JPH0458898B2 - - Google Patents

Info

Publication number
JPH0458898B2
JPH0458898B2 JP60172785A JP17278585A JPH0458898B2 JP H0458898 B2 JPH0458898 B2 JP H0458898B2 JP 60172785 A JP60172785 A JP 60172785A JP 17278585 A JP17278585 A JP 17278585A JP H0458898 B2 JPH0458898 B2 JP H0458898B2
Authority
JP
Japan
Prior art keywords
pressure
detection element
wafer
calibration
verification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60172785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232332A (ja
Inventor
Masaru Inagaki
Atsushi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Priority to JP60172785A priority Critical patent/JPS6232332A/ja
Publication of JPS6232332A publication Critical patent/JPS6232332A/ja
Publication of JPH0458898B2 publication Critical patent/JPH0458898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/082Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to a condition of the discharged jet or spray, e.g. to jet shape, spray pattern or droplet size

Landscapes

  • Measuring Fluid Pressure (AREA)
JP60172785A 1985-08-05 1985-08-05 圧力検出素子の検定方法及び装置 Granted JPS6232332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60172785A JPS6232332A (ja) 1985-08-05 1985-08-05 圧力検出素子の検定方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60172785A JPS6232332A (ja) 1985-08-05 1985-08-05 圧力検出素子の検定方法及び装置

Publications (2)

Publication Number Publication Date
JPS6232332A JPS6232332A (ja) 1987-02-12
JPH0458898B2 true JPH0458898B2 (enExample) 1992-09-18

Family

ID=15948305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60172785A Granted JPS6232332A (ja) 1985-08-05 1985-08-05 圧力検出素子の検定方法及び装置

Country Status (1)

Country Link
JP (1) JPS6232332A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100350777B1 (ko) * 2000-08-18 2002-08-28 한국생산기술연구원 분사노즐의 압력측정장치 및 그 방법
WO2006008337A1 (en) * 2004-07-21 2006-01-26 Afore Oy Pressure testing apparatus and method for pressure testing
US20090039908A1 (en) * 2006-04-26 2009-02-12 Tokyo Electron Limited Microstructure inspecting apparatus and microstructure inspecting method
US8916113B2 (en) 2009-02-27 2014-12-23 Hitachi High-Technologies Corporation Chemical analyzer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456378A (en) * 1977-10-14 1979-05-07 Hitachi Ltd Wafer prober apparatus
JPS55125639A (en) * 1979-03-23 1980-09-27 Hitachi Ltd Inspection apparatus
JPS56107142A (en) * 1980-01-31 1981-08-25 Toshiba Corp Property evaluation device for semiconductor pressure detection element
JPS57122546U (enExample) * 1981-01-23 1982-07-30

Also Published As

Publication number Publication date
JPS6232332A (ja) 1987-02-12

Similar Documents

Publication Publication Date Title
US6127831A (en) Method of testing a semiconductor device by automatically measuring probe tip parameters
US3996517A (en) Apparatus for wafer probing having surface level sensing
CN101551231B (zh) 校准方法、针尖位置检测装置和探针装置
CN113866603B (zh) 一种mems压力传感器芯片的圆片级测试装置及测试方法
JP2003050271A (ja) プローブカード特性測定装置、プローブ装置及びプローブ方法
CN110501539A (zh) 用于探针卡制造、检测及维修的设备及其使用方法
CN110108238A (zh) 一种用于测量零件平面度的测量系统和测量方法
US4708012A (en) Method and apparatus for high pressure testing of solid state pressure sensors
CN109211182A (zh) 一种电路板形变度测量装置和方法
JP2013179329A (ja) 針先位置検出装置及びプローブ装置
CN211013057U (zh) 一种比例伺服阀的检测设备
US4662074A (en) Method and apparatus for determining precision of numerically controlled machine tool devices
US7847569B2 (en) Probe device and method of regulating contact pressure between object to be inspected and probe
WO2018139930A1 (en) None contact shear testing
Beutel et al. Cell manipulation system based on a self-calibrating silicon micro force sensor providing capillary status monitoring
CN118707276B (zh) 一种控制探测器的探头与晶圆之间距离的方法和装置
JPS6232332A (ja) 圧力検出素子の検定方法及び装置
JPH02504427A (ja) 位置決定装置用テストバー
CN218895752U (zh) 一种微小形变综合试验台
Chen et al. Wafer-level test system using a physical stimulus for a MEMS accelerometer
JP2003315196A (ja) 圧力センサの製造方法およびその製造方法に用いる測定装置
JPH01227448A (ja) ウエハプローバ
Ham et al. Design, fabrication, and characterization of piezoresisitve strain gage-based pressure sensors for mechatronic systems
CN219121627U (zh) 一种力传感器气动测量装置
CN114088526A (zh) 一种胶接试件的测量装置及方法