JP2009043815A - Protection device - Google Patents

Protection device Download PDF

Info

Publication number
JP2009043815A
JP2009043815A JP2007205273A JP2007205273A JP2009043815A JP 2009043815 A JP2009043815 A JP 2009043815A JP 2007205273 A JP2007205273 A JP 2007205273A JP 2007205273 A JP2007205273 A JP 2007205273A JP 2009043815 A JP2009043815 A JP 2009043815A
Authority
JP
Japan
Prior art keywords
switching element
heat
thermal fuse
heat conductive
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007205273A
Other languages
Japanese (ja)
Inventor
Tetsuro Kahara
哲朗 花原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2007205273A priority Critical patent/JP2009043815A/en
Publication of JP2009043815A publication Critical patent/JP2009043815A/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Structure Of Printed Boards (AREA)
  • Secondary Cells (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a protection device which is used mainly for a battery cell unit in various types of electronic devices and which can reliably protect an electronic circuit with a simple arrangement. <P>SOLUTION: A heat conductive pattern 10 is provided on the upper surface of a wiring circuit board 1 to extend from the lower surface of a switching element 2 to the inner edge of a through hole 8, a heat conductive resin 9 is coated and formed between the outer periphery of a temperature fuse 5 and the switching element 2, so that heat generated by the switching element 2 can be reliably transmitted to the temperature fuse 5 with less variations, not only from the heat conductive resin 9 but also from the heat conductive pattern 10 having a good thermal conductivity. Consequently, the protection device capable of reliably protecting an electronic circuit can be obtained with a simple arrangement. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、主に各種電子機器の電池ユニットに用いられる保護装置に関するものである。   The present invention relates to a protection device mainly used for battery units of various electronic devices.

近年、ノートパソコンやビデオカメラ等の携帯機器においては、充電可能な電池を装着すると共に、携帯時にはこの電池電源を用いて様々な操作が行われており、これらの機器に用いられる電池ユニットにおいても、安価で、確実な電子回路の保護を行えるものが求められている。   In recent years, portable devices such as notebook computers and video cameras are equipped with a rechargeable battery, and various operations have been performed using this battery power source when being carried. Also in battery units used for these devices, There is a need for an inexpensive and reliable electronic circuit protection.

このような従来の保護装置について、図7〜図12を用いて説明する。   Such a conventional protection device will be described with reference to FIGS.

図7は従来の保護装置の断面図、図8は同斜視図であり、同図において、1は上下面に複数の配線パターン(図示せず)が形成された配線基板、2はFETやトランジスタ等のスイッチング素子で、配線基板1上面の複数のランド3に、スイッチング素子2の複数の端子4が半田付けによって実装接続されると共に、配線パターンを介してスイッチング素子2が電池(図示せず)や機器の電子回路(図示せず)に接続されている。   7 is a cross-sectional view of a conventional protective device, and FIG. 8 is a perspective view thereof. In FIG. 7, reference numeral 1 denotes a wiring board having a plurality of wiring patterns (not shown) formed on the upper and lower surfaces, and 2 denotes an FET or transistor. A plurality of terminals 4 of the switching element 2 are mounted and connected to a plurality of lands 3 on the upper surface of the wiring board 1 by soldering, and the switching element 2 is connected to a battery (not shown) via a wiring pattern. And an electronic circuit (not shown) of the device.

そして、5は温度ヒューズで、左右の端子6がランド7に半田付けされて、スイッチング素子2と電池の間に接続され、スイッチング素子2左方近傍の配線基板1の貫通孔8に装着されると共に、この温度ヒューズ5外周とスイッチング素子2との間、及び貫通孔8内には、シリコーン等の熱伝導性樹脂9が塗布されて、保護装置が構成されている。   Reference numeral 5 denotes a thermal fuse. The left and right terminals 6 are soldered to the lands 7 and connected between the switching element 2 and the battery, and are attached to the through holes 8 of the wiring board 1 near the left side of the switching element 2. At the same time, a thermal conductive resin 9 such as silicone is applied between the outer periphery of the thermal fuse 5 and the switching element 2 and in the through hole 8 to constitute a protective device.

