JPH0459948U - - Google Patents
Info
- Publication number
- JPH0459948U JPH0459948U JP10397190U JP10397190U JPH0459948U JP H0459948 U JPH0459948 U JP H0459948U JP 10397190 U JP10397190 U JP 10397190U JP 10397190 U JP10397190 U JP 10397190U JP H0459948 U JPH0459948 U JP H0459948U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- package
- encapsulated
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の一実施例のアイランドに半導
体ICペレツトを搭載した要部平面図、第2図は
第1図の半導体ICペレツトを他の種類の一例の
モールドIC用パツケージのアイランドに搭載し
た要部平面図、第3図は従来のZIP型のモール
ドIC用パツケージの一例のアイランドに半導体
ICペレツトを搭載した要部平面図である。
1,11……半導体ICペレツト、2……パツ
ド、3……アイランド、4……リード、5……吊
りピン、6……ボンデイングワイヤ。
Figure 1 is a plan view of the main part of a semiconductor IC pellet mounted on an island according to an embodiment of the present invention, and Figure 2 is a diagram showing the semiconductor IC pellet shown in Figure 1 mounted on an island of another type of molded IC package. FIG. 3 is a plan view of a main part in which a semiconductor IC pellet is mounted on an island of an example of a conventional ZIP type molded IC package. 1, 11... Semiconductor IC pellet, 2... Pad, 3... Island, 4... Lead, 5... Hanging pin, 6... Bonding wire.
Claims (1)
ンラインパツケージ型のモールドIC用パツケー
ジにおいて、前記半導体ICペレツトを搭載する
アイランドを封入樹脂の側面に対して斜めに配置
し前記半導体ICペレツトを封入したことを特徴
とするモールドIC用パツケージ。 A zigzag in-line package type molded IC package in which a semiconductor IC pellet is encapsulated in resin, characterized in that an island on which the semiconductor IC pellet is mounted is arranged diagonally with respect to a side surface of the encapsulating resin, and the semiconductor IC pellet is encapsulated therein. Package cage for molded IC.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10397190U JPH0459948U (en) | 1990-10-01 | 1990-10-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10397190U JPH0459948U (en) | 1990-10-01 | 1990-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0459948U true JPH0459948U (en) | 1992-05-22 |
Family
ID=31849061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10397190U Pending JPH0459948U (en) | 1990-10-01 | 1990-10-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0459948U (en) |
-
1990
- 1990-10-01 JP JP10397190U patent/JPH0459948U/ja active Pending