JPS56107142A - Property evaluation device for semiconductor pressure detection element - Google Patents
Property evaluation device for semiconductor pressure detection elementInfo
- Publication number
- JPS56107142A JPS56107142A JP1024380A JP1024380A JPS56107142A JP S56107142 A JPS56107142 A JP S56107142A JP 1024380 A JP1024380 A JP 1024380A JP 1024380 A JP1024380 A JP 1024380A JP S56107142 A JPS56107142 A JP S56107142A
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- pressure
- detected
- detection element
- reference pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title abstract 3
- 238000011156 evaluation Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000003321 amplification Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 238000003199 nucleic acid amplification method Methods 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
- G01L27/002—Calibrating, i.e. establishing true relation between transducer output value and value to be measured, zeroing, linearising or span error determination
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
PURPOSE:To arrange so that quick measurement and evaluation may be made by compensating for a comparison reference semiconductor pressure detection element through utilization of various compensation functions and comparing the properties of a pressure detection element to be measured under the same conditions as the former element. CONSTITUTION:An output from a reference pressure sensor 11 which operates in response to a pressure applied by a pressure device 13 is detected/amplified after being conducted to an amplification circuit 14. Part of the detected output is fed back to the reference pressure sensor 11 through a sensitivity adjustment circuit 15 and a linearization circuit 16. This feedback loop makes compensation for properties complying to the specification of the reference pressure sensor 11, so that the action of the reference pressure sensor 11 is corrected through comparison with a reference value. Its detected pressure value is input to an arithmetic control device 18 through the intermediary of A/D converter 17. In the meantime, a measured pressure sensor 12 is driven on the same conditions as the reference pressure sensor 11. While the arithmetic control device 18 samples a detected output from the reference pressure sensor 11 and compares the sample with a comparison reference data. Property evaluation data under various conditions such as temperature, pressure is printed out through a data output device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1024380A JPS56107142A (en) | 1980-01-31 | 1980-01-31 | Property evaluation device for semiconductor pressure detection element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1024380A JPS56107142A (en) | 1980-01-31 | 1980-01-31 | Property evaluation device for semiconductor pressure detection element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56107142A true JPS56107142A (en) | 1981-08-25 |
Family
ID=11744858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1024380A Pending JPS56107142A (en) | 1980-01-31 | 1980-01-31 | Property evaluation device for semiconductor pressure detection element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56107142A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60159624A (en) * | 1984-01-31 | 1985-08-21 | Toshiba Corp | Calibrating device of pressure measuring device |
JPS6232332A (en) * | 1985-08-05 | 1987-02-12 | Toyota Central Res & Dev Lab Inc | Verification method and device for pressure detection element |
JPS6390139U (en) * | 1986-12-01 | 1988-06-11 | ||
JPH0379950A (en) * | 1990-06-08 | 1991-04-04 | Noritz Corp | Automatic bath device |
US5479813A (en) * | 1994-05-16 | 1996-01-02 | General Electric Company | Sensor matching through real-time output compensation |
JP2009539683A (en) * | 2006-06-05 | 2009-11-19 | カブリコ コーポレイション | Tire pressure monitoring method and apparatus |
CN108024736A (en) * | 2015-09-07 | 2018-05-11 | 欧姆龙健康医疗事业株式会社 | The inspection method of pressure pulse wave sensor and the manufacture method of pressure pulse wave sensor |
-
1980
- 1980-01-31 JP JP1024380A patent/JPS56107142A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60159624A (en) * | 1984-01-31 | 1985-08-21 | Toshiba Corp | Calibrating device of pressure measuring device |
JPS6232332A (en) * | 1985-08-05 | 1987-02-12 | Toyota Central Res & Dev Lab Inc | Verification method and device for pressure detection element |
JPS6390139U (en) * | 1986-12-01 | 1988-06-11 | ||
JPH0379950A (en) * | 1990-06-08 | 1991-04-04 | Noritz Corp | Automatic bath device |
US5479813A (en) * | 1994-05-16 | 1996-01-02 | General Electric Company | Sensor matching through real-time output compensation |
JP2009539683A (en) * | 2006-06-05 | 2009-11-19 | カブリコ コーポレイション | Tire pressure monitoring method and apparatus |
JP2014073841A (en) * | 2006-06-05 | 2014-04-24 | Kavlico Corp | Method and apparatus for tire pressure monitoring |
CN108024736A (en) * | 2015-09-07 | 2018-05-11 | 欧姆龙健康医疗事业株式会社 | The inspection method of pressure pulse wave sensor and the manufacture method of pressure pulse wave sensor |
EP3332702A4 (en) * | 2015-09-07 | 2019-04-17 | Omron Healthcare Co., Ltd. | Method of inspecting pressure pulse wave sensor, and method of manufacturing pressure pulse wave sensor |
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