また、このような保護装置を製作する際には、先ず図9の分解斜視図に示すように、配線基板1上面のランド3や7上面にクリーム半田(図示せず)を印刷した後、ランド3にスイッチング素子2の端子4を載置し加熱して、図10の斜視図に示すように、配線基板1にスイッチング素子2を半田付けする。   Further, when manufacturing such a protective device, first, as shown in the exploded perspective view of FIG. 9, after solder cream (not shown) is printed on the lands 3 and 7 on the upper surface of the wiring substrate 1, 3, the terminal 4 of the switching element 2 is placed and heated, and the switching element 2 is soldered to the wiring board 1 as shown in the perspective view of FIG.

そして、図11の分解斜視図に示すように、貫通孔8をテープ(図示せず)等によって配線基板1裏面から塞ぎ、貫通孔8内とその周囲、スイッチング素子2との間に熱伝導性樹脂9を塗布した後、図12の斜視図に示すように、この熱伝導性樹脂9内に温度ヒューズ5を埋め込むと共に、左右の端子6をランド7に載置する。   Then, as shown in the exploded perspective view of FIG. 11, the through-hole 8 is closed from the back surface of the wiring board 1 with a tape (not shown) or the like, and the thermal conductivity between the inside of the through-hole 8 and its periphery and the switching element 2. After applying the resin 9, as shown in the perspective view of FIG. 12, the thermal fuse 5 is embedded in the thermally conductive resin 9 and the left and right terminals 6 are placed on the lands 7.

さらに、この後、温度ヒューズ5に大きな熱が加わらないように、手作業によって端子6をランド7に半田付けし、熱伝導性樹脂9を乾燥させ、貫通孔8裏面を塞いだテープ等を剥がして、図7や図8に示すような保護装置が完成する。   Further, after that, the terminal 6 is soldered to the land 7 by manual work so that a large heat is not applied to the thermal fuse 5, the heat conductive resin 9 is dried, and the tape etc. which closes the back surface of the through hole 8 is peeled off. Thus, the protection device as shown in FIGS. 7 and 8 is completed.

以上の構成において、機器を携帯時には、スイッチング素子2を介して電池から電子回路に電源が供給されて、機器の様々な操作が行われ、また、電池に充電を行う際には、スイッチング素子2が切換えられ、このスイッチング素子2を介して充電器等から電池に充電が行われる。   In the above configuration, when the device is carried, power is supplied from the battery to the electronic circuit through the switching element 2 to perform various operations of the device, and when the battery is charged, the switching element 2 is used. The battery is charged from a charger or the like through the switching element 2.

なお、このような機器の操作時や電池への充電時等に、万が一、回路の短絡等が生じスイッチング素子2に過電流が流れた場合、この過電流によってスイッチング素子2が発熱し、この熱が熱伝導性樹脂9に伝わり、さらに熱伝導性樹脂9を介して温度ヒューズ5に伝わる。   In the event that such a device is operated or a battery is charged, if a short circuit occurs and an overcurrent flows through the switching element 2, the overcurrent causes the switching element 2 to generate heat, and this heat Is transmitted to the thermal conductive resin 9 and further transmitted to the thermal fuse 5 through the thermal conductive resin 9.

そして、過電流がある程度以上流れ、温度ヒューズ5に伝わる熱が所定温度以上になった場合には、温度ヒューズ5が溶断して、電池からのスイッチング素子2や電子回路への電源供給が遮断される。   When the overcurrent flows to some extent and the heat transmitted to the thermal fuse 5 reaches a predetermined temperature or more, the thermal fuse 5 is melted and the power supply from the battery to the switching element 2 and the electronic circuit is cut off. The

つまり、電池とスイッチング素子2の間に接続された温度ヒューズ5が、過電流等によるスイッチング素子2の発熱を検出し、この熱が所定温度以上になった場合には、電池からの電源供給を遮断することによって、短絡等による機器の損傷を未然に防ぐようになっている。   That is, the thermal fuse 5 connected between the battery and the switching element 2 detects the heat generation of the switching element 2 due to overcurrent or the like, and when this heat exceeds a predetermined temperature, the power supply from the battery is turned off. By shutting off, the device is prevented from being damaged due to a short circuit or the like.

