JPH0453920B2 - - Google Patents

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Publication number
JPH0453920B2
JPH0453920B2 JP1236689A JP23668989A JPH0453920B2 JP H0453920 B2 JPH0453920 B2 JP H0453920B2 JP 1236689 A JP1236689 A JP 1236689A JP 23668989 A JP23668989 A JP 23668989A JP H0453920 B2 JPH0453920 B2 JP H0453920B2
Authority
JP
Japan
Prior art keywords
cleaning agent
carbon atoms
cleaning
general formula
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1236689A
Other languages
Japanese (ja)
Other versions
JPH0397792A (en
Inventor
Hirotoshi Ushama
Kenji Yokoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lion Corp
Original Assignee
Lion Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lion Corp filed Critical Lion Corp
Priority to JP23668989A priority Critical patent/JPH0397792A/en
Publication of JPH0397792A publication Critical patent/JPH0397792A/en
Publication of JPH0453920B2 publication Critical patent/JPH0453920B2/ja
Granted legal-status Critical Current

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  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

産業上の利用分野 本発明は、半田付けに際して用いられるフラツ
クスを洗浄する液体洗浄剤に関する。 従来の技術 エレクトロニクス産業においては、プリント基
板の半田けの際にフラツクスが使用されている。
このようなフラツクスは、プリント基板および最
終製品の高品質を維持するために、半田け作業の
終了後に、高清浄度に洗浄することが要求されて
いる。 フラツクス用洗浄剤としては、従来から種々の
ものが開示されており、例えば、特開昭59−
227998号公報、同61−37363号公報、同61−42474
号公報等に報告されている。 しかしながら、これら洗浄剤はいずれもフロン
系溶剤、塩素系溶剤を骨格とした組成物であり、
近年、これら溶剤の環境への安全性が比較となつ
ていることから、溶剤系に代わる水系洗浄剤の要
望が高まつている。 発明が解決しようとする課題 本発明は半田フラツクスに対して優れた洗浄性
能を有し、しかも、環境への安全性に対して全く
問題がない水系の液体洗浄剤を提供するものであ
る。 発明の構成 本発明の半田フラツクス用液体洗浄剤は、下記
の一般式()で表わされる化合物、あるいはさ
らに一般式()で表わされる化合物を含むこと
を特徴とする。 R1−O(−CoH2oO)−nH ……() (R1:炭素数1〜5のアルキル基またはアル
ケニル基) n:2〜4の数 m:1〜10の数) R2−O(−C2H4O)−lH ……() (R2:炭素数8〜18のアルキル基またはアル
ケニル基もしくは炭素数12〜25のアルキルフエニ
ル基 l:5〜15の数) 以下、本発明についてさらに詳細に説明する。 上記一般式()の化合物は、炭素数1〜5の
飽和または不飽和アルコールのアルキレンオキシ
ド付加物である。式中のCoH2oOは、オキシエチ
レン、オキシプロピレン、オキシブチレンが単独
または混合物として付加していることを示し、特
に、オキシエチレンとオキシプロピレンのブロツ
ク付加物が好適である。nはアルキレンオキシド
の平均付加モル数を示し、1〜10、好ましくは2
〜6である。オキシエチレンとオキシプロピレン
とのブロツク付加の場合、オキシエチレン1〜3
モル、オキシプロピレン1〜5モルが好適であ
る。 一般式()の化合物は、炭素数8〜18の飽和
または不飽和アルコールのエチレンオキシド付加
物と、ベンゼン環も含めて炭素数12〜25のアルキ
ルフエノールのエチレンオキシド付加物とを包含
する。前者の場合は炭素数10〜16の二級アルコー
ルが好ましく、後者の場合はオクチルフエノー
ル、ノニルフエノールが好ましい。エチレンオキ
シドの平均付加モル数(l)は5〜15である。 本発明の半田フラツクス用液体洗浄剤は、一般
式()の化合物あるいは一般式()と()
の化合物の混合物そのままでもよいが、通常、水
にて希釈し5〜70重量%の透明均一な水溶液とす
る。また、一般式()と()の化合物を併用
する場合は、():()=1〜10:10〜1、好ま
しくは1〜5:5〜1の割合(重量比)で配合す
ることにより、いつそう良好な洗浄力を示す。 本発明の液体洗浄剤は、その他必要に応じて、
液安定性を保持するためにエチレングリコール、
プロピレングリコール、メタノール、エタノー
ル、プロパノール等のハイドロトロープ剤などを
配合することもできる。 発明の効果 本発明の液体洗浄剤は、フロン系等の溶媒を必
要とすることなく水系で半田フラツクスに対して
優れた洗浄性能を示し、特にプリント配線板、プ
リント回路板のようなプリント基板の半田付けの
際に使用されるロジンフラツクスの除去に極めて
有効である。 また、透明安定性に優れ、低泡性であるので、
取り扱いも容易である。 以下、実施例により本発明の液体洗浄剤につい
てさらに具体的に説明するが、それに先立つて実
施例で用いた評価方法を示す。 (1) 洗浄剤の透明性 100mlガラスビンに洗浄剤を入れ、25℃恒温室
内に24時間静置し、目視によつて下記の基準で透
明性を評価する。〇を合格とする。 評価基準 〇:透明 △:やや白濁 ×:沈澱・二層分離 (2) フラツクスの洗浄性 ガラス板に半田フラツクスを塗布し、200℃、
15分間焼成を行なつて汚垢板とし、各々の洗浄剤
を水で5倍希釈した洗浄液中で40℃、5分間の浸
漬洗浄を行なう。洗浄中のフラツクスの溶解状態
を目視で判定し、次の基準により評価する。〇以
上を合格とする。 評価基準 ◎:溶解力が強い 〇:溶解力がある △:溶解力がやや劣る ×:溶解力がない 実施例1 (洗浄剤の調製) 以下の処方の各液体洗浄剤1〜13を調製した。
