JPH0459898A - Detergent for flux - Google Patents
Detergent for fluxInfo
- Publication number
- JPH0459898A JPH0459898A JP17007890A JP17007890A JPH0459898A JP H0459898 A JPH0459898 A JP H0459898A JP 17007890 A JP17007890 A JP 17007890A JP 17007890 A JP17007890 A JP 17007890A JP H0459898 A JPH0459898 A JP H0459898A
- Authority
- JP
- Japan
- Prior art keywords
- polyoxyethylene
- alkyl group
- ether
- tank
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims description 15
- 239000003599 detergent Substances 0.000 title abstract description 4
- -1 polyoxyethylene Polymers 0.000 claims abstract description 36
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 21
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 239000012459 cleaning agent Substances 0.000 claims description 13
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 abstract description 13
- 235000014113 dietary fatty acids Nutrition 0.000 abstract description 8
- 229930195729 fatty acid Natural products 0.000 abstract description 8
- 239000000194 fatty acid Substances 0.000 abstract description 8
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 abstract description 6
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 abstract description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract description 4
- 150000005215 alkyl ethers Chemical class 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 abstract 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 abstract 1
- 229960003328 benzoyl peroxide Drugs 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- UJPKMTDFFUTLGM-UHFFFAOYSA-N 1-aminoethanol Chemical class CC(N)O UJPKMTDFFUTLGM-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 230000000779 depleting effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000002529 flux (metallurgy) Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 125000004971 nitroalkyl group Chemical group 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ハンダ接合時にハンダと基材との接合力を強
める為に塗布されるフラックスをハンダ接合後に除去す
る為の7ラツクス洗浄剤に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a 7lux cleaning agent for removing flux applied during soldering to strengthen the bonding force between the solder and the base material after soldering. .
従来、電気・電子産業分野では、プリント回路又はプリ
ント配線板製造工程において、ハンダと基材とを強固に
固着させる為に予めフラックスを塗布している。このフ
ラックスは、プリント回路又はプリント配線板に残存す
ると導電不良或は腐食の原因となる為、・通常、ハンダ
付は終了後には有機系洗浄剤によって、洗浄除去されて
いる。この洗浄剤として、従来からフロン113或はメ
チルクロロホルムが使用されてきている。これらの溶剤
はフラックスに対する溶解力が大きく、不燃性であるこ
とから広範囲に使用されている。Conventionally, in the field of electrical and electronic industries, flux is applied in advance in order to firmly bond solder and base material in the manufacturing process of printed circuits or printed wiring boards. If this flux remains on the printed circuit or printed wiring board, it will cause poor conductivity or corrosion. Therefore, after soldering is finished, it is usually cleaned and removed using an organic cleaning agent. Freon 113 or methyl chloroform has conventionally been used as this cleaning agent. These solvents have a great ability to dissolve flux and are nonflammable, so they are widely used.
しかし、社会的な環境問題に対する意識の高まりの中で
環境破壊性物質の大気及び水系への排出規制の動きが出
てきている。例えば、フロン系溶剤(特定フロン5種:
CFCl1、CFCl 2、CFCll3、CFCll
4、CFC115)やメチルクロロホルムは、オゾン層
破壊物質として、その使用が制限されつつある。However, as society's awareness of environmental issues increases, there is a movement to regulate the discharge of environmentally destructive substances into the atmosphere and water systems. For example, fluorocarbon solvents (5 types of specified fluorocarbons:
CFCl1, CFCl2, CFCll3, CFCll
The use of CFC115) and methyl chloroform is being restricted as they are ozone depleting substances.
かかる状況において、フロン113或はメチルクロロホ
ルムを使用している産業界では、−日も早く溶剤に代わ
るフラックス洗浄剤が求められているのが実状である。Under such circumstances, industries that use Freon 113 or methyl chloroform are in need of a flux cleaning agent that can replace the solvent as soon as possible.
