JPH0455181U - - Google Patents
Info
- Publication number
- JPH0455181U JPH0455181U JP9707890U JP9707890U JPH0455181U JP H0455181 U JPH0455181 U JP H0455181U JP 9707890 U JP9707890 U JP 9707890U JP 9707890 U JP9707890 U JP 9707890U JP H0455181 U JPH0455181 U JP H0455181U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- fixed
- conductive rubber
- rubber material
- grounding conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図はセラミツク基板の側面図、第３図はセラミツ
ク基板の底面図である。
１０……鏡体ケース、１１……基板固定部、１
２……導電性ゴムシート、１３……アース用導体
、１４……セラミツク基板、１５……センサ、１
６……半田付け用ピン、１７……樹脂リング、１
８……ブラケツト、１９……頂部、２０……グロ
メツト、２１……リード線、２２……シールド線
。
Figure 1 is a front view showing one embodiment of the present invention;
The figure is a side view of the ceramic substrate, and FIG. 3 is a bottom view of the ceramic substrate. 10... Mirror case, 11... Board fixing part, 1
2... Conductive rubber sheet, 13... Ground conductor, 14... Ceramic substrate, 15... Sensor, 1
6...Soldering pin, 17...Resin ring, 1
8... Bracket, 19... Top, 20... Grommet, 21... Lead wire, 22... Shield wire.
Claims (1)
体１３を固着し、セラミツク基板固定用ケース１
０の基板固定部１１表面に導電性ゴム材１２を装
着し、アース用導体１３と導電性ゴム材１２とを
接触させた状態でセラミツク基板１４をセラミツ
ク基板固定用ケース１０に固定したことを特徴と
するセラミツク基板の固定構造。 The grounding conductor 13 is fixed to the surface of the fixing part of the ceramic substrate 14, and the ceramic substrate fixing case 1 is assembled.
A conductive rubber material 12 is attached to the surface of the substrate fixing part 11 of 0, and the ceramic substrate 14 is fixed to the ceramic substrate fixing case 10 with the grounding conductor 13 and the conductive rubber material 12 in contact with each other. Fixed structure of ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707890U JPH0455181U (en) | 1990-09-14 | 1990-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9707890U JPH0455181U (en) | 1990-09-14 | 1990-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455181U true JPH0455181U (en) | 1992-05-12 |
Family
ID=31837146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9707890U Pending JPH0455181U (en) | 1990-09-14 | 1990-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455181U (en) |
-
1990
- 1990-09-14 JP JP9707890U patent/JPH0455181U/ja active Pending