なお、組成中のアルキレンオキシド付加の記載で
(C2H4O)1(C3H6O)2Hのようにあるのはその順番
にブロツク付加させた事を意味し、[(C2H4O)1
(C3H6O)2]はランダム付加を示す。 また、洗浄剤11は比較例であり、他は実施例で
ある。 洗浄剤 1 C4H9−O(C2H4O)1(C3H6O)2H 30wt% エチルアルコール 35wt% 水 35wt% 洗浄剤 2 C4H9−O(C2H4O)1(C3H6O)2H 30wt% 第2級C12H25−O(C2H4O)8H 15wt% エチルアルコール 5wt% 水 50wt% 洗浄剤 3 C4H9−O(C2H4O)1(C3H6O)2H 30wt%
INDUSTRIAL APPLICATION FIELD The present invention relates to a liquid cleaning agent for cleaning flux used in soldering. BACKGROUND OF THE INVENTION Fluxes are used in the electronics industry when soldering printed circuit boards.
In order to maintain the high quality of printed circuit boards and final products, such fluxes are required to be cleaned to a high degree of cleanliness after soldering work is completed. Various cleaning agents for fluxes have been disclosed in the past, for example, Japanese Patent Application Laid-Open No. 1983-1999.
Publication No. 227998, Publication No. 61-37363, Publication No. 61-42474
It has been reported in the No. However, all of these cleaning agents are compositions based on fluorocarbon-based solvents and chlorinated solvents,
In recent years, the environmental safety of these solvents has been compared, and there has been an increasing demand for water-based cleaning agents to replace solvent-based cleaning agents. Problems to be Solved by the Invention The present invention provides an aqueous liquid cleaning agent that has excellent cleaning performance for solder flux and has no problems with respect to environmental safety. Structure of the Invention The liquid cleaning agent for solder flux of the present invention is characterized by containing a compound represented by the following general formula (), or further a compound represented by the general formula (). R 1 -O(-C o H 2o O) - n H...() (R 1 : Alkyl group or alkenyl group having 1 to 5 carbon atoms) n: Number of 2 to 4 m: Number of 1 to 10) R2 -O( -C2H4O ) -lH ...() ( R2 : Alkyl group or alkenyl group having 8 to 18 carbon atoms or alkylphenyl group having 12 to 25 carbon atoms l: 5 to 15 The present invention will be described in more detail below. The compound of the above general formula () is an alkylene oxide adduct of a saturated or unsaturated alcohol having 1 to 5 carbon atoms. C o H 2o O in the formula indicates that oxyethylene, oxypropylene, or oxybutylene is added alone or as a mixture, and a block adduct of oxyethylene and oxypropylene is particularly preferred. n indicates the average number of moles of alkylene oxide added, and is 1 to 10, preferably 2
~6. In the case of block addition of oxyethylene and oxypropylene, oxyethylene 1 to 3
1 to 5 moles of oxypropylene are preferred. The compound of general formula () includes an ethylene oxide adduct of a saturated or unsaturated alcohol having 8 to 18 carbon atoms, and an ethylene oxide adduct of an alkylphenol having 12 to 25 carbon atoms, including a benzene ring. In the former case, a secondary alcohol having 10 to 16 carbon atoms is preferred, and in the latter case, octylphenol and nonylphenol are preferred. The average number of added moles (l) of ethylene oxide is 5 to 15. The liquid cleaning agent for solder flux of the present invention is a compound of general formula () or general formulas () and ().