また、温度ヒューズ5を配線基板1の貫通孔8に装着することによって、配線基板1上面に温度ヒューズ5を載置した場合に比べ、装置全体の低背化を図ると共に、温度ヒューズ5外周とスイッチング素子2との間に塗布した熱伝導性樹脂9によって、スイッチング素子2の発熱を温度ヒューズ5へ確実に伝えるように構成されているものであった。   Further, by mounting the thermal fuse 5 in the through hole 8 of the wiring board 1, the overall height of the apparatus can be reduced compared to the case where the thermal fuse 5 is placed on the upper surface of the wiring board 1, and the outer periphery of the thermal fuse 5 The heat conductive resin 9 applied between the switching element 2 and the switching element 2 is configured to reliably transmit the heat generated by the switching element 2 to the thermal fuse 5.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。
特開平11−330665号公報
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 11-330665

しかしながら、上記従来の保護装置においては、温度ヒューズ5を配線基板1の貫通孔8に装着することによって、装置全体の低背化を図ることが可能にはなっているものの、温度ヒューズ5外周や貫通孔8内に塗布された熱伝導性樹脂9の上面や下面から、スイッチング素子2の熱が放熱されてしまうため、装置が使用される条件によっては、熱の伝わり具合にばらつきを生じる場合があるという課題があった。   However, in the above-described conventional protection device, the thermal fuse 5 is mounted in the through hole 8 of the wiring board 1 so that the overall height of the device can be reduced. Since the heat of the switching element 2 is dissipated from the upper surface and the lower surface of the heat conductive resin 9 applied in the through-hole 8, depending on the conditions in which the device is used, the heat transmission may vary. There was a problem that there was.

本発明は、このような従来の課題を解決するものであり、簡易な構成で、確実な電子回路の保護が可能な保護装置を提供することを目的とする。   The present invention solves such a conventional problem, and an object of the present invention is to provide a protection device capable of reliably protecting an electronic circuit with a simple configuration.

上記目的を達成するために本発明は、配線基板上面にスイッチング素子下面から、貫通孔内縁に延出する熱伝導パターンを設けると共に、温度ヒューズ外周とスイッチング素子との間に、熱伝導性樹脂を塗布形成して保護装置を構成したものであり、熱伝導性樹脂に加え、スイッチング素子下面から貫通孔内縁に延出した、銅等の熱伝導性の良好な熱伝導パターンによって、スイッチング素子の発熱を温度ヒューズに、ばらつきが少なく確実に伝えることができるため、簡易な構成で、確実な電子回路の保護が可能な保護装置を得ることができるという作用を有するものである。   In order to achieve the above object, the present invention provides a thermal conductive pattern extending from the lower surface of the switching element to the inner edge of the through hole on the upper surface of the wiring board, and a thermal conductive resin between the outer periphery of the thermal fuse and the switching element. The protection device is configured by coating and forming, and in addition to the heat conductive resin, the heat generated by the switching element is extended by the heat conductive pattern with good heat conductivity, such as copper, extending from the lower surface of the switching element to the inner edge of the through hole. Therefore, it is possible to obtain a protective device capable of reliably protecting an electronic circuit with a simple configuration.

以上のように本発明によれば、簡易な構成で、確実な電子回路の保護が可能な保護装置を実現することができるという有利な効果が得られる。   As described above, according to the present invention, it is possible to obtain an advantageous effect that it is possible to realize a protective device capable of reliably protecting an electronic circuit with a simple configuration.

以下、本発明の実施の形態について、図1〜図6を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

なお、背景技術の項で説明した構成と同一構成の部分には同一符号を付して、詳細な説明を簡略化する。   In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure demonstrated in the term of background art, and detailed description is simplified.

