JPH0455211B2 - - Google Patents

Info

Publication number
JPH0455211B2
JPH0455211B2 JP982484A JP982484A JPH0455211B2 JP H0455211 B2 JPH0455211 B2 JP H0455211B2 JP 982484 A JP982484 A JP 982484A JP 982484 A JP982484 A JP 982484A JP H0455211 B2 JPH0455211 B2 JP H0455211B2
Authority
JP
Japan
Prior art keywords
thermosetting resin
inorganic filler
resin
parts
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP982484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60152530A (ja
Inventor
Yoshitaka Tagami
Kazuhiko Muya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP982484A priority Critical patent/JPS60152530A/ja
Publication of JPS60152530A publication Critical patent/JPS60152530A/ja
Publication of JPH0455211B2 publication Critical patent/JPH0455211B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP982484A 1984-01-23 1984-01-23 熱硬化性樹脂成形材料の製造法 Granted JPS60152530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP982484A JPS60152530A (ja) 1984-01-23 1984-01-23 熱硬化性樹脂成形材料の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP982484A JPS60152530A (ja) 1984-01-23 1984-01-23 熱硬化性樹脂成形材料の製造法

Publications (2)

Publication Number Publication Date
JPS60152530A JPS60152530A (ja) 1985-08-10
JPH0455211B2 true JPH0455211B2 (enrdf_load_stackoverflow) 1992-09-02

Family

ID=11730881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP982484A Granted JPS60152530A (ja) 1984-01-23 1984-01-23 熱硬化性樹脂成形材料の製造法

Country Status (1)

Country Link
JP (1) JPS60152530A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052990C (zh) * 1996-11-01 2000-05-31 中国科学院长春应用化学研究所 聚芳醚砜/无机粒子复合材料的制备

Also Published As

Publication number Publication date
JPS60152530A (ja) 1985-08-10

Similar Documents

Publication Publication Date Title
JPS58218147A (ja) 半導体装置を包封する方法および該方法によつて包封された半導体装置
JPS6322224B2 (enrdf_load_stackoverflow)
US3689618A (en) Use of an unadvanced silicone resin binder in resistor manufacture
JPH0455211B2 (enrdf_load_stackoverflow)
US2288321A (en) Moldable composition and molded article and method of making the same
JP2657989B2 (ja) 封止用樹脂組成物およびその製造方法
US3855173A (en) High temperature stable modified aromatic amine-aldehyde molding powders modified with aromatic polycarboxylic acid, and molded article
JPS60152529A (ja) 熱硬化性樹脂成形材料
US3756980A (en) High temperature stable modified phenolic molding powders
JPH0249329B2 (enrdf_load_stackoverflow)
JP3256007B2 (ja) フェノール樹脂成形材料の製造方法
JP3450260B2 (ja) エポキシ樹脂組成物およびコイル注型物
JPS6037104A (ja) 電気抵抗体または導電体の製造法
JP2803053B2 (ja) エポキシ樹脂組成物及び半導体封止装置
JPS63225618A (ja) 封止用樹脂組成物およびその製造方法
JPH0573767B2 (enrdf_load_stackoverflow)
JP2531166B2 (ja) フェノ―ル樹脂成形材料の成形品の製法
JPS60161423A (ja) 封止用樹脂組成物
KR940004867B1 (ko) 폴리 아미드 수지 조성물
JP2610497B2 (ja) 耐衝撃性に優れたポリオレフィン樹脂組成物
JPH0739466B2 (ja) 封止用樹脂組成物およびその製造方法
JPH0463858A (ja) フェノール樹脂成形材料
JPH0588734B2 (enrdf_load_stackoverflow)
JPH06322240A (ja) フェノール樹脂成形材料およびその成形品
JPH04292617A (ja) マレイミド樹脂組成物