JPH0465500A - Flux-cleaning agent - Google Patents
Flux-cleaning agentInfo
- Publication number
- JPH0465500A JPH0465500A JP17751490A JP17751490A JPH0465500A JP H0465500 A JPH0465500 A JP H0465500A JP 17751490 A JP17751490 A JP 17751490A JP 17751490 A JP17751490 A JP 17751490A JP H0465500 A JPH0465500 A JP H0465500A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- polyoxyethylene
- cleaning
- cleaning agent
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 17
- 230000004907 flux Effects 0.000 claims abstract description 16
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims 1
- -1 polyoxyethylene Polymers 0.000 abstract description 26
- 229920003171 Poly (ethylene oxide) Polymers 0.000 abstract description 14
- 239000002904 solvent Substances 0.000 abstract description 14
- 235000014113 dietary fatty acids Nutrition 0.000 abstract description 8
- 229930195729 fatty acid Natural products 0.000 abstract description 8
- 239000000194 fatty acid Substances 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 5
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract description 3
- 150000005215 alkyl ethers Chemical class 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052801 chlorine Inorganic materials 0.000 abstract description 2
- 239000000460 chlorine Substances 0.000 abstract description 2
- 231100000053 low toxicity Toxicity 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 9
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- PFNHSEQQEPMLNI-UHFFFAOYSA-N 2-methyl-1-pentanol Chemical compound CCCC(C)CO PFNHSEQQEPMLNI-UHFFFAOYSA-N 0.000 description 2
- RZKSECIXORKHQS-UHFFFAOYSA-N Heptan-3-ol Chemical compound CCCCC(O)CC RZKSECIXORKHQS-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- NMRPBPVERJPACX-UHFFFAOYSA-N (3S)-octan-3-ol Natural products CCCCCC(O)CC NMRPBPVERJPACX-UHFFFAOYSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- UJPKMTDFFUTLGM-UHFFFAOYSA-N 1-aminoethanol Chemical class CC(N)O UJPKMTDFFUTLGM-UHFFFAOYSA-N 0.000 description 1
- WOFPPJOZXUTRAU-UHFFFAOYSA-N 2-Ethyl-1-hexanol Natural products CCCCC(O)CCC WOFPPJOZXUTRAU-UHFFFAOYSA-N 0.000 description 1
- TZYRSLHNPKPEFV-UHFFFAOYSA-N 2-ethyl-1-butanol Chemical compound CCC(CC)CO TZYRSLHNPKPEFV-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 125000004971 nitroalkyl group Chemical group 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ハンダ接合時にハンダと基材との接合力を強
める為に塗布されるフラックスをハンダ接合後に除去す
る為のフラックス洗浄剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flux cleaning agent for removing flux applied during solder bonding to strengthen the bonding force between the solder and a base material after solder bonding.
従来、電気・電子産業分野では、プリント回路又はプリ
ント配線板製造工程において、ハンダと基材とを強固に
固着させる為に予めフラックスを塗布している。このフ
ラックスは、プリント回路又はプリント配線板に残存す
ると導電不良或は腐食の原因となる為、通常、ハンダ付
は終了後には有機系洗浄剤によって、洗浄除去されてい
る。この洗浄剤として、従来からフロン１１３或はメチ
ルクロロホルムが使用されてきている。これらの溶剤は
フラックスに対する溶解力か大きく、不燃性であること
から広範囲に使用されている。Conventionally, in the field of electrical and electronic industries, flux is applied in advance in order to firmly bond solder and base material in the manufacturing process of printed circuits or printed wiring boards. If this flux remains on the printed circuit or printed wiring board, it will cause poor conductivity or corrosion, so it is usually washed off with an organic cleaning agent after soldering. Freon 113 or methyl chloroform has conventionally been used as this cleaning agent. These solvents have a high ability to dissolve flux and are nonflammable, so they are widely used.
しかし、社会的な環境問題に対する意識の高まりの中で
環境破壊性物質の大気及び水系への排出規制の動きが出
てきている。例えば、フロン系溶剤（特定フロン５種：
ＣＦＣＩＩ、 ＣＦＣｌ２． ＣＦＣＩＩ３． ＣＦ
ＣＩＩ４゜ＣＦＣＩＩ５）やメチルクロロホルムは、オ
ゾン層破壊物質として、その使用が制限されつつある。However, as society's awareness of environmental issues increases, there is a movement to regulate the discharge of environmentally destructive substances into the atmosphere and water systems. For example, fluorocarbon solvents (5 types of specified fluorocarbons:
CFCII, CFCl2. CFCII3. C.F.