(実施の形態)
図1は本発明の一実施の形態による保護装置の断面図、図2は同斜視図であり、同図において、1は紙フェノールやガラス入りエポキシ等の配線基板で、上下面には銅等によって複数の配線パターン(図示せず)が形成されると共に、上面には複数のランド3や7が設けられている。
(Embodiment)
FIG. 1 is a cross-sectional view of a protective device according to an embodiment of the present invention, FIG. 2 is a perspective view thereof, in which 1 is a wiring board such as paper phenol or epoxy containing glass, and copper and the like are provided on the upper and lower surfaces. Thus, a plurality of wiring patterns (not shown) are formed, and a plurality of lands 3 and 7 are provided on the upper surface.

そして、2はFETやトランジスタ等のスイッチング素子で、配線基板1上面の複数のランド3に、複数の端子4が半田付けによって実装接続され、配線パターンを介してスイッチング素子2が電池(図示せず)や機器の電子回路(図示せず)に接続されている。   Reference numeral 2 denotes a switching element such as an FET or a transistor. A plurality of terminals 4 are mounted and connected to a plurality of lands 3 on the upper surface of the wiring substrate 1 by soldering, and the switching element 2 is connected to a battery (not shown) via the wiring pattern. ) Or an electronic circuit (not shown) of the device.

また、5は略円筒状でセラミック等の筒内に可溶金属が内蔵された温度ヒューズで、左右の端子6がランド7に半田付けされて、スイッチング素子2と電池の間に接続されると共に、スイッチング素子2左方近傍の配線基板1の貫通孔8に装着されている。   Reference numeral 5 denotes a temperature fuse having a substantially cylindrical shape in which a fusible metal is built in a cylinder such as a ceramic. The left and right terminals 6 are soldered to the lands 7 and connected between the switching element 2 and the battery. The switching element 2 is mounted in the through hole 8 of the wiring board 1 near the left side.

さらに、10は略T字状で銅箔や銀等の熱伝導パターンで、図1や図3の分解斜視図に示すように、配線基板1上面をスイッチング素子2下面から貫通孔8に延出する平坦部10Aと、貫通孔8内縁にスルーホール状に設けられた中空筒部10Bから形成されている。   Further, 10 is a substantially T-shaped heat conduction pattern such as copper foil or silver, and the upper surface of the wiring board 1 extends from the lower surface of the switching element 2 to the through hole 8 as shown in the exploded perspective views of FIGS. And a hollow cylinder portion 10B provided in a through hole shape at the inner edge of the through hole 8.

そして、配線基板1の熱伝導パターン10やランド3、7を除く全面をポリエステルやエポキシ等の絶縁層(図示せず)が覆うと共に、温度ヒューズ5外周とスイッチング素子2との間、及び貫通孔8内には、シリコーン等の熱伝導性樹脂9が塗布形成されて、保護装置が構成されている。   The entire surface of the wiring board 1 excluding the heat conduction pattern 10 and the lands 3 and 7 is covered with an insulating layer (not shown) such as polyester or epoxy, and between the outer periphery of the thermal fuse 5 and the switching element 2 and through holes. In 8, a heat conductive resin 9 such as silicone is applied and formed to constitute a protective device.

また、このような保護装置を製作する際には、先ず図3の分解斜視図に示すように、配線基板1上面のランド3や7上面にクリーム半田(図示せず)を印刷した後、ランド3にスイッチング素子2の端子4を載置し加熱して、図4の斜視図に示すように、配線基板1にスイッチング素子2を半田付けする。   When manufacturing such a protective device, first, as shown in the exploded perspective view of FIG. 3, after solder cream (not shown) is printed on the lands 3 and 7 on the upper surface of the wiring substrate 1, The terminal 4 of the switching element 2 is placed on 3 and heated, and the switching element 2 is soldered to the wiring board 1 as shown in the perspective view of FIG.

なお、この時、ランド7には上面全面ではなく両端にクリーム半田を印刷することによって、加熱後、印刷され溶融硬化した半田によって、上面両端に突出部7Aが形成される。   At this time, the solder 7 is printed on the lands 7 not on the entire upper surface but on both ends, so that the protrusions 7A are formed on both ends of the upper surface by the solder that is printed and melted and hardened after heating.