本発明者らは、フラックス洗浄剤に用いられるフロン1
13或はメチルクロロホルムに代わる洗浄剤の研究を重
ねた結果、ノニオン系界面活性剤、及び一般式(I)
R,(OCm)n OR2(I)
(式中、nは1、2或は3を示し、nが1或は2の時、
mは2或は3、R2はH1炭素数1〜5のアルキル基或
はアセトキシル基を示し、R2はH1炭素数1〜5のア
ルキル基或はアセチル基を示す。The present inventors have discovered that Freon 1 used in flux cleaning agents.
13 or as a result of repeated research on detergents to replace methyl chloroform, nonionic surfactants and the general formula (I) R, (OCm)n OR2(I) (where n is 1, 2 or 3) and when n is 1 or 2,
m is 2 or 3, R2 represents H1 an alkyl group having 1 to 5 carbon atoms or an acetoxyl group, and R2 represents H1 an alkyl group having 1 to 5 carbon atoms or an acetyl group.
また、nが3の時、mは2或は3、R1はH1炭素数1
〜3のアルキル基或はアセトキシル基を示し、R2はH
1炭素数1〜3のアルキル基或はアセチル基を示す)で
表される物質の一種又は一種以上を必須成分として含む
組成物が、従来のフラックス洗浄剤(フロン113及び
メチルクロロホルム)に匹敵する程の高い洗浄性能及び
仕上がり性の良さを示す洗浄剤であることを見出し、こ
の知見に基づいて本発明をなすに至った。Also, when n is 3, m is 2 or 3, R1 is H1 carbon number 1
-3 alkyl group or acetoxyl group, R2 is H
A composition containing as an essential component one or more substances represented by an alkyl group or an acetyl group having 1 to 3 carbon atoms is comparable to conventional flux cleaning agents (Freon 113 and methyl chloroform). We have discovered that this is a cleaning agent that exhibits moderately high cleaning performance and good finish, and based on this knowledge, we have developed the present invention.
すなわち、本発明は、
(1) ノニオン系界面活性剤、及び(2)一般式(
1)
%式%()
(式中、nは1,2或は3を示し、nが1或は2の時、
mは2或は3、R1はH1炭素数1〜5のアルキル基或
はアセトキシル基を示し、R2はH1炭素数1〜5のア
ルキル基或はアセチル基を示す。That is, the present invention comprises (1) a nonionic surfactant, and (2) the general formula (
1) % formula %() (In the formula, n represents 1, 2 or 3, and when n is 1 or 2,
m is 2 or 3, R1 represents H1 an alkyl group having 1 to 5 carbon atoms or an acetoxyl group, and R2 represents H1 an alkyl group or acetyl group having 1 to 5 carbon atoms.
また、nが3の時、mは2或は3、R1はH1炭素数1
〜3のアルキル基或はアセトキシル基を示し、R2はH
1炭素数1〜3のアルキル基或はアセチル基を示す)
で表される物質の一種又は一種以上、
を必須成分として含むことを特徴とするフラックス洗浄
剤である。Also, when n is 3, m is 2 or 3, R1 is H1 carbon number 1
-3 alkyl group or acetoxyl group, R2 is H
This is a flux cleaning agent characterized by containing as an essential component one or more of the following substances (representing an alkyl group or acetyl group having 1 to 3 carbon atoms).
本発明に用いるノニオン系界面活性剤の濃度は、1〜3
0重量%の範囲にあることが好ましい。The concentration of the nonionic surfactant used in the present invention is 1 to 3.
Preferably, it is in the range of 0% by weight.
