JPH0460790B2 - - Google Patents

Info

Publication number
JPH0460790B2
JPH0460790B2 JP15671886A JP15671886A JPH0460790B2 JP H0460790 B2 JPH0460790 B2 JP H0460790B2 JP 15671886 A JP15671886 A JP 15671886A JP 15671886 A JP15671886 A JP 15671886A JP H0460790 B2 JPH0460790 B2 JP H0460790B2
Authority
JP
Japan
Prior art keywords
blasting
grains
abrasive
frozen
raw material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15671886A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6316972A (ja
Inventor
Sekiji Imaike
Hiroyuki Oora
Takeki Tai
Norio Yamazaki
Hayaaki Fukumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Sanso Co Ltd
Mitsubishi Electric Corp
Original Assignee
Taiyo Sanso Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Sanso Co Ltd, Mitsubishi Electric Corp filed Critical Taiyo Sanso Co Ltd
Priority to JP15671886A priority Critical patent/JPS6316972A/ja
Publication of JPS6316972A publication Critical patent/JPS6316972A/ja
Publication of JPH0460790B2 publication Critical patent/JPH0460790B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00Selection of abrasive materials or additives for abrasive blasts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
JP15671886A 1986-07-03 1986-07-03 プラスト用砥粒 Granted JPS6316972A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15671886A JPS6316972A (ja) 1986-07-03 1986-07-03 プラスト用砥粒

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15671886A JPS6316972A (ja) 1986-07-03 1986-07-03 プラスト用砥粒

Publications (2)

Publication Number Publication Date
JPS6316972A JPS6316972A (ja) 1988-01-23
JPH0460790B2 true JPH0460790B2 (enrdf_load_stackoverflow) 1992-09-29

Family

ID=15633820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15671886A Granted JPS6316972A (ja) 1986-07-03 1986-07-03 プラスト用砥粒

Country Status (1)

Country Link
JP (1) JPS6316972A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101682097B1 (ko) * 2014-08-26 2016-12-02 주식회사 케이씨텍 연마 슬러리 조성물

Also Published As

Publication number Publication date
JPS6316972A (ja) 1988-01-23

Similar Documents

Publication Publication Date Title
US4932168A (en) Processing apparatus for semiconductor wafers
US5009240A (en) Wafer cleaning method
US5827114A (en) Slurry blasting process
US6520837B2 (en) Method and apparatus for ultrafine grinding and/or mixing of solid particles
DE3937221A1 (de) Reinigungsvorrichtung fuer festkoerperoberflaechen
DE102020000018A1 (de) Verfahren und Vorrichtung zur Fertigung eines kryogen-mechanisch wirkenden Strahlmittels, sowie Verfahren und Vorrichtung zum Reinigen von Bauteilen mit dem kryogen-mechanisch wirkenden Strahlmittel
JPH0460790B2 (enrdf_load_stackoverflow)
US5114748A (en) Method of preparing or rubbing a substrate to be used in a lcd device by spraying it with uniformly sized droplets or frozen water
JPS58124528A (ja) 昇華性物質の球状化物、その製法及び製造装置
EP0990711B1 (de) Bearbeitung von mittels thermischen Spritzens zu beschichtender Oberflächen
EP0234365A1 (de) Einrichtung zur abrasiven Oberflächenbehandlung
US4781754A (en) Rapid solidification of plasma sprayed magnetic alloys
KR20010061607A (ko) 반도체 장비 세정 장치 및 방법
JPS6115749A (ja) ドライアイスによる樹脂の低温粉砕装置の洗浄法
JPS63300867A (ja) 砥粒およびそれを用いた表面処理方法
JP2004181334A (ja) 洗浄材製造方法及びその製造装置並びにこれを使用する洗浄システム
JPS60138008A (ja) 金属粉末の製造方法
RU2284231C2 (ru) Установка для очистки поверхностей
JPH081345B2 (ja) 超微細凍結粒子の生成装置
CA2150883C (en) Process for cooling liquid melt during thermal waste treatment
JPH0696226B2 (ja) 超微凍結粒の製造噴射装置
JPS5934143B2 (ja) 溶滓の冷却装置
JPH0757471B2 (ja) 凍結粒噴射装置
JPS62120978A (ja) 氷粒を噴射するクリ−ニング装置
JPH06181689A (ja) 液状物の凍結顆粒生成方法とその装置

Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

LAPS Cancellation because of no payment of annual fees
R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350