 1 is a perspective view showing a partial cross section of an example of a metal base wiring board with a resistor according to the present invention.
この抵抗付き金属ベース配線板は金属板１、金属板１上
に設けられた絶縁樹脂層２、絶縁樹脂層２上に設けられ
たセラミックス層３並びにセラミックス層３上に設けら
れた導体回路４及び抵抗回路５からなる。This metal base wiring board with a resistor includes a metal plate 1, an insulating resin layer 2 provided on the metal plate 1, a ceramic layer 3 provided on the insulating resin layer 2, and a conductor circuit 4 provided on the ceramic layer 3. It consists of a resistance circuit 5.
セラミックス層３は、絶縁樹脂Ｎ２が抵抗回路５の抵抗
値調整のためのトリミングによって傷つくことを防いで
いる。また、絶縁樹脂層２は、金属板１とセラミックス
層３との接着を担っている。The ceramic layer 3 prevents the insulating resin N2 from being damaged by trimming for adjusting the resistance value of the resistance circuit 5. Furthermore, the insulating resin layer 2 serves to bond the metal plate 1 and the ceramic layer 3 together.
このように、絶縁層を絶縁樹脂層２とセラミックス層３
の２層構造とすることにより、耐トリミング性と接着性
の役割を各層に分担することができる。このため、比較
的低価格で耐トリミング性と接着性とを兼ね備えた抵抗
付金属ベース配線板を製造することが可能である。In this way, the insulating layer is divided into the insulating resin layer 2 and the ceramic layer 3.
By having a two-layer structure, the roles of trimming resistance and adhesiveness can be shared between each layer. Therefore, it is possible to manufacture a metal base wiring board with a resistor that has both trimming resistance and adhesiveness at a relatively low cost.
セラミックス層３の厚さとしては、耐トリミング性の点
から２５μｍ以上が望ましく、より望ましくは５０μｍ
以上である。また、生産性や配線板加工時の切断性等の
点から３００μｍ以下が望ましく、より望ましくは１５
０μｍ以下である。The thickness of the ceramic layer 3 is preferably 25 μm or more from the viewpoint of trimming resistance, and more preferably 50 μm.
That's all. In addition, from the viewpoint of productivity and cuttability during wiring board processing, the thickness is preferably 300 μm or less, and more preferably 15 μm or less.
It is 0 μm or less.
また、このように薄いセラミックス層の形成には溶射が
適している。溶射材料としてはアルミナ、ムライト等の
電気絶縁性に優れたセラミックスが適している。Further, thermal spraying is suitable for forming such a thin ceramic layer. Ceramics with excellent electrical insulation properties, such as alumina and mullite, are suitable as thermal spraying materials.
また、絶縁樹脂層２の厚さとしては、特に制限はないが
、１０μｍ以上で、２００μｍ以下とすることが一般的
である。また、絶縁樹脂材料としては、特に制限はなく
、例えば、エポキシ系樹脂、ポリイミド系樹脂、フェノ
ール系樹脂等の電気絶縁性に優れた材料が挙げられる。Further, the thickness of the insulating resin layer 2 is not particularly limited, but is generally 10 μm or more and 200 μm or less. The insulating resin material is not particularly limited, and examples include materials with excellent electrical insulation such as epoxy resins, polyimide resins, and phenol resins.
更に、必要に応じて上記の絶縁樹脂に無機フィラーを添
加したり、上記の絶縁樹脂とガラス布とを複合したりア
ルミナベーパとを複合したりなどしてもよい。Furthermore, if necessary, an inorganic filler may be added to the above insulating resin, or the above insulating resin may be combined with glass cloth or alumina vapor.
上記のセラミックス層３と！！！！総樹脂層２の２層構
造からなる絶縁層は金属板１上に設けられているが、金
属板１として使用できる金属としては、鉄、アルミニウ
ム、銅、４２合金等が挙げられ、はとんどの金属、合金
を使用することができる。With the ceramic layer 3 above! ! ! ! An insulating layer consisting of a two-layer structure of a total resin layer 2 is provided on the metal plate 1. Metals that can be used as the metal plate 1 include iron, aluminum, copper, 42 alloy, etc. Any metal or alloy can be used.