本発明に用いるノニオン系界面活性剤としては、例えば
、ポリオキシエチレンラウリルエーテル、ポリオキシエ
チレンセチルエーテル、ポリオキシエチレンステアリル
エーテル、ポリオキシエチレンオレイルエーテル等のポ
リオキシエチレンアルキルエーテル;ポリオキシエチレ
ンノニルフェニルエーテル、ポリオキシエチレンオクチ
ルフェニルエーテル等のポリオキシエチレンアルキルフ
ェニルエーテル;ポリオキシエチレンポリオキシプロピ
レンブロックポリマニ、ポリオキシソルビクン脂肪酸エ
ステル、ポリオキシエチレン脂肪酸エステル、ポリオキ
シエチレンアルキルアミン、ポリオキシエチレン脂肪酸
アミド等のポリオキシエチレン誘導体;ソルビタン脂肪
酸エステル、グリセリン脂肪酸エステル等が挙げられる
。これらはそれぞれ単独で用いることが可能であるが、
好ましくは、二種類以上の組み合わせが用いられる。Examples of nonionic surfactants used in the present invention include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene nonylphenyl Ether, polyoxyethylene alkylphenyl ether such as polyoxyethylene octylphenyl ether; polyoxyethylene polyoxypropylene block polymer, polyoxysorbicun fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene alkylamine, polyoxyethylene fatty acid Examples include polyoxyethylene derivatives such as amides; sorbitan fatty acid esters, glycerin fatty acid esters, and the like. Each of these can be used alone, but
Preferably, a combination of two or more types is used.
より好ましくはポリオキシエチレンアルキルエーテル或
はポリオキシエチレン脂肪酸エステル等のポリオキシエ
チレン系のノニオン系界面活性剤が一種類以上含まれる
組み合わせが用いられる。ポリオキシエチレン系のノニ
オン系界面活性剤におけるエチレンオキサイド部分の付
加モル数は3〜40が好ましく、より好ましくは10〜
20である。More preferably, a combination containing one or more polyoxyethylene-based nonionic surfactants such as polyoxyethylene alkyl ether or polyoxyethylene fatty acid ester is used. The number of moles of the ethylene oxide moiety added in the polyoxyethylene nonionic surfactant is preferably 3 to 40, more preferably 10 to 40.
It is 20.
本発明に用いる一般式(I)
R+ (OCm)n OR2(I)(式中、nは1
、2或は3を示し、nが1或は2の時、mは2或は3、
R1はH1炭素数1〜5のアルキル基或はアセトキシル
基を示し、R2はH1炭素数1〜5のアルキル基或はア
セチル基を示す。General formula (I) used in the present invention R+ (OCm)n OR2(I) (wherein, n is 1
, 2 or 3, when n is 1 or 2, m is 2 or 3,
R1 represents an alkyl group or acetoxyl group in which H1 has 1 to 5 carbon atoms, and R2 represents an alkyl group or acetyl group in which H1 has 1 to 5 carbon atoms.
また、nが3の時、mは2或は3、R3はH1炭素数1
〜3のアルキル基或はアセトキシル基を示し、R2はH
1炭素数1〜3のアルキル基或はアセチル基を示す)で
表される物質の濃度は50〜99重量%の範囲にあるこ
とが好ましい。Also, when n is 3, m is 2 or 3, R3 is H1 carbon number 1
-3 alkyl group or acetoxyl group, R2 is H
The concentration of the substance represented by (representing an alkyl group or acetyl group having 1 to 3 carbon atoms) is preferably in the range of 50 to 99% by weight.
本発明に用いられる一般式(I)
R+ (OCm)n OR2(I)(式中、nは
1.2或3を示し、nが1或は2の時、mは2或は3、
R1はH1炭素数1〜5のアルキル基或はアセトキシル
基を示し、R2はH1炭素数1〜5のアルキル基或はア
セチル基を示す。General formula (I) used in the present invention R+ (OCm)n OR2(I) (wherein, n represents 1.2 or 3, and when n is 1 or 2, m is 2 or 3,
R1 represents an alkyl group or acetoxyl group in which H1 has 1 to 5 carbon atoms, and R2 represents an alkyl group or acetyl group in which H1 has 1 to 5 carbon atoms.