Although the mixture of compounds may be used as is, it is usually diluted with water to form a transparent and uniform aqueous solution containing 5 to 70% by weight. In addition, when the compounds of general formulas () and () are used together, they should be blended in a ratio (weight ratio) of ():() = 1 to 10:10 to 1, preferably 1 to 5:5 to 1. Therefore, it shows good cleaning power. The liquid cleaning agent of the present invention may also include, if necessary,
Ethylene glycol, to maintain liquid stability
Hydrotropes such as propylene glycol, methanol, ethanol, and propanol can also be blended. Effects of the Invention The liquid cleaning agent of the present invention is aqueous and exhibits excellent cleaning performance for solder flux without the need for fluorocarbon-based solvents, and particularly for cleaning printed wiring boards and printed circuit boards. Extremely effective in removing rosin flux used during soldering. In addition, it has excellent transparency stability and low foaming, so
It is also easy to handle. Hereinafter, the liquid cleaning agent of the present invention will be explained in more detail with reference to Examples, but first, the evaluation method used in the Examples will be described. (1) Transparency of cleaning agent Pour the cleaning agent into a 100ml glass bottle, leave it in a constant temperature room at 25℃ for 24 hours, and visually evaluate the transparency using the following criteria. 〇 is considered a pass. Evaluation criteria 〇: Transparent △: Slightly cloudy ×: Precipitation/two-layer separation (2) Cleanability of flux Solder flux was applied to a glass plate and heated at 200°C.
The board was baked for 15 minutes to obtain a soiled board, and then immersed in a cleaning solution prepared by diluting each cleaning agent 5 times with water at 40°C for 5 minutes. The state of flux dissolution during cleaning is visually determined and evaluated using the following criteria. 〇 or above is considered a pass. Evaluation criteria ◎: Strong dissolving power 〇: Solving power △: Slightly poor dissolving power ×: No dissolving power Example 1 (Preparation of cleaning agent) Each liquid cleaning agent 1 to 13 with the following formulation was prepared. .
In addition, in the description of alkylene oxide addition in the composition, (C 2 H 4 O) 1 (C 3 H 6 O) 2 H means that the blocks were added in that order, and [(C 2 H4O ) 1 /
(C 3 H 6 O) 2 ] indicates random addition. Further, the cleaning agent 11 is a comparative example, and the others are examples. Cleaning agent 1 C 4 H 9 -O (C 2 H 4 O) 1 (C 3 H 6 O) 2 H 30wt% Ethyl alcohol 35wt% Water 35wt% Cleaning agent 2 C 4 H 9 -O (C 2 H 4 O ) 1 (C 3 H 6 O) 2 H 30wt% Secondary C 12 H 25 -O (C 2 H 4 O) 8 H 15wt% Ethyl alcohol 5wt% Water 50wt% Cleaning agent 3 C 4 H 9 -O ( C 2 H 4 O) 1 (C 3 H 6 O) 2 H 30wt%

