JPH0459948U - - Google Patents

Info

Publication number
JPH0459948U
JPH0459948U JP10397190U JP10397190U JPH0459948U JP H0459948 U JPH0459948 U JP H0459948U JP 10397190 U JP10397190 U JP 10397190U JP 10397190 U JP10397190 U JP 10397190U JP H0459948 U JPH0459948 U JP H0459948U
Authority
JP
Japan
Prior art keywords
pellet
semiconductor
package
encapsulated
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10397190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10397190U priority Critical patent/JPH0459948U/ja
Publication of JPH0459948U publication Critical patent/JPH0459948U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例のアイランドに半導
体ICペレツトを搭載した要部平面図、第2図は
第1図の半導体ICペレツトを他の種類の一例の
モールドIC用パツケージのアイランドに搭載し
た要部平面図、第3図は従来のZIP型のモール
ドIC用パツケージの一例のアイランドに半導体
ICペレツトを搭載した要部平面図である。 1,11……半導体ICペレツト、2……パツ
ド、3……アイランド、4……リード、5……吊
りピン、6……ボンデイングワイヤ。
Figure 1 is a plan view of the main part of a semiconductor IC pellet mounted on an island according to an embodiment of the present invention, and Figure 2 is a diagram showing the semiconductor IC pellet shown in Figure 1 mounted on an island of another type of molded IC package. FIG. 3 is a plan view of a main part in which a semiconductor IC pellet is mounted on an island of an example of a conventional ZIP type molded IC package. 1, 11... Semiconductor IC pellet, 2... Pad, 3... Island, 4... Lead, 5... Hanging pin, 6... Bonding wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ICペレツトを樹脂封入するジグザグイ
ンラインパツケージ型のモールドIC用パツケー
ジにおいて、前記半導体ICペレツトを搭載する
アイランドを封入樹脂の側面に対して斜めに配置
し前記半導体ICペレツトを封入したことを特徴
とするモールドIC用パツケージ。
A zigzag in-line package type molded IC package in which a semiconductor IC pellet is encapsulated in resin, characterized in that an island on which the semiconductor IC pellet is mounted is arranged diagonally with respect to a side surface of the encapsulating resin, and the semiconductor IC pellet is encapsulated therein. Package cage for molded IC.
JP10397190U 1990-10-01 1990-10-01 Pending JPH0459948U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10397190U JPH0459948U (en) 1990-10-01 1990-10-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10397190U JPH0459948U (en) 1990-10-01 1990-10-01

Publications (1)

Publication Number Publication Date
JPH0459948U true JPH0459948U (en) 1992-05-22

Family

ID=31849061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10397190U Pending JPH0459948U (en) 1990-10-01 1990-10-01

Country Status (1)

Country Link
JP (1) JPH0459948U (en)

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