また、nが3の時、mは2或は3、R1はH1炭素数1
〜3のアルキル基或はアセトキシル基示し、R2はH1
炭素数1〜3のアルキル基或はアセチル基を示す)で表
される物質としては、例えば、エチレングリコールモノ
メチルエーテル、エチレングリコールモノエチルエーテ
ル、エチレングリコールジメチルエーテル、エチレング
リコールジエチルエーテル、ジエチレングリコールモノ
メチルエーテル、ジエチレングリコールモノエチルエー
テル、ジエチレングリコールジメチルエーテル、ジエチ
ルグリコールジエチルエーテル、エチレングリコールメ
チルエーテルアセタート、エチレングリコールモノエチ
ルエーテルアセタート、ジエチレングリコールモノメチ
ルエーテルアセタート、ジエチレングリコールモノエチ
ルエーテルアセタート、ジエチレングリコールモノブチ
ルエーテルアセタート、トリエチレングリコールモノメ
チルエーテル、ジプロピレングリコールモノメチルエー
テル、トリプロピレングリコールモノメチルエーテル等
が挙げられる。これらはそれぞれ単独または2種以上を
組み合わせて用いられる。Also, when n is 3, m is 2 or 3, R1 is H1 carbon number 1
~3 alkyl group or acetoxyl group, R2 is H1
Examples of substances represented by C1-C3 alkyl group or acetyl group include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol monomethyl ether, and diethylene glycol. Monoethyl ether, diethylene glycol dimethyl ether, diethyl glycol diethyl ether, ethylene glycol methyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, triethylene glycol monomethyl Examples include ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, and the like. These may be used alone or in combination of two or more.
本発明における必須成分の組み合わせは、被洗物の材質
及び形態、汚れの種類等に応じて、任意に変えることが
可能である。必須成分の内、どちらか一方でも欠けると
、フラックス洗浄性能或は水リンス性が悪くなることに
よる仕上がりの悪化が起こる。又、必須成分2種類の組
み合わせによって始めて環境に対して安全でしかも従来
のフロン系及び塩素系のフラックス洗浄能力に匹敵する
実用的な洗浄剤が得られるものである。更に、本発明の
組成物に液の安全性の保持や被洗物に対する安全性を向
上させる為に、或は溶解力向上の為に種々の安定剤及び
添加剤を加えることが可能である。安定剤及び添加剤と
しては例えば、炭化水素類、アルコール類、エーテル類
アセタール類、エステル類、ケトン類、脂肪酸類、ニト
ロアルカン類、アミン類、アミド類、アミノエタノール
類、ベンゾトリアゾール類等が挙げられる。The combination of essential components in the present invention can be arbitrarily changed depending on the material and form of the object to be washed, the type of dirt, etc. If any one of the essential components is missing, the finish will deteriorate due to poor flux cleaning performance or water rinsing performance. Moreover, only by combining two types of essential components can a practical cleaning agent that is safe for the environment and comparable in cleaning ability to conventional fluorocarbon-based and chlorine-based fluxes be obtained. Furthermore, various stabilizers and additives can be added to the composition of the present invention in order to maintain the safety of the liquid and improve the safety for the items to be washed, or to improve the dissolving power. Examples of stabilizers and additives include hydrocarbons, alcohols, ether acetals, esters, ketones, fatty acids, nitroalkanes, amines, amides, aminoethanols, benzotriazoles, etc. It will be done.
更に本発明の組成物にアニオン系界面活性剤やカチオン
系界面活性剤を必要に応じて添加することも可能である
。Furthermore, it is also possible to add an anionic surfactant or a cationic surfactant to the composition of the present invention, if necessary.
〔実施例〕
以下、本発明を実施例及び比較例によって具体的に説明
する。実施例及び比較例における洗浄方法は次の通りで
ある。[Example] Hereinafter, the present invention will be specifically explained using Examples and Comparative Examples. The cleaning methods in Examples and Comparative Examples are as follows.
一実施例における洗浄方法(第1図)−■ 本発明の組
成物を仕込んだ超音波洗浄機〔ヤマト科学■製、商品名
: BRANSONC220〕2槽(第一槽、第二槽)
と水リンス槽2槽(第三槽、第四槽)を用意し、洗浄槽
の温度を40℃とした。尚、水リンス槽の温度は室温と
した。Cleaning method in one embodiment (Fig. 1) - Ultrasonic cleaning machine charged with the composition of the present invention [manufactured by Yamato Scientific, trade name: BRANSONC220] 2 tanks (first tank, second tank)
Two water rinsing tanks (a third tank and a fourth tank) were prepared, and the temperature of the washing tank was set to 40°C. In addition, the temperature of the water rinsing tank was set to room temperature.
