JPS56107142A - Property evaluation device for semiconductor pressure detection element - Google Patents

Property evaluation device for semiconductor pressure detection element

Info

Publication number
JPS56107142A
JPS56107142A JP1024380A JP1024380A JPS56107142A JP S56107142 A JPS56107142 A JP S56107142A JP 1024380 A JP1024380 A JP 1024380A JP 1024380 A JP1024380 A JP 1024380A JP S56107142 A JPS56107142 A JP S56107142A
Authority
JP
Japan
Prior art keywords
pressure sensor
pressure
detected
detection element
reference pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1024380A
Other languages
Japanese (ja)
Inventor
Shunji Shiromizu
Ryuzo Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1024380A priority Critical patent/JPS56107142A/en
Publication of JPS56107142A publication Critical patent/JPS56107142A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
    • G01L27/002—Calibrating, i.e. establishing true relation between transducer output value and value to be measured, zeroing, linearising or span error determination

Abstract

PURPOSE:To arrange so that quick measurement and evaluation may be made by compensating for a comparison reference semiconductor pressure detection element through utilization of various compensation functions and comparing the properties of a pressure detection element to be measured under the same conditions as the former element. CONSTITUTION:An output from a reference pressure sensor 11 which operates in response to a pressure applied by a pressure device 13 is detected/amplified after being conducted to an amplification circuit 14. Part of the detected output is fed back to the reference pressure sensor 11 through a sensitivity adjustment circuit 15 and a linearization circuit 16. This feedback loop makes compensation for properties complying to the specification of the reference pressure sensor 11, so that the action of the reference pressure sensor 11 is corrected through comparison with a reference value. Its detected pressure value is input to an arithmetic control device 18 through the intermediary of A/D converter 17. In the meantime, a measured pressure sensor 12 is driven on the same conditions as the reference pressure sensor 11. While the arithmetic control device 18 samples a detected output from the reference pressure sensor 11 and compares the sample with a comparison reference data. Property evaluation data under various conditions such as temperature, pressure is printed out through a data output device.
JP1024380A 1980-01-31 1980-01-31 Property evaluation device for semiconductor pressure detection element Pending JPS56107142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1024380A JPS56107142A (en) 1980-01-31 1980-01-31 Property evaluation device for semiconductor pressure detection element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1024380A JPS56107142A (en) 1980-01-31 1980-01-31 Property evaluation device for semiconductor pressure detection element

Publications (1)

Publication Number Publication Date
JPS56107142A true JPS56107142A (en) 1981-08-25

Family

ID=11744858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1024380A Pending JPS56107142A (en) 1980-01-31 1980-01-31 Property evaluation device for semiconductor pressure detection element

Country Status (1)

Country Link
JP (1) JPS56107142A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60159624A (en) * 1984-01-31 1985-08-21 Toshiba Corp Calibrating device of pressure measuring device
JPS6232332A (en) * 1985-08-05 1987-02-12 Toyota Central Res & Dev Lab Inc Method and device for testing pressure detecting element
JPS6390139U (en) * 1986-12-01 1988-06-11
JPH0379950A (en) * 1990-06-08 1991-04-04 Noritz Corp Automatic bath device
US5479813A (en) * 1994-05-16 1996-01-02 General Electric Company Sensor matching through real-time output compensation
JP2009539683A (en) * 2006-06-05 2009-11-19 カブリコ コーポレイション Tire pressure monitoring method and apparatus
CN108024736A (en) * 2015-09-07 2018-05-11 欧姆龙健康医疗事业株式会社 The inspection method of pressure pulse wave sensor and the manufacture method of pressure pulse wave sensor

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60159624A (en) * 1984-01-31 1985-08-21 Toshiba Corp Calibrating device of pressure measuring device
JPS6232332A (en) * 1985-08-05 1987-02-12 Toyota Central Res & Dev Lab Inc Method and device for testing pressure detecting element
JPH0458898B2 (en) * 1985-08-05 1992-09-18 Toyoda Chuo Kenkyusho Kk
JPS6390139U (en) * 1986-12-01 1988-06-11
JPH0379950A (en) * 1990-06-08 1991-04-04 Noritz Corp Automatic bath device
JPH0457940B2 (en) * 1990-06-08 1992-09-16 Noritsu Kk
US5479813A (en) * 1994-05-16 1996-01-02 General Electric Company Sensor matching through real-time output compensation
JP2009539683A (en) * 2006-06-05 2009-11-19 カブリコ コーポレイション Tire pressure monitoring method and apparatus
JP2014073841A (en) * 2006-06-05 2014-04-24 Kavlico Corp Method and apparatus for tire pressure monitoring
CN108024736A (en) * 2015-09-07 2018-05-11 欧姆龙健康医疗事业株式会社 The inspection method of pressure pulse wave sensor and the manufacture method of pressure pulse wave sensor
EP3332702A4 (en) * 2015-09-07 2019-04-17 Omron Healthcare Co., Ltd. Method of inspecting pressure pulse wave sensor, and method of manufacturing pressure pulse wave sensor

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