そして、図5の分解斜視図に示すように、貫通孔8をテープ(図示せず)等によって配線基板1裏面から塞ぎ、貫通孔8内とその周囲、スイッチング素子2との間に熱伝導性樹脂9を塗布した後、図6の斜視図に示すように、この熱伝導性樹脂9内に温度ヒューズ5を埋め込むと共に、左右の端子6をランド7の突出部7Aの間に載置する。   Then, as shown in the exploded perspective view of FIG. 5, the through-hole 8 is closed from the back surface of the wiring board 1 with a tape (not shown) or the like, and the thermal conductivity between the inside of the through-hole 8 and its periphery and the switching element 2. After applying the resin 9, as shown in the perspective view of FIG. 6, the thermal fuse 5 is embedded in the thermally conductive resin 9 and the left and right terminals 6 are placed between the protruding portions 7 </ b> A of the land 7.

さらに、この後、温度ヒューズ5に大きな熱が加わらないように、手作業によって端子6をランド7に半田付けし、熱伝導性樹脂9を乾燥させ、貫通孔8裏面を塞いだテープ等を剥がして、図1や図2に示すような保護装置が完成する。   Further, after that, the terminal 6 is soldered to the land 7 by manual work so that a large heat is not applied to the thermal fuse 5, the heat conductive resin 9 is dried, and the tape etc. which closes the back surface of the through hole 8 is peeled off. Thus, the protection device as shown in FIGS. 1 and 2 is completed.

なお、この温度ヒューズ5をランド7に半田付けする際、左右のランド7上面には図6に示すように、両端に突出部7Aが形成されているため、左右の端子6を各々この突出部7Aの間に載置して、ずれの少ない位置決めをした状態で温度ヒューズ5を配置できると共に、新たな半田を用いることなく、この突出部7Aを半田ごて等で溶融するだけで、端子6のランド7への半田付けを行うことができる。   When the thermal fuse 5 is soldered to the lands 7, the left and right lands 7 have protrusions 7A at both ends as shown in FIG. The thermal fuse 5 can be placed in a state where it is placed between 7A and positioned with little displacement, and the terminal 6 is simply melted with a soldering iron or the like without using new solder. Soldering to the land 7 can be performed.

以上の構成において、機器を携帯時には、スイッチング素子2を介して電池から電子回路に電源が供給されて、機器の様々な操作が行われ、また、電池に充電を行う際には、スイッチング素子2が切換えられ、このスイッチング素子2を介して充電器等から電池に充電が行われる。   In the above configuration, when the device is carried, power is supplied from the battery to the electronic circuit through the switching element 2 to perform various operations of the device, and when the battery is charged, the switching element 2 is used. The battery is charged from a charger or the like through the switching element 2.

そして、このような機器の操作時や電池への充電時等に、万が一、回路の短絡等が生じスイッチング素子2に過電流が流れた場合、この過電流によってスイッチング素子2が発熱し、この熱が熱伝導性樹脂9に伝わり、さらに熱伝導性樹脂9を介して温度ヒューズ5に伝わる。   When such a device is operated or a battery is charged, if a short circuit occurs and an overcurrent flows through the switching element 2, the overcurrent causes the switching element 2 to generate heat. Is transmitted to the thermal conductive resin 9 and further transmitted to the thermal fuse 5 through the thermal conductive resin 9.

また、同時に、本発明においては、このスイッチング素子2の発熱が、スイッチング素子2下面に延出した熱伝導パターン10の平坦部10Aから、貫通孔8内縁の中空筒部10Bを介しても温度ヒューズ5に伝わる。   At the same time, in the present invention, the heat generated by the switching element 2 is also generated from the flat portion 10A of the heat conduction pattern 10 extending to the lower surface of the switching element 2 through the hollow cylinder portion 10B at the inner edge of the through hole 8. Go to 5.

そして、過電流がある程度以上、例えば5A以上の過電流が流れ、温度ヒューズ5に伝わる熱が所定温度以上、例えば135℃以上になった場合には、温度ヒューズ5が溶断して、電池からのスイッチング素子2や電子回路への電源供給が遮断される。   When the overcurrent flows to a certain extent, for example, 5A or more, and the heat transmitted to the thermal fuse 5 reaches a predetermined temperature or higher, for example, 135 ° C. or higher, the thermal fuse 5 is blown and The power supply to the switching element 2 and the electronic circuit is cut off.