■ 被洗物(ガラスエポキシ製プリント基板)に各種フ
ラックス(タムラ製作所製、商品名:フラックスF−2
30V及びMH−320■)を塗布し、溶融ハンダ槽(
260℃)で5秒間ハンダ付けを行った。■ Apply various types of flux (manufactured by Tamura Seisakusho, product name: Flux F-2) to the item to be washed (glass epoxy printed circuit board).
30V and MH-320■) and melted solder bath (
Soldering was performed at 260°C for 5 seconds.
■ 被洗物を第一槽に1分間、続いて第二槽に1分間浸
漬して、超音波洗浄を行った。■ The items to be washed were immersed in the first tank for 1 minute and then in the second tank for 1 minute to perform ultrasonic cleaning.
■ 次に被洗物を第三槽と第四槽に各1分間、順番に浸
し、それぞれ被洗物を軽く揺動させて水リンスを行った
。(2) Next, the items to be washed were sequentially immersed in the third tank and the fourth tank for 1 minute each, and the items to be washed were lightly shaken for water rinsing.
■−最後に110℃に設定された乾燥機で被洗物を乾燥
させた(乾燥時間5分間)。- Finally, the items to be washed were dried in a dryer set at 110°C (drying time: 5 minutes).
■ オメガメーターにより、プリント基板上のイオン分
残渣を計測定した。■ Ion residue on the printed circuit board was measured using an omega meter.
一比較例における洗浄方法(第2図)−(揮発性溶剤を
用いた場合)
■ 冷却管を備えた容量1000−の硬質ガラス製洗浄
器3台(第一槽、第二槽、第三槽)を用意し、各種に比
較溶剤300−を入れ、第一槽を沸騰槽(比較溶剤の沸
点の温度)、第二槽を冷却槽(室温)、第三槽を蒸気槽
(比較溶剤の沸点の温度)とした。Cleaning method in a comparative example (Figure 2) - (when volatile solvent is used) ■ Three hard glass washers with a capacity of 1000 and equipped with cooling pipes (first tank, second tank, third tank) ), put 300 - of comparison solvent into each type, use the first tank as a boiling tank (at the boiling point of the comparison solvent), the second tank as a cooling tank (at room temperature), and the third tank as a steam tank (at the boiling point of the comparison solvent). temperature).
■ 前記の被洗物を各種に順番に1分間浸漬しん(但し
、第三槽では被洗物を蒸気層へ入れただけ)。■ Each type of item to be washed was immersed in the bath for 1 minute in turn (however, in the third tank, the items to be washed were simply put into the steam layer).
■ その後、オメガメーターにより、プリント基板上の
イオン分残渣を測定した。■ Thereafter, the ion residue on the printed circuit board was measured using an omega meter.
実施例1〜8 第1表に示す組成物について洗浄実験を行った。Examples 1-8 A cleaning experiment was conducted on the compositions shown in Table 1.
その結果を第4表に示す。The results are shown in Table 4.
比較例1,2 第2表に示す溶剤について洗浄実験を行った。Comparative examples 1 and 2 Cleaning experiments were conducted using the solvents shown in Table 2.
その結果を第4表に示す。The results are shown in Table 4.
比較例3〜6 第3表に示す溶剤について洗浄実験を行った。Comparative examples 3 to 6 Cleaning experiments were conducted using the solvents listed in Table 3.
その結果を第4表に示す。The results are shown in Table 4.