The use of CII4°CFCII5) and methyl chloroform is being restricted as they are substances that deplete the ozone layer.
かかる状況において、フロン１１３或はメチルクロロホ
ルムを使用している産業界では、−日も早く、これら溶
剤に代わるフラックス洗浄剤か求められているのが実状
である。Under such circumstances, industries that use Freon 113 or methyl chloroform are urgently seeking a flux cleaning agent that can replace these solvents.
本発明者らは、フラックス洗浄剤に用いられるフロン１
１３或はメチルクロロホルムに代わる洗浄剤の研究を重
ねた結果、ノニオン系界面活性剤、及び
一般式（Ｉ）
Ｒ−ＯＨ（Ｉ）
（式中、Ｒは炭素数５〜ＩＯのアルキル基を示す）で表
されるアルコールの一種又は一種以上を必須成分として
含む組成物が、従来のフラックス洗浄剤（フロン１１３
及びメチルクロロホルム）に匹敵する程の高い洗浄性能
及び仕上がり性の良さを示す洗浄剤であることを見出し
、この知見に基づいて本発明をなすに至った。The present inventors have discovered that Freon 1 used in flux cleaning agents.
13, or as a result of repeated research on cleaning agents to replace methyl chloroform, nonionic surfactants and general formula (I) R-OH (I) (wherein R represents an alkyl group having 5 to IO carbon atoms) ) is a composition containing as an essential component one or more of the alcohols represented by
The present inventors have discovered that the present invention is a cleaning agent that exhibits high cleaning performance and finish quality comparable to those of methyl chloroform and methylchloroform), and based on this knowledge, the present invention was developed.
すなわち、本発明は、
（１）ノニオン系界面活性剤、及び
（２）−船蔵（Ｉ）
Ｒ−ＯＨ（Ｉ）
（式中、Ｒは炭素数５〜１０のアルキル基を示す）で表
されるアルコールの一種又は一種以上、を必須成分とし
て含むことを特徴とするフラックス洗浄剤である。That is, the present invention provides (1) a nonionic surfactant, and (2) -Funazura (I) R-OH (I) (wherein R represents an alkyl group having 5 to 10 carbon atoms). This flux cleaning agent is characterized by containing one or more types of alcohol as an essential component.
本発明に用いるノニオン系界面活性剤の濃度は、１〜３
０重量％の範囲にあることが好ましい。The concentration of the nonionic surfactant used in the present invention is 1 to 3.
Preferably, it is in the range of 0% by weight.
本発明に用いるノニオン系界面活性剤としては、例えば
、ポリオキシエチレンラウリルエーテル、ポリオキシエ
チレンセチルエーテル、ポリオキシエチレンステアリル
エーテル、ポリオキシエチレンオレイルエーテル等のポ
リオキシエチレンアルキルエーテル；ポリオキシエチレ
ンノニルフェニルエーテル、ポリオキシエチレンオクチ
ルフェニルエーテル等のポリオキシエチレンアルキルフ
ェニルエーテル ポリオキシエチレンポリオキシプロピ
レンブロックポリマー、ポリオキシソルビタン脂肪酸エ
ステル、ポリオキシエチレン脂肪酸エステル、ポリオキ
シエチレンアルキルアミン、ポリオキシエチレン脂肪酸
アミド等のポリオキシエチレン誘導体；ソルビタン脂肪
酸エステル、グリセリン脂肪酸エステル等が挙げられる
。これらはそれぞれ単独で用いることが可能であるが、
好ましくは二種類以上の組み合わせが用いられる。より
好ましくはポリオキシエチレンアルキルエーテル或はポ
リオキシエチレン脂肪酸エステル等のポリオキシエチレ
ン系のノニオン系界面活性剤が一種類以上含まれる組み
合わせが用いられる。ポリオキシエチレン系のノニオン
系界面活性剤におけるエチレンオキサイド部分の付加モ
ル数は３〜４０が好ましく、より好ましくは１０〜２０
である。Examples of nonionic surfactants used in the present invention include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene nonylphenyl Ether, polyoxyethylene alkylphenyl ether such as polyoxyethylene octylphenyl ether, polyoxyethylene polyoxypropylene block polymer, polyoxysorbitan fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene alkylamine, polyoxyethylene fatty acid amide, etc. Polyoxyethylene derivatives; examples include sorbitan fatty acid esters and glycerin fatty acid esters. Each of these can be used alone, but
Preferably, a combination of two or more types is used. More preferably, a combination containing one or more polyoxyethylene-based nonionic surfactants such as polyoxyethylene alkyl ether or polyoxyethylene fatty acid ester is used. The number of moles of the ethylene oxide moiety added in the polyoxyethylene nonionic surfactant is preferably 3 to 40, more preferably 10 to 20.