つまり、過電流が流れスイッチング素子2が発熱した場合、この熱が熱伝導性樹脂9を介して温度ヒューズ5に伝わると同時に、銅等の熱伝導性の良好な熱伝導パターン10の、温度ヒューズ5間近の中空筒部10Bからも熱が伝わり、所定温度で確実に温度ヒューズ5が溶断するようになっている。   That is, when an overcurrent flows and the switching element 2 generates heat, this heat is transmitted to the thermal fuse 5 through the thermal conductive resin 9, and at the same time, the thermal fuse of the thermal conductive pattern 10 having good thermal conductivity such as copper. Heat is also transmitted from the hollow cylinder portion 10B close to 5, so that the thermal fuse 5 is surely blown at a predetermined temperature.

すなわち、スイッチング素子2と温度ヒューズ5の間隔や、装置が使用される条件にばらつきがあり、熱伝導性樹脂9上面や貫通孔8下面から多少スイッチング素子2の熱が放熱された場合でも、スイッチング素子2下面から貫通孔8内縁に延出した熱伝導パターン10によって、スイッチング素子2の発熱を確実に温度ヒューズ5に伝え、電池からの電源供給を確実に遮断することによって、短絡等による機器の損傷を未然に防ぐように構成されている。   That is, even when the gap between the switching element 2 and the thermal fuse 5 and the conditions under which the device is used vary and the heat of the switching element 2 is dissipated somewhat from the upper surface of the thermal conductive resin 9 and the lower surface of the through hole 8, the switching is performed. By the heat conduction pattern 10 extending from the lower surface of the element 2 to the inner edge of the through hole 8, the heat generation of the switching element 2 is reliably transmitted to the thermal fuse 5, and the power supply from the battery is surely cut off, so It is configured to prevent damage.

このように本実施の形態によれば、配線基板1上面にスイッチング素子2下面から、貫通孔8内縁に延出する熱伝導パターン10を設けると共に、温度ヒューズ5外周とスイッチング素子2との間に、熱伝導性樹脂9を塗布形成することによって、熱伝導性樹脂9に加え、銅等の熱伝導性の良好な熱伝導パターン10からも、スイッチング素子2の発熱を、温度ヒューズ5にばらつきが少なく確実に伝えることができるため、簡易な構成で、確実な電子回路の保護が可能な保護装置を得ることができるものである。   As described above, according to the present embodiment, the heat conduction pattern 10 extending from the lower surface of the switching element 2 to the inner edge of the through hole 8 is provided on the upper surface of the wiring board 1 and between the outer periphery of the thermal fuse 5 and the switching element 2. By applying and forming the heat conductive resin 9, in addition to the heat conductive resin 9, also the heat conduction pattern 10 having a good heat conductivity such as copper causes the heat generation of the switching element 2 to vary in the temperature fuse 5. Since the information can be reliably transmitted with a small amount, it is possible to obtain a protection device capable of reliably protecting an electronic circuit with a simple configuration.

本発明による保護装置は、簡易な構成で、確実な電子回路の保護が可能なものが得られ、各種電子機器の電池ユニット用として有用である。   The protection device according to the present invention has a simple configuration and can reliably protect an electronic circuit, and is useful for battery units of various electronic devices.

本発明の一実施の形態による保護装置の断面図Sectional drawing of the protection apparatus by one embodiment of this invention 同斜視図Same perspective view 同分解斜視図Exploded perspective view 同斜視図Same perspective view 同分解斜視図Exploded perspective view 同斜視図Same perspective view 従来の保護装置の断面図Cross-sectional view of a conventional protection device 同斜視図Same perspective view 同分解斜視図Exploded perspective view 同斜視図Same perspective view 同分解斜視図Exploded perspective view 同斜視図Same perspective view

