JPH0456185A - Fuse by print pattern - Google Patents
Fuse by print patternInfo
- Publication number
- JPH0456185A JPH0456185A JP16350890A JP16350890A JPH0456185A JP H0456185 A JPH0456185 A JP H0456185A JP 16350890 A JP16350890 A JP 16350890A JP 16350890 A JP16350890 A JP 16350890A JP H0456185 A JPH0456185 A JP H0456185A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- fuse
- temperature
- shape
- increases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000155 melt Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011889 copper foil Substances 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 230000000644 propagated effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリントサーキットボード上のパターンの一
部分を細くする事によって、不測の過電流が加わった時
にパターンを溶断してしまうパターンヒユーズに関する
ものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a pattern fuse that melts the pattern when an unexpected overcurrent is applied by thinning a part of the pattern on a printed circuit board. It is.
第2図(a)(b)は従来の技術を示すものである。 FIGS. 2(a) and 2(b) show a conventional technique.
第2図の従来の技術によれば、電子部品1か不測の故障
によりショートもしくはショートに近い状態になった場
合、パターンヒユーズ部2に流れる過電流によって、こ
の部分か発熱して溶断する事になる。しかしながら従来
の技術によれば、この部分での発熱が基材3を通じて逃
げてしまうことによって、このパターンヒユーズ部2が
溶断しにくくなる傾向があった。According to the conventional technology shown in FIG. 2, when the electronic component 1 becomes short-circuited or nearly short-circuited due to an unexpected failure, the overcurrent flowing through the pattern fuse section 2 causes this section to heat up and melt. Become. However, according to the conventional technology, the heat generated in this portion escapes through the base material 3, so that the pattern fuse portion 2 tends to be difficult to blow out.
しかしながら、従来の技術では、パターンヒユーズ部で
発生した熱か基材を熱伝導して逃げてしまう事によって
、溶断しなかったり、溶断するまでに必要以上の時間を
要するといった欠点があった。However, the conventional technology has the drawback that the heat generated in the pattern fuse part conducts heat through the base material and escapes, so that the fuse does not blow out or it takes more time than necessary to blow out the fuse.
そこで本発明は、従来のこの様な欠点を解決すべく、パ
ターンヒユーズ部での溶断が確実に行われる事を目的と
した。Therefore, the present invention aims to solve the above-mentioned drawbacks of the conventional technology and to ensure that the pattern fuse section is blown out.
上記課題を解決するために、本発明ではパターンヒユー
ズを有するパターン上の電子部品取り付けランドの形状
を延長して、上記パターンヒユーズ部を囲む様な形状に
した。In order to solve the above problem, in the present invention, the shape of the electronic component mounting land on the pattern having the pattern fuse is extended to surround the pattern fuse part.
従来の技術がパターンヒユーズ部で発熱した熱たけてパ
ターンを溶断しているのに比較して、本発明では、パタ
ーンヒユーズ部での発熱に加えて不測の故障によりショ
ートもしくはショートに近い状態になった電子部品から
の発熱も利用している。不測の故障によりショートもし
くはショートに近い状態になった電子部品からの発熱は
ランド部の銅箔を熱伝導し、このランド部が高温になる
が、本発明ではこのランド形状が延長され、バタンヒユ
ーズ部を囲んでいることによって、バタンヒユーズ部が
この熱によって加熱される。よってこのパターンヒユー
ズ部は、パターンヒユーズ部自身だけで発熱した時より
も、より早く高温になる。するとこのパターンヒユーズ
部のヒュースを形成している銅の抵抗値か上昇し、パタ
ーンヒユーズ部での電力消費が大きくなり、益々この部
分での発熱か大きくなり、やがてパターンヒユーズが溶
断に至る。またこのパターンヒユーズ部の発熱か増加し
てランド部よりも高温になった時も、電子部品からの発
熱か延長されたランド部を熱伝導し、かつパターンヒユ
ーズ部を囲んでいる事によって、パターンヒユーズ部で
発熱している熱が基材を伝って逃げにくくなる。よって
パターンヒユーズ部での温度がより早く上昇し、バタン
ヒユーズの溶断をより確実にするものである。In contrast to the conventional technology in which the pattern is blown out by the heat generated in the pattern fuse, in the present invention, in addition to the heat generated in the pattern fuse, an unexpected failure can cause a short or near-short condition. It also uses heat generated from electronic components. Heat generated from electronic components that have become short-circuited or nearly short-circuited due to an unexpected failure is thermally conducted through the copper foil on the land, causing the land to become hot. However, in the present invention, this land shape is extended, and the baton fuse By surrounding the area, the batten fuse area is heated by this heat. Therefore, this pattern fuse section reaches a high temperature more quickly than when the pattern fuse section itself generates heat. Then, the resistance value of the copper forming the fuse in this pattern fuse increases, power consumption in the pattern fuse increases, heat generation in this area increases, and eventually the pattern fuse blows out. In addition, even when the heat generated by the pattern fuse increases and becomes hotter than the land, the heat from the electronic components is conducted through the extended land, and by surrounding the pattern fuse, the pattern The heat generated in the fuse part is transmitted through the base material and becomes difficult to escape. Therefore, the temperature at the pattern fuse portion rises more quickly, and the blower fuse is more reliably blown out.