It is.
本発明に用いるアルコールの濃度は５０〜９９重量％の
範囲にあることが好ましい。The concentration of alcohol used in the present invention is preferably in the range of 50 to 99% by weight.
本発明に用いられるアルコールとしては、例えば、１−
ペンタノール、２−ペンタノール、３−ペンタノール、
２−メチル−１−ブタノール、１−ヘキサノール、２−
メチル−１−ペンタノール、２−エチル−１−ブタノー
ル、■−ヘプタツール、２−ヘプタツール、３−ヘプタ
ノール、■−オクタツール、２−オクタツール、２−エ
チル−１−ヘキサノール、■−ノナノール、■−デカノ
ール等が挙げられる。これらはそれぞれ単独または２種
以上を組み合わせて用いられる。Examples of the alcohol used in the present invention include 1-
Pentanol, 2-pentanol, 3-pentanol,
2-methyl-1-butanol, 1-hexanol, 2-
Methyl-1-pentanol, 2-ethyl-1-butanol, ■-heptatool, 2-heptatool, 3-heptanol, ■-octatool, 2-octatool, 2-ethyl-1-hexanol, ■-nonanol , ■-decanol and the like. These may be used alone or in combination of two or more.
本発明における必須成分の組み合わせは、被洗物の材質
及び形態、汚れの種類等に応じて、任意に変えることが
可能である。必須成分の内、どちらか一方でも欠けると
、フラックス洗浄性能或は水リンス性が悪くなることに
よる仕上がりの悪化が起こる。又、必須成分２種類の組
み合わせによって始めて環境に対して安全で、しかも労
働衛生上も問題かなく、従来のフロン系及び塩素系の洗
浄能力に匹敵する実用的な洗浄剤が得られるものである
。更に、本発明の組成物に液の安定性の保持や被洗物に
対する安定性を向上させる為に或は溶解力向上の為に種
々の安定剤及び添加剤を加えることが可能である。安定
剤及び添加剤としては、例えば、炭化水素類、エステル
類、エーテル類、アセタール類、ケトン類、脂肪酸類、
ニトロアルカン類、アミン類、アミド類、グリコール類
、アミノエタノール類、ベンゾトリアゾール類等が挙げ
られる。The combination of essential components in the present invention can be arbitrarily changed depending on the material and form of the object to be washed, the type of dirt, etc. If any one of the essential components is missing, the finish will deteriorate due to poor flux cleaning performance or water rinsing performance. In addition, only by combining two essential components can we obtain a practical cleaning agent that is safe for the environment, poses no problems in terms of occupational hygiene, and is comparable in cleaning ability to conventional fluorocarbon- and chlorine-based cleaning agents. . Furthermore, it is possible to add various stabilizers and additives to the composition of the present invention in order to maintain the stability of the liquid and improve the stability against the objects to be washed, or to improve the dissolving power. Examples of stabilizers and additives include hydrocarbons, esters, ethers, acetals, ketones, fatty acids,
Examples include nitroalkanes, amines, amides, glycols, aminoethanols, benzotriazoles, and the like.
更に本発明の組成物にアニオン系界面活性剤やカチオン
系界面活性剤を必要に応じて添加することも可能である
。Furthermore, it is also possible to add an anionic surfactant or a cationic surfactant to the composition of the present invention, if necessary.
以下、本発明を、実施例及び比較例によって具体的に説
明する。実施例及び比較例における洗浄方法は次の通り
である。Hereinafter, the present invention will be specifically explained using Examples and Comparative Examples. The cleaning methods in Examples and Comparative Examples are as follows.
