JPH0281010U - - Google Patents
Info
- Publication number
- JPH0281010U JPH0281010U JP16010588U JP16010588U JPH0281010U JP H0281010 U JPH0281010 U JP H0281010U JP 16010588 U JP16010588 U JP 16010588U JP 16010588 U JP16010588 U JP 16010588U JP H0281010 U JPH0281010 U JP H0281010U
- Authority
- JP
- Japan
- Prior art keywords
- lead frames
- component elements
- composite component
- view
- molded resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の複合部品の一実施例を示す断
面図、第２図、第３図、第４図は本考案の実施例
における複合部品の構成を示すリードフレーム上
のインダクタンス素子、及びキヤパシタンス素子
の配置平面図、第５図は従来の複合部品の構成を
示すリードフレーム上のインダクタンス素子、及
びキヤパシタンス素子の配置平面図、第６図はそ
のモールド樹脂による外装を施した複合部品の断
面図、第７図は複合部品をプリント基板上に配し
た斜視図、第８図はその等価回路図である。
１２……インダクタンス素子、１３……リード
フレーム、１４……外部引出し端子、１５……キ
ヤパシタンス素子、１６……リードフレーム、１
７……外部引出し端子、１８……パイロツト穴、
１９……モールド樹脂。
FIG. 1 is a cross-sectional view showing an embodiment of the composite component of the present invention, and FIGS. 2, 3, and 4 are inductance elements on a lead frame showing the configuration of the composite component in the embodiment of the present invention, and Fig. 5 is a plan view of the arrangement of the capacitance element, and Fig. 5 is a plan view of the arrangement of the inductance element on the lead frame and the capacitance element, showing the configuration of a conventional composite part. Fig. 6 is a cross section of the composite part covered with the molded resin. 7 is a perspective view of the composite component arranged on a printed circuit board, and FIG. 8 is an equivalent circuit diagram thereof. 12... Inductance element, 13... Lead frame, 14... External lead terminal, 15... Capacitance element, 16... Lead frame, 1
7... External lead-out terminal, 18... Pilot hole,
19...Mold resin.
Claims (1)
レーム上に取付け、この部品素子を取付けたリー
ドフレームを２枚以上重ね合わせたものをモール
ド樹脂により外装してなる複合部品。 A composite component made by mounting the same or different component elements on respective lead frames, stacking two or more lead frames with these component elements attached and covering them with molded resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16010588U JPH0281010U (en) | 1988-12-08 | 1988-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16010588U JPH0281010U (en) | 1988-12-08 | 1988-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281010U true JPH0281010U (en) | 1990-06-22 |
Family
ID=31441879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16010588U Pending JPH0281010U (en) | 1988-12-08 | 1988-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281010U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163602A (en) * | 1985-01-11 | 1986-07-24 | 株式会社村田製作所 | Manufacture of electronic component |
-
1988
- 1988-12-08 JP JP16010588U patent/JPH0281010U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163602A (en) * | 1985-01-11 | 1986-07-24 | 株式会社村田製作所 | Manufacture of electronic component |
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