JPH046198Y2 - - Google Patents

Info

Publication number

JPH046198Y2

JPH046198Y2 JP1985126303U JP12630385U JPH046198Y2 JP H046198 Y2 JPH046198 Y2 JP H046198Y2 JP 1985126303 U JP1985126303 U JP 1985126303U JP 12630385 U JP12630385 U JP 12630385U JP H046198 Y2 JPH046198 Y2 JP H046198Y2

Authority

JP

Japan

Prior art keywords

metal cap

hole

capacitor element

adhesive

heat

Prior art date

1985-08-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003990 capacitor Substances 0.000 claims description 59
• 239000002184 metal Substances 0.000 claims description 50
• 229910052751 metal Inorganic materials 0.000 claims description 50
• 239000000853 adhesive Substances 0.000 claims description 31
• 230000001070 adhesive effect Effects 0.000 claims description 31
• 238000004804 winding Methods 0.000 claims description 31
• 229910000679 solder Inorganic materials 0.000 claims description 9
• 239000011104 metalized film Substances 0.000 claims description 8
• 238000007747 plating Methods 0.000 claims description 7
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
• 229910052709 silver Inorganic materials 0.000 claims description 3
• 239000004332 silver Substances 0.000 claims description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 229910052802 copper Inorganic materials 0.000 claims description 2
• 239000010949 copper Substances 0.000 claims description 2
• 229910052759 nickel Inorganic materials 0.000 claims description 2
• 238000000034 method Methods 0.000 description 7
• 239000004020 conductor Substances 0.000 description 5
• 239000002245 particle Substances 0.000 description 3
• 239000004033 plastic Substances 0.000 description 3
• 238000005476 soldering Methods 0.000 description 3
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 230000007423 decrease Effects 0.000 description 2
• 238000005516 engineering process Methods 0.000 description 2
• 239000010408 film Substances 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 239000002923 metal particle Substances 0.000 description 2
• 238000001465 metallisation Methods 0.000 description 2
• 239000007921 spray Substances 0.000 description 2
• 239000000126 substance Substances 0.000 description 2
• 238000003466 welding Methods 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 1
• 239000004642 Polyimide Substances 0.000 description 1
• 239000004826 Synthetic adhesive Substances 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 230000000149 penetrating effect Effects 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920000728 polyester Polymers 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 230000002265 prevention Effects 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 238000005507 spraying Methods 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1