本発明のフラックス洗浄剤は、従来のフロン系及び塩素
系溶剤に匹敵する脱脂性能及び仕上がり性の良さを有し
、しかも、オゾンを破壊することなく、更に生物分解性
が高い為に、排水中に混入した場合でも、通常の微生物
処理等により容易に分解させることが可能である。従っ
て排水によって、水系環境を汚染させる心配もない。ま
た、低毒性及び高引火点である為、非常に安全な洗浄溶
剤である。The flux cleaning agent of the present invention has degreasing performance and finish quality comparable to conventional fluorocarbon-based and chlorinated solvents, and furthermore, it does not destroy ozone and is highly biodegradable, so it can be used in wastewater. Even if it gets mixed into the water, it can be easily decomposed by ordinary microbial treatment. Therefore, there is no need to worry about contaminating the aquatic environment due to wastewater. It is also a very safe cleaning solvent due to its low toxicity and high flash point.
従って、本発明のフラックス洗浄剤は実用上、従来のフ
ロン系及び塩素系溶剤を代替する優れた脱脂用洗浄剤で
ある。Therefore, the flux cleaning agent of the present invention is practically an excellent degreasing agent that can replace conventional fluorocarbon-based and chlorinated solvents.
第1図は実施例の洗浄剤を用いた被洗物の洗浄方法の概
略図、第2図は比較例の揮発性溶剤を用いた被洗物の洗
浄方法の概略図である。
特許出願人 旭化成工業株式会社FIG. 1 is a schematic diagram of a method of cleaning an object to be washed using a cleaning agent of an example, and FIG. 2 is a schematic diagram of a method of cleaning an object to be washed using a volatile solvent of a comparative example. Patent applicant: Asahi Kasei Industries, Ltd.
Claims (2)
、nは1、2或は3を示し、nが1或は2の時、mは2
或は3、R_1はH、炭素数1〜5のアルキル基或はア
セトキシル基を示し、R_2はH、炭素数1〜5のアル
キル基或はアセチル基を示す。また、nが3の時、mは
2或は3、R_1はH、炭素数1〜3のアルキル基或は
アセトキシル基を示し、R_2はH、炭素数1〜3のア
ルキル基或はアセチル基を示す) で表される物質一種又は一種以上、 を必須成分として含むことを特徴とするフラックス洗浄
剤。(2) General formula (I) R_1-(O-Cm)n-O-R_2...(I) (In the formula, n represents 1, 2 or 3, and when n is 1 or 2, m is 2
Or 3, R_1 represents H, an alkyl group having 1 to 5 carbon atoms, or an acetoxyl group, and R_2 represents H, an alkyl group having 1 to 5 carbon atoms, or an acetyl group. Furthermore, when n is 3, m is 2 or 3, R_1 is H, an alkyl group having 1 to 3 carbon atoms, or an acetoxyl group, and R_2 is H, an alkyl group having 1 to 3 carbon atoms, or an acetyl group. A flux cleaning agent characterized by containing as an essential component one or more substances represented by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17007890A JPH0459898A (en) | 1990-06-29 | 1990-06-29 | Detergent for flux |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17007890A JPH0459898A (en) | 1990-06-29 | 1990-06-29 | Detergent for flux |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0459898A true JPH0459898A (en) | 1992-02-26 |
Family
ID=15898237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17007890A Pending JPH0459898A (en) | 1990-06-29 | 1990-06-29 | Detergent for flux |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0459898A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5547601A (en) * | 1992-09-09 | 1996-08-20 | Jnj Industries, Inc. | CFC-free solvent for solvating solder flux |
US5846920A (en) * | 1993-09-17 | 1998-12-08 | Matsushita Electric Industrial Co., Ltd. | Cleaning agent for removing soldering flux based on alkylene glycol branched monoalkyl ether |
-
1990
- 1990-06-29 JP JP17007890A patent/JPH0459898A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5547601A (en) * | 1992-09-09 | 1996-08-20 | Jnj Industries, Inc. | CFC-free solvent for solvating solder flux |
US5846920A (en) * | 1993-09-17 | 1998-12-08 | Matsushita Electric Industrial Co., Ltd. | Cleaning agent for removing soldering flux based on alkylene glycol branched monoalkyl ether |
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