また、金属板１として銅／インバー／銅のような複層金
属板も使用できる。４２合金、インバー等の金属からな
る金属板や銅／インバー／銅の複層金属板のように熱膨
張張係数がｌ０ＸＩＯ−６／”Ｃ以下の金属板１を用い
ると、得られる基板の抵抗温度係数が小さくなり、基板
上に設けられた抵抗回路の抵抗値が温度変化に対し安定
化して望ましい。Moreover, a multilayer metal plate such as copper/invar/copper can also be used as the metal plate 1. If a metal plate 1 having a coefficient of thermal expansion of 10XIO-6/''C or less, such as a metal plate made of a metal such as 42 alloy or Invar or a multilayer metal plate of copper/Invar/copper, is used, the resistance of the resulting substrate will be It is desirable that the temperature coefficient becomes small and the resistance value of the resistance circuit provided on the substrate becomes stable against temperature changes.
上記の２層構造の絶縁層と金属板１からなる基板には、
絶縁層のセラミックス層３表面に導体回路４と抵抗回路
５が形成されている。The substrate consisting of the above-mentioned two-layer structure insulating layer and metal plate 1 includes:
A conductor circuit 4 and a resistance circuit 5 are formed on the surface of the ceramic layer 3, which is an insulating layer.
導体回路４としては、めっき、導体ペースト印刷等公知
の各種の方法で作製したものなどを好適に使用すること
ができる。銅箔から形成されたものも好適である。As the conductor circuit 4, those produced by various known methods such as plating and conductor paste printing can be suitably used. Also suitable are those formed from copper foil.
抵抗回路５は、樹脂系抵抗ペースト、抵抗めっき又は抵
抗箔のうちのいずれかによって形成されていることが好
ましい。It is preferable that the resistance circuit 5 is formed of one of resin-based resistance paste, resistance plating, or resistance foil.
抵抗回路５の形成法としては、樹脂系抵抗ペーストを印
刷する方法、ニッケル等の比較的抵抗値の高い金属をめ
っきする抵抗めっき法、ニッケル箔やニッケルクロム合
金箔等の抵抗箔を用いて接着する方法等が適している。The resistance circuit 5 can be formed by printing a resin-based resistance paste, by plating a metal with a relatively high resistance value such as nickel, or by bonding using a resistance foil such as nickel foil or nickel-chromium alloy foil. A suitable method is to do so.
抵抗箔を用いる場合、導体回路４も同時に形成するため
に銅等の導体金属と抵抗材料との複合箔を用い選択エツ
チングによって抵抗回路と導体回路を得ても良い。When a resistive foil is used, a composite foil of a conductive metal such as copper and a resistive material may be used to form the conductive circuit 4 at the same time, and the resistive circuit and conductive circuit may be obtained by selective etching.
また、抵抗回路５の抵抗値はトリミングにより調整され
ていることが好ましい。Further, it is preferable that the resistance value of the resistance circuit 5 is adjusted by trimming.
抵抗回路５のトリミングは公知のレーザやサンドブラス
ト等を用いる方法により行うことができる。Trimming of the resistor circuit 5 can be performed by a known method using a laser, sandblasting, or the like.
本発明の抵抗付き金属ベース配線板の作製方法としては
、例えば、銅箔にセラミックスを溶射した後、得られた
セラミラス溶射層付き銅箔のセラミックス溶射層上に金
属板を樹脂を介して積層接着し、次いで銅箔をエツチン
グにより回路形成し、その後銅回路の所望の位置に抵抗
ペーストを印刷し必要に応じトリミングして抵抗回路を
形成する方法が挙げられる。この場合、所望に応じ、抵
抗ペーストと上記のように形成した銅回路との接着性を
良くするため、銅回路表面の少なくとも一部を酸化処理
等により粗面化するなどの表面処理を行うことや、ある
いは、銅回路と抵抗ペーストとの間に導体ペースト部分
を設けることなどができる。As a method for producing a metal base wiring board with a resistor of the present invention, for example, after thermally spraying ceramics on a copper foil, a metal plate is laminated and bonded via a resin on the ceramics sprayed layer of the obtained copper foil with a ceramics sprayed layer. There is a method in which a circuit is then formed by etching the copper foil, and then a resistor paste is printed at a desired position of the copper circuit and trimmed as necessary to form a resistor circuit. In this case, if desired, in order to improve the adhesion between the resistor paste and the copper circuit formed as described above, surface treatment such as roughening at least a part of the copper circuit surface by oxidation treatment etc. may be performed. Alternatively, a conductive paste portion may be provided between the copper circuit and the resistive paste.
