JPH0459141U - - Google Patents

Info

Publication number
JPH0459141U
JPH0459141U JP1990077847U JP7784790U JPH0459141U JP H0459141 U JPH0459141 U JP H0459141U JP 1990077847 U JP1990077847 U JP 1990077847U JP 7784790 U JP7784790 U JP 7784790U JP H0459141 U JPH0459141 U JP H0459141U
Authority
JP
Japan
Prior art keywords
lead frame
vertical movement
movement mechanism
wire bonding
bonding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990077847U
Other languages
English (en)
Other versions
JP2513437Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990077847U priority Critical patent/JP2513437Y2/ja
Publication of JPH0459141U publication Critical patent/JPH0459141U/ja
Application granted granted Critical
Publication of JP2513437Y2 publication Critical patent/JP2513437Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例の斜視図、第２図は従
来例の斜視図である。 １……リードフレーム、２……ガイドレール、
３……リードフレーム搬送装置、４，６……上下
動機構、５……ヒータプレート、７……ワーク押
え、８……ボンデイングヘツド、１１……リード
フレーム供給マガジン、１２，１３，１４……制
御装置。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレーム搬送装置と、上下動機構を有す
    るリードフレーム加熱装置と、上下動機構を有す
    るリードフレーム押え部材と、ボンデイングヘツ
    ドとを備えたワイヤボンデイング装置において、
    前記リードフレーム加熱装置と押え部材の上下動
    機構をそれぞれ独立に作動可能とする制御装置を
    設け、リードフレームの加熱時間経過後に押え部
    材を下降させるようにしたことを特徴とするワイ
    ヤボンデイング装置。
JP1990077847U 1990-07-24 1990-07-24 ワイヤボンディング装置 Expired - Lifetime JP2513437Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990077847U JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990077847U JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH0459141U true JPH0459141U (ja) 1992-05-21
JP2513437Y2 JP2513437Y2 (ja) 1996-10-09

Family

ID=31809536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990077847U Expired - Lifetime JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JP2513437Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163626A (ja) * 1992-11-27 1994-06-10 Kaijo Corp ボンディング装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237732A (ja) * 1988-07-27 1990-02-07 Toshiba Corp ワイヤボンディング装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237732A (ja) * 1988-07-27 1990-02-07 Toshiba Corp ワイヤボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163626A (ja) * 1992-11-27 1994-06-10 Kaijo Corp ボンディング装置

Also Published As

Publication number Publication date
JP2513437Y2 (ja) 1996-10-09

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