実施例における洗浄方法（第１図）
■ 本発明の組成物を仕込んだ超音波洗浄機〔ヤマト科
学■製、商品名：ＢＲＡＮＳＯＮＩＣ２２０〕２槽〔第
一槽、第二槽）と水リンス槽２槽（第三槽、第四槽）を
用意し、洗浄槽の温度を４０°Ｃとした。Cleaning method in Examples (Figure 1) ■ Ultrasonic cleaning machine charged with the composition of the present invention [manufactured by Yamato Kagaku ■, product name: BRANSONIC220] 2 tanks [first tank, second tank] and water rinse tank 2 Tanks (third tank, fourth tank) were prepared, and the temperature of the cleaning tank was set to 40°C.
尚、水リンス槽の温度は室温とした。In addition, the temperature of the water rinsing tank was set to room temperature.
■ 被洗物（ガラスエポキシ製プリント基板）に各種フ
ラックス（タムラ製作所製、商品名：フラックスＦ−２
３０Ｖ及びＭＨ−３２０Ｖ）を塗布し、溶融ハンダ槽（
２６０°Ｃ）で５秒間ハンダ付は作業を行った。■ Apply various types of flux (manufactured by Tamura Seisakusho, product name: Flux F-2) to the item to be washed (glass epoxy printed circuit board).
30V and MH-320V) and melted solder bath (
Soldering was carried out at 260°C for 5 seconds.
■ 被洗物を第一槽に１分間、続いて第二槽に１分間浸
漬して、超音波洗浄を行った。■ The items to be washed were immersed in the first tank for 1 minute and then in the second tank for 1 minute to perform ultrasonic cleaning.
■ 次に被洗物を第三槽と第四槽に各１分間、順番に浸
し、それぞれ被洗物を軽く揺動させて水リンスを行った
。(2) Next, the items to be washed were sequentially immersed in the third tank and the fourth tank for 1 minute each, and the items to be washed were lightly shaken for water rinsing.
■ 最後に１１０°Ｃに設定された乾燥機で被洗物を乾
燥させた（乾燥時間５分間）。■ Finally, the items to be washed were dried in a dryer set at 110°C (drying time: 5 minutes).
■ オメガメーターにより、プリント基板上のイオン分
残査を測定した。■ Ion residue on the printed circuit board was measured using an omega meter.
比較例における洗浄方法（第２図）
（揮発性溶剤を用いた場合）
■ 冷却管を備えた容量１０００７ｎ！！の硬質ガラス
製洗浄器３台（第一槽、第二槽、第三槽）を用意し、各
種に比較溶剤３００７ｒＬｌをいれ、第一槽を沸騰槽（
比較溶剤の沸点の温度）、第二槽を冷浴槽（室温）、第
三槽を蒸気槽（比較溶剤の沸点の温度）とした。Cleaning method in comparative example (Figure 2) (When volatile solvent is used) ■ Capacity 10007n with cooling pipe! ! Prepare three hard glass cleaners (first tank, second tank, and third tank), put comparative solvent 3007rLl in each type, and replace the first tank with a boiling tank (
The second tank was used as a cold bath (room temperature), and the third tank was a steam tank (temperature equal to the boiling point of the comparative solvent).
■ 前記の被洗物を各種に順番に１分間浸漬した（但し
、第三槽では被洗物を蒸気層へ入れただけ）。(2) Each of the items to be washed was immersed in order for 1 minute (however, in the third tank, the items to be washed were simply put into the steam layer).
■ その後、オメガメーターにより、プリント基板上の
イオン分残査を測定した。■ Thereafter, the ion content remaining on the printed circuit board was measured using an omega meter.
尚、比較例で高沸系溶剤を用いる場合は、“実施例にお
ける洗浄方法”に準じた。In addition, when using a high-boiling solvent in the comparative example, the "cleaning method in the example" was followed.
実施例１〜８ 第１表に示す組成物について洗浄実験を行った。Examples 1-8 A cleaning experiment was conducted on the compositions shown in Table 1.
その結果を第４表に示す。The results are shown in Table 4.
比較例１，２ 第２表に示す溶剤について洗浄実験を行った。Comparative examples 1 and 2 Cleaning experiments were conducted using the solvents shown in Table 2.