符号の説明Explanation of symbols

1 配線基板
2 スイッチング素子
3、7 ランド
4、6 端子
5 温度ヒューズ
7A 突出部
8 貫通孔
9 熱伝導性樹脂
10 熱伝導パターン
10A 平坦部
10B 中空筒部
DESCRIPTION OF SYMBOLS 1 Wiring board 2 Switching element 3, 7 Land 4, 6 Terminal 5 Thermal fuse 7A Protrusion part 8 Through-hole 9 Thermal conductive resin 10 Thermal conductive pattern 10A Flat part 10B Hollow cylinder part

Claims (1)

上面に複数の配線パターンが形成された配線基板と、電池電源の切換えを行うスイッチング素子と、このスイッチング素子近傍の貫通孔に装着された温度ヒューズからなり、上記配線基板上面に上記スイッチング素子下面から、上記貫通孔内縁に延出する熱伝導パターンを設けると共に、上記温度ヒューズ外周と上記スイッチング素子との間に、熱伝導性樹脂を塗布形成した保護装置。 A wiring board having a plurality of wiring patterns formed on the upper surface, a switching element for switching the battery power source, and a thermal fuse mounted in a through hole in the vicinity of the switching element. A protective device in which a heat conductive pattern extending to the inner edge of the through hole is provided and a heat conductive resin is applied and formed between the outer periphery of the thermal fuse and the switching element.
JP2007205273A 2007-08-07 2007-08-07 Protection device Withdrawn JP2009043815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007205273A JP2009043815A (en) 2007-08-07 2007-08-07 Protection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007205273A JP2009043815A (en) 2007-08-07 2007-08-07 Protection device

Publications (1)

Publication Number Publication Date
JP2009043815A true JP2009043815A (en) 2009-02-26

Family

ID=40444264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007205273A Withdrawn JP2009043815A (en) 2007-08-07 2007-08-07 Protection device

Country Status (1)

Country Link
JP (1) JP2009043815A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210716A (en) * 2010-03-29 2011-10-20 Samsung Sdi Co Ltd Secondary battery pack, and protection circuit module for secondary battery pack
JP2017076487A (en) * 2015-10-14 2017-04-20 ホシデン株式会社 Plug connector and adaptor
WO2023223786A1 (en) * 2022-05-20 2023-11-23 ミドリ安全株式会社 Device for air-conditioning clothing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210716A (en) * 2010-03-29 2011-10-20 Samsung Sdi Co Ltd Secondary battery pack, and protection circuit module for secondary battery pack
JP2017076487A (en) * 2015-10-14 2017-04-20 ホシデン株式会社 Plug connector and adaptor
TWI704733B (en) * 2015-10-14 2020-09-11 日商星電股份有限公司 Plug connectors and adapters
WO2023223786A1 (en) * 2022-05-20 2023-11-23 ミドリ安全株式会社 Device for air-conditioning clothing

Similar Documents

Publication Publication Date Title
TW414985B (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
TWI389159B (en) Protection element
US20100265031A1 (en) Surface mount thin film fuse structure and method of manufacturing the same
JP2006295019A5 (en)
KR20120054338A (en) Protective circuit module
KR100586128B1 (en) Mounting structure for temperature-sensitive fuse on circuit board
JP2008218618A (en) Printed circuit board
KR101380075B1 (en) Protective circuit module
JP2009043815A (en) Protection device
JP2009032606A (en) Protective device
JP2011023556A (en) Battery unit
US20110155450A1 (en) Printed circuit board and electronic apparatus
JP4967849B2 (en) Protective device
JP2008311163A (en) Protective device
WO2003096414A3 (en) Power supply component assembly on a printed circuit and method for obtaining same
US20090067130A1 (en) Arrangement for heat dissipation
JP6600743B2 (en) Heat dissipation system for printed circuit boards using highly conductive heat dissipation pads
KR102629271B1 (en) Thermal fuse and printed circuit board thereof
US7621042B2 (en) Method for mounting electronic components on a substrate
JP2009117188A (en) Connection structure and circuit structure between exothermic circuit element and temperature fuse
JP2006222304A5 (en)
KR100373936B1 (en) Heat discharging structure for power module
JP2010165617A (en) Battery unit
JP2009076345A (en) Battery unit
JP2010109219A (en) Battery unit

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100514

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20100614

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20101206