つまり、電子部品の発熱を有効にパターンヒユーズ部に
導く事によって、パターンヒユーズ部の温度上昇をより
加速するものである。In other words, by effectively guiding the heat generated by the electronic components to the pattern fuse part, the temperature rise in the pattern fuse part is further accelerated.
第1図(a)(b)は本特許によるパターンヒユーズで
ある。FIGS. 1(a) and 1(b) are pattern fuses according to this patent.
この図で示す様に、電子部品取り付け用のランド4の形
状が延長されて、過電流発生時に溶断する事を目的とし
たパターンヒユーズ部2を囲む様な形状をしている。こ
の事によって電子部品が不測の故障によって破壊した場
合、例えば、トランジスタとかダイオードが内部でショ
ートもしくはショートに近い状態になった場合、これら
の素子からの発熱が変形したランド部4の銅箔を伝って
、パターンヒユーズの周辺を高温にする。またこの様な
過電流が発生している状態では、電流値をI、パターン
ヒユーズ部の抵抗値をRとするとI2Rの電力がこのパ
ターンヒユーズ部で熱として消費される事になる。パタ
ーンヒユーズ部2の抵抗値Rは、銅の特性から温度が上
がるほど抵抗値が大きくなるから、ここでの消費電力も
大きくなりやかて銅箔が溶断に至るまでの温度に達成す
る。As shown in this figure, the shape of the land 4 for mounting electronic components is extended to surround a pattern fuse portion 2 intended to blow out when an overcurrent occurs. As a result, if an electronic component is destroyed due to an unexpected failure, for example, if a transistor or diode is short-circuited or nearly short-circuited internally, the heat generated from these elements will be transmitted through the deformed copper foil of the land portion 4. to raise the temperature around the pattern fuse. Further, in a state where such an overcurrent is generated, if the current value is I and the resistance value of the pattern fuse part is R, the power of I2R will be consumed as heat in this pattern fuse part. Since the resistance value R of the pattern fuse portion 2 increases as the temperature rises due to the characteristics of copper, the power consumption here also increases and the temperature reaches a point where the copper foil melts.
またヒユーズパターン2が温度上昇している間も本発明
の特徴であるヒユーズパターン2を囲む様な形状のラン
ド4によって、ヒユーズパターン2で発生した熱を逃げ
に<<シているので、従来技術に比べてより早くヒユー
ズパターン2の温度上昇が可能となっている。Furthermore, even when the temperature of the fuse pattern 2 is rising, the land 4 which is shaped to surround the fuse pattern 2, which is a feature of the present invention, allows the heat generated in the fuse pattern 2 to escape. This allows the temperature of the fuse pattern 2 to rise more quickly than in the previous example.
以上説明した様に、本発明によれば、電子部品の異常が
発生し、ショートもしくはショートに近い状態になった
時に、従来の技術に比較して、より早くパターンヒユー
ズ部を溶断させる事により電子部品や基材の発熱、燃焼
などを短時間で停市させ、発煙、延焼、火災等の被害を
未然に防止したり、最小限にとどめる事に効果がある。As explained above, according to the present invention, when an abnormality occurs in an electronic component and a short-circuit or near-circuit occurs, the pattern fuse section is blown out more quickly than in the conventional technology. It is effective in stopping the heat generation and combustion of parts and base materials in a short time, preventing or minimizing damage such as smoke, spread of fire, and fire.
第1図(a)、(b)は、本発明の実施例を示す図。 第2図(a)、(b)は、従来例を示す図。 以上 出願人 セイコーエプソン株式会社 FIGS. 1(a) and 1(b) are diagrams showing an embodiment of the present invention. FIGS. 2(a) and 2(b) are diagrams showing a conventional example. that's all Applicant: Seiko Epson Corporation
Claims (1)
って不測の過電流が流れた時に溶断するパターンヒュー
ズに於いて、上記パターンに接続される電子部品の取り
付けランドの形状を延長して、上記パターンヒューズ部
を囲むよう形成にした事を特徴とするプリントパターン
によるヒューズ。In a pattern fuse that melts when a part of the pattern on a printed circuit board becomes thin and an unexpected overcurrent flows, the shape of the mounting land of the electronic component connected to the pattern is extended to create the pattern fuse. A fuse with a printed pattern characterized by being formed so as to surround a portion of the fuse.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16350890A JPH0456185A (en) | 1990-06-21 | 1990-06-21 | Fuse by print pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16350890A JPH0456185A (en) | 1990-06-21 | 1990-06-21 | Fuse by print pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0456185A true JPH0456185A (en) | 1992-02-24 |
Family
ID=15775200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16350890A Pending JPH0456185A (en) | 1990-06-21 | 1990-06-21 | Fuse by print pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0456185A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999043061A1 (en) * | 1998-02-23 | 1999-08-26 | Mitsubishi Materials Corporation | Surge absorber |
JP2011243918A (en) * | 2010-05-21 | 2011-12-01 | Sharp Corp | Circuit board and electrical equipment equipped with circuit board |
-
1990
- 1990-06-21 JP JP16350890A patent/JPH0456185A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999043061A1 (en) * | 1998-02-23 | 1999-08-26 | Mitsubishi Materials Corporation | Surge absorber |
US6285535B1 (en) * | 1998-02-23 | 2001-09-04 | Mitsubishi Materials Corporation | Surge absorber |
JP2011243918A (en) * | 2010-05-21 | 2011-12-01 | Sharp Corp | Circuit board and electrical equipment equipped with circuit board |
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