このように、セラミックス溶射層を付けた銅箔を用いて
、これを金属板等と積層し加熱加圧接着すると、銅回路
の表面を平滑にすることができる。In this way, by using a copper foil coated with a ceramic sprayed layer, laminating it with a metal plate, etc., and bonding it under heat and pressure, the surface of the copper circuit can be made smooth.
このため、印刷抵抗の膜厚を一定化しやすく、予め目標
値に近い抵抗値を有する抵抗回路を形成することができ
、このものをトリミングすることにより、抵抗回路の抵
抗値の高精度化を図ることができる。Therefore, it is easy to keep the film thickness of the printed resistor constant, and a resistor circuit having a resistance value close to the target value can be formed in advance, and by trimming this, the resistance value of the resistor circuit can be highly accurate. be able to.
なお、本発明の抵抗付き金属ベース配線板には、金属板
の両面に上記の絶縁層等を設け、公知の方法でスルーホ
ールを形成したものも含まれる。Note that the metal base wiring board with a resistor of the present invention includes one in which the above-mentioned insulating layer or the like is provided on both sides of a metal plate and through holes are formed by a known method.
本発明では、絶縁層の一部に樹脂よりも耐熱温度、硬度
ともに優れたセラミックス層を設けることにより、絶縁
層を傷付けることなく、レーザやサンドブラスト等によ
る抵抗の１−リミングが可能となり、高精度な抵抗値を
得ることができるようになった。In the present invention, by providing a ceramic layer that has superior heat resistance and hardness than resin in a part of the insulating layer, it is possible to perform 1-rimming of the resistance by laser, sandblasting, etc. without damaging the insulating layer, resulting in high precision. It is now possible to obtain a resistance value of
実施例
厚さ５０μｍのアルミナ層を溶射した銅箔のアルミナ層
上にエポキシ樹脂ワニスを塗布・乾燥し、厚さ５０μｍ
のエポキシ樹脂層とした。このものと厚さ１ｍｍの銅板
とをエポキシ樹脂層と銅板とが接するように加圧加熱に
よって接着し、ｗ板を１１製した。次いで、エツチング
法にて銅箔を加工し、銅回路を形成した。更に銅回路の
所定位置に抵抗ペーストを印刷・乾燥して５つの抵抗を
形成し、抵抗付き金属ベース配線板を得た。各抵抗の抵
抗値を測定したところ、低い方から８５．８７．８８．
９２．９５Ωであった。Example: A 50 μm thick alumina layer was sprayed onto the alumina layer of copper foil, and then an epoxy resin varnish was applied and dried to a thickness of 50 μm.
It was made into an epoxy resin layer. This material was bonded to a 1 mm thick copper plate by pressure heating so that the epoxy resin layer and the copper plate were in contact with each other, thereby producing 11 W plates. Next, the copper foil was processed using an etching method to form a copper circuit. Furthermore, five resistors were formed by printing and drying a resistor paste at predetermined positions on the copper circuit, thereby obtaining a metal base wiring board with resistors. When we measured the resistance value of each resistor, it was 85.87.88 from the lowest.
It was 92.95Ω.