その結果を第４表に示す。The results are shown in Table 4.
比較例３〜６ 第３表に示す溶剤について洗浄実験を行った。Comparative examples 3 to 6 Cleaning experiments were conducted using the solvents listed in Table 3.
その結果を第４表に示す。The results are shown in Table 4.
以下余白
〔発明の効果〕
本発明のフラックス洗浄剤は、従来のフロン系及び塩素
系溶剤に匹敵する洗浄性能及び仕上かり性の良さを有し
、しかも、オゾンを破壊することなく、更に生物分解性
か高い為に、排水中に混入した場合でも、通常の微生物
処理等により容易に分解させることか可能である。従っ
て排水によって、水系環境を汚染させる心へ己もない。The following margin [Effects of the Invention] The flux cleaning agent of the present invention has cleaning performance and finish quality comparable to conventional fluorocarbon-based and chlorinated solvents, and furthermore, does not destroy ozone and is biodegradable. Because of its high susceptibility, even if it is mixed into wastewater, it can be easily decomposed by normal microbial treatment. Therefore, there is no intention of contaminating the water environment through wastewater.
また、低毒性及び高引火点である為、非常に安全な洗浄
溶剤である。It is also a very safe cleaning solvent due to its low toxicity and high flash point.
従って、本発明のフラックス洗浄剤は、実用上、従来の
フロン系及び塩素系溶剤を代替する優れたフラックス洗
浄剤である。Therefore, the flux cleaning agent of the present invention is practically an excellent flux cleaning agent that can replace conventional fluorocarbon-based and chlorinated solvents.
第１図は実施例の洗浄剤を用いた被洗物の洗浄方法の概
略図、第２図は比較例の揮発性溶剤を用いた被洗物の洗
浄方法の概略図である。
特許出願人 旭化成工業株式会社FIG. 1 is a schematic diagram of a method of cleaning an object to be washed using a cleaning agent of an example, and FIG. 2 is a schematic diagram of a method of cleaning an object to be washed using a volatile solvent of a comparative example. Patent applicant: Asahi Kasei Industries, Ltd.
Claims (2)
されるアルコールの１種又は１種以上、を必須成分とし
て含むことを特徴とするフラックス洗浄剤。(2) General formula (I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (In the formula, R represents an alkyl group having 5 to 10 carbon atoms) One or more alcohols are required. A flux cleaning agent characterized by containing it as an ingredient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17751490A JPH0465500A (en) | 1990-07-06 | 1990-07-06 | Flux-cleaning agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17751490A JPH0465500A (en) | 1990-07-06 | 1990-07-06 | Flux-cleaning agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465500A true JPH0465500A (en) | 1992-03-02 |
Family
ID=16032242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17751490A Pending JPH0465500A (en) | 1990-07-06 | 1990-07-06 | Flux-cleaning agent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465500A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04142399A (en) * | 1990-10-03 | 1992-05-15 | New Japan Chem Co Ltd | Nonhalogenous detergent composition |
| EP0619364A1 (en) * | 1993-04-09 | 1994-10-12 | Purac Biochem N.V. | A non-ozone depleting cleaning composition for degreasing and defluxing purposes |
| JPH0782600A (en) * | 1993-02-26 | 1995-03-28 | Teishin Shoji Kk | Detergent and cleaning method |
| US5482645A (en) * | 1993-04-09 | 1996-01-09 | Purac Biochem B.V. | Non-ozone depleting cleaning composition for degreasing and defluxing purposes |
-
1990
- 1990-07-06 JP JP17751490A patent/JPH0465500A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04142399A (en) * | 1990-10-03 | 1992-05-15 | New Japan Chem Co Ltd | Nonhalogenous detergent composition |
| JPH0782600A (en) * | 1993-02-26 | 1995-03-28 | Teishin Shoji Kk | Detergent and cleaning method |
| EP0619364A1 (en) * | 1993-04-09 | 1994-10-12 | Purac Biochem N.V. | A non-ozone depleting cleaning composition for degreasing and defluxing purposes |
| US5482645A (en) * | 1993-04-09 | 1996-01-09 | Purac Biochem B.V. | Non-ozone depleting cleaning composition for degreasing and defluxing purposes |
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