JPH0415862U - - Google Patents
Info
- Publication number
- JPH0415862U JPH0415862U JP5828890U JP5828890U JPH0415862U JP H0415862 U JPH0415862 U JP H0415862U JP 5828890 U JP5828890 U JP 5828890U JP 5828890 U JP5828890 U JP 5828890U JP H0415862 U JPH0415862 U JP H0415862U
- Authority
- JP
- Japan
- Prior art keywords
- curing
- piezoelectric element
- copper
- printing
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Description
第１図は、本考案の圧電素子の概略断面図であ
り、第２図は、従来の圧電素子の概略断面図であ
る。
１０，２０……圧電素子、１，２１……圧電磁
器、２，３，２２，２３……電極、４……リード
線。
FIG. 1 is a schematic sectional view of a piezoelectric element of the present invention, and FIG. 2 is a schematic sectional view of a conventional piezoelectric element. 10, 20... piezoelectric element, 1, 21... piezoelectric ceramic, 2, 3, 22, 23... electrode, 4... lead wire.
Claims (1)
化型銅ペーストの印刷・硬化による銅電極を備え
た圧電素子。 A piezoelectric element with copper electrodes formed by printing and curing resin-curing copper paste with a thickness of 6 to 10 μm on both sides of a piezoelectric ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5828890U JPH0415862U (en) | 1990-05-31 | 1990-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5828890U JPH0415862U (en) | 1990-05-31 | 1990-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415862U true JPH0415862U (en) | 1992-02-07 |
Family
ID=31583764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5828890U Pending JPH0415862U (en) | 1990-05-31 | 1990-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415862U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06173384A (en) * | 1992-10-07 | 1994-06-21 | Kajima Corp | Curtain wall consisting of composite panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63236785A (en) * | 1987-03-26 | 1988-10-03 | 松下電器産業株式会社 | Electrode formation for ceramic electronic parts |
| JPH0216172A (en) * | 1988-07-05 | 1990-01-19 | Tatsuta Electric Wire & Cable Co Ltd | Solderable conductive paint |
-
1990
- 1990-05-31 JP JP5828890U patent/JPH0415862U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63236785A (en) * | 1987-03-26 | 1988-10-03 | 松下電器産業株式会社 | Electrode formation for ceramic electronic parts |
| JPH0216172A (en) * | 1988-07-05 | 1990-01-19 | Tatsuta Electric Wire & Cable Co Ltd | Solderable conductive paint |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06173384A (en) * | 1992-10-07 | 1994-06-21 | Kajima Corp | Curtain wall consisting of composite panel |