JPH0459124U - - Google Patents
Info
- Publication number
- JPH0459124U JPH0459124U JP10130190U JP10130190U JPH0459124U JP H0459124 U JPH0459124 U JP H0459124U JP 10130190 U JP10130190 U JP 10130190U JP 10130190 U JP10130190 U JP 10130190U JP H0459124 U JPH0459124 U JP H0459124U
- Authority
- JP
- Japan
- Prior art keywords
- capacitor elements
- chip
- capacitor
- view
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Description
第１図は本考案によるチツプ型複合コンデンサ
の一部切欠き外観斜視図、第２図はその内部構造
を示す一部省略平面図、第３図は第２図のＡ−Ａ
′線に沿う断面図、第４図は第２実施例を示す外
観斜視図図である。第５図は従来のチツプ型積層
セラミツクコンデンサの外観斜視図、第６図は従
来のチツプ型ソリツドタンタルコンデンサの外観
斜視図である。
５……モールド樹脂、６，１３……外部リード
、７……分割溝、８……チツプ型積層セラミツク
コンデンサ（コンデンサ素子）、９……内部リー
ド、１０……外部電極、１１……リードフレーム
、１２……導電性ペースト。
Fig. 1 is a partially cutaway external perspective view of a chip-type composite capacitor according to the present invention, Fig. 2 is a partially omitted plan view showing its internal structure, and Fig. 3 is an A-A in Fig. 2.
FIG. 4 is a sectional view taken along the line '', and FIG. 4 is an external perspective view showing the second embodiment. FIG. 5 is an external perspective view of a conventional chip-type multilayer ceramic capacitor, and FIG. 6 is an external perspective view of a conventional chip-type solid tantalum capacitor. 5...Mold resin, 6, 13...External lead, 7...Dividing groove, 8...Chip type multilayer ceramic capacitor (capacitor element), 9...Internal lead, 10...External electrode, 11...Lead frame , 12... conductive paste.
Claims (1)
部リード上に独立した複数個のコンデンサ素子を
搭載し、樹脂モールドにて一体化して外部リード
を導出し、かつ、個々のコンデンサ素子間のモー
ルド樹脂に分割溝を設けたことを特徴とするチツ
プ型複合コンデンサ。 Multiple independent capacitor elements are mounted on multiple sets of divided internal leads of a common lead frame, integrated with resin molding, external leads are derived, and the molded resin between the individual capacitor elements is A chip-type composite capacitor characterized by having a dividing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10130190U JPH0459124U (en) | 1990-09-27 | 1990-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10130190U JPH0459124U (en) | 1990-09-27 | 1990-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459124U true JPH0459124U (en) | 1992-05-21 |
Family
ID=31844638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10130190U Pending JPH0459124U (en) | 1990-09-27 | 1990-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459124U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005062318A1 (en) * | 2003-12-18 | 2005-07-07 | Matsushita Electric Industrial Co., Ltd. | Electronic component |
| JP2019110321A (en) * | 2015-02-27 | 2019-07-04 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ | Ceramic element and manufacturing method of ceramic element |
| US11527364B2 (en) * | 2018-06-27 | 2022-12-13 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including a plurality of bodies and metal terminals connected to outer electrodes |
| US11532436B2 (en) * | 2018-06-27 | 2022-12-20 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including outer electrodes connected to metal terminals |
-
1990
- 1990-09-27 JP JP10130190U patent/JPH0459124U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005062318A1 (en) * | 2003-12-18 | 2005-07-07 | Matsushita Electric Industrial Co., Ltd. | Electronic component |
| JP2019110321A (en) * | 2015-02-27 | 2019-07-04 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ | Ceramic element and manufacturing method of ceramic element |
| JP2021184489A (en) * | 2015-02-27 | 2021-12-02 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | Ceramic element and manufacturing method thereof |
| US11527364B2 (en) * | 2018-06-27 | 2022-12-13 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including a plurality of bodies and metal terminals connected to outer electrodes |
| US11532436B2 (en) * | 2018-06-27 | 2022-12-20 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including outer electrodes connected to metal terminals |