次に、これらの抵抗を１００±２Ωになるようにレーザ
でトリミングを行なった。この後、この配線板の耐電圧
性を調べるため配線板の回路面と銅板面間に電圧をかけ
て耐電圧を測定したところ、２ＫＶ以上であり、トリミ
ングにより絶縁層が傷つけられることなく、十分な耐電
圧性を保っていた。Next, these resistors were trimmed with a laser to a value of 100±2Ω. After this, in order to check the voltage resistance of this wiring board, a voltage was applied between the circuit surface of the wiring board and the copper plate surface, and the voltage resistance was measured, and it was found to be over 2KV, and the insulation layer was not damaged by trimming. It maintained high voltage resistance.
符号の説明
１ 金属板 ２ 絶縁樹脂層３ セラミ
ックス層 ４ 導体回路５ 抵抗回路
６ トリミング部比較例
一方、アルミナ層のない銅箔を用いて実施例と同様の試
験を行ったところ、トリミング後の耐電圧が０．５〜Ｉ
ＫＶとなり、トリミング前の２ＫＶ以上の耐電圧に対し
大幅な低下がみられた。Explanation of symbols 1 Metal plate 2 Insulating resin layer 3 Ceramic layer 4 Conductor circuit 5 Resistance circuit
6 Comparative example of trimmed part On the other hand, when a test similar to the example was conducted using copper foil without an alumina layer, the withstand voltage after trimming was 0.5 to I
KV, which was a significant decrease from the withstand voltage of 2KV or more before trimming.
Claims (4)
縁樹脂層上に設けられたセラミックス層並びに該セラミ
ックッス層上に設けられた導体回路及び抵抗回路からな
ることを特徴とする抵抗付き金属ベース配線板。1. A metal with a resistor, comprising a metal plate, an insulating resin layer provided on the metal plate, a ceramic layer provided on the insulating resin layer, and a conductor circuit and a resistance circuit provided on the ceramic layer. base wiring board.
る請求項１記載の抵抗付き金属ベース配線板。2. 2. The metal base wiring board with a resistor according to claim 1, wherein the resistance value of the resistor circuit is adjusted by trimming.
下の溶射層である請求項１又は２記載の抵抗付き金属ベ
ース配線板。3. 3. The metal base wiring board with a resistor according to claim 1, wherein the ceramic layer is a sprayed layer having a thickness of 25 μm or more and 300 μm or less.
抵抗箔のうちのいずれかによって形成されている請求項
１、２又は３記載の抵抗付き金属ベース配線板。4. 4. A metal base wiring board with a resistor according to claim 1, wherein the resistor circuit is formed of any one of resin-based resistor paste, resistor plating, or resistor foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2172751A JP2790903B2 (en) | 1990-07-02 | 1990-07-02 | Metal base wiring board with resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2172751A JP2790903B2 (en) | 1990-07-02 | 1990-07-02 | Metal base wiring board with resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0462986A true JPH0462986A (en) | 1992-02-27 |
| JP2790903B2 JP2790903B2 (en) | 1998-08-27 |
Family
ID=15947651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2172751A Expired - Lifetime JP2790903B2 (en) | 1990-07-02 | 1990-07-02 | Metal base wiring board with resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2790903B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008089161A (en) * | 2006-10-05 | 2008-04-17 | Bridgestone Flowtech Corp | Coupling and manufacturing method of coupling |
| JP2010021434A (en) * | 2008-07-11 | 2010-01-28 | Denka Agsp Kk | Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01290279A (en) * | 1988-05-18 | 1989-11-22 | Hitachi Chem Co Ltd | Wiring board and manufacture thereof |
| JPH0254780A (en) * | 1988-08-18 | 1990-02-23 | Nkk Corp | Ceramics-coated steel sheet |
-
1990
- 1990-07-02 JP JP2172751A patent/JP2790903B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01290279A (en) * | 1988-05-18 | 1989-11-22 | Hitachi Chem Co Ltd | Wiring board and manufacture thereof |
| JPH0254780A (en) * | 1988-08-18 | 1990-02-23 | Nkk Corp | Ceramics-coated steel sheet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008089161A (en) * | 2006-10-05 | 2008-04-17 | Bridgestone Flowtech Corp | Coupling and manufacturing method of coupling |
| JP2010021434A (en) * | 2008-07-11 | 2010-01-28 | Denka Agsp Kk | Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2790903B2 (en) | 1998-08-27 |
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