JPH0459176U - - Google Patents
Info
- Publication number
- JPH0459176U JPH0459176U JP10145890U JP10145890U JPH0459176U JP H0459176 U JPH0459176 U JP H0459176U JP 10145890 U JP10145890 U JP 10145890U JP 10145890 U JP10145890 U JP 10145890U JP H0459176 U JPH0459176 U JP H0459176U
- Authority
- JP
- Japan
- Prior art keywords
- tetrafluoroethylene
- adhesive layer
- copolymer resin
- resin
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 2
- 229920006026 co-polymeric resin Polymers 0.000 claims 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10145890U JPH0459176U (zh) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10145890U JPH0459176U (zh) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459176U true JPH0459176U (zh) | 1992-05-21 |
Family
ID=31844924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10145890U Pending JPH0459176U (zh) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459176U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020027172A1 (ja) * | 2018-07-31 | 2020-02-06 | 日東電工株式会社 | 板状の複合材料 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63145341A (ja) * | 1986-12-09 | 1988-06-17 | Matsushita Electric Works Ltd | 含フツ素樹脂プリプレグおよびそれを用いた多層配線基板 |
| JPH01103064A (ja) * | 1987-10-15 | 1989-04-20 | Toshiba Corp | テレコントロール受信装置 |
-
1990
- 1990-09-27 JP JP10145890U patent/JPH0459176U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63145341A (ja) * | 1986-12-09 | 1988-06-17 | Matsushita Electric Works Ltd | 含フツ素樹脂プリプレグおよびそれを用いた多層配線基板 |
| JPH01103064A (ja) * | 1987-10-15 | 1989-04-20 | Toshiba Corp | テレコントロール受信装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020027172A1 (ja) * | 2018-07-31 | 2020-02-06 | 日東電工株式会社 | 板状の複合材料 |
| JPWO2020027172A1 (ja) * | 2018-07-31 | 2021-08-26 | 日東電工株式会社 | 板状の複合材料 |
| US11472165B2 (en) | 2018-07-31 | 2022-10-18 | Nitto Denko Corporation | Plate-like composite material |
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