【式】 15wt% エチルアルコール 5wt% 水 50wt% 洗浄剤 4 C4H9−O[(C2H4O)1/(C3H6O)2]H 30wt% エチルアルコール 35wt% 水 35wt% 洗浄剤 5〜11 C4H9−O(C2H4O)J(C3H6O)kH(j,kの値
は表−1に記載) 30wt% エチルアルコール 35wt% 水 35wt%
[Formula] 15wt% Ethyl alcohol 5wt% Water 50wt% Cleaning agent 4 C 4 H 9 −O [(C 2 H 4 O) 1 / (C 3 H 6 O) 2 ] H 30wt% Ethyl alcohol 35wt% Water 35wt% Cleaning agent 5-11 C 4 H 9 -O (C 2 H 4 O) J (C 3 H 6 O) k H (values of j and k are listed in Table-1) 30wt% Ethyl alcohol 35wt% Water 35wt%

【表】 洗浄剤 12〜13 C4H9−O(C2H4O)1(C3H6O)2H 30wt% 第2級C12H25−O(C2H4O)lH(lの値は、表−
2中に記載) 15wt% エチルアルコール 5wt% 水 50wt%
[Table] Cleaning agent 12-13 C 4 H 9 -O (C 2 H 4 O) 1 (C 3 H 6 O) 2 H 30wt% Secondary C 12 H 25 -O (C 2 H 4 O) l H (the value of l is shown in Table-
2) 15wt% Ethyl alcohol 5wt% Water 50wt%

【表】 実施例2 (洗浄剤の性能評価) 実施例1で調製した各洗浄剤の性能を評価し、
結果を表−3に示した。
[Table] Example 2 (Performance evaluation of cleaning agents) The performance of each cleaning agent prepared in Example 1 was evaluated,
The results are shown in Table-3.

【表】 他は実施例である。
[Table] The others are examples.

Claims (1)

【特許請求の範囲】 1 一般式()で表わされる化合物を含むこと
を特徴とする半田フラツクス用液体洗浄剤。 R1−O(−CoH2oO)−nH ……() (R1:炭素数1〜5のアルキル基またはアル
ケニル基) n:2〜4の数 m:1〜10の数) 2 一般式()で表わされる化合物と、一般式
()で表わされる化合物とを含むことを特徴と
する半田フラツクス用液体洗浄剤。 R1−O(−CoH2oO)−nH ……() (R1:炭素数1〜5のアルキル基またはアル
ケニル基) n:2〜4の数 m:1〜10の数) R2−O(−C2H4O)−lH ……() (R2:炭素数8〜18のアルキル基またはアル
ケニル基もしくは炭素数12〜25のアルキルフエニ
ル基 l:5〜15の数)
[Scope of Claims] 1. A liquid cleaning agent for solder flux, characterized by containing a compound represented by the general formula (). R 1 -O(-C o H 2o O) - n H...() (R 1 : Alkyl group or alkenyl group having 1 to 5 carbon atoms) n: Number of 2 to 4 m: Number of 1 to 10) 2. A liquid cleaning agent for solder flux characterized by containing a compound represented by the general formula () and a compound represented by the general formula (). R 1 -O(-C o H 2o O) - n H...() (R 1 : Alkyl group or alkenyl group having 1 to 5 carbon atoms) n: Number of 2 to 4 m: Number of 1 to 10) R2 -O( -C2H4O ) -lH ...() ( R2 : Alkyl group or alkenyl group having 8 to 18 carbon atoms or alkylphenyl group having 12 to 25 carbon atoms l: 5 to 15 number)
JP23668989A 1989-09-11 1989-09-11 Liquid detergent for solder flux Granted JPH0397792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23668989A JPH0397792A (en) 1989-09-11 1989-09-11 Liquid detergent for solder flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23668989A JPH0397792A (en) 1989-09-11 1989-09-11 Liquid detergent for solder flux

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5252475A Division JP2684319B2 (en) 1993-09-13 1993-09-13 Liquid cleaner for solder flux

Publications (2)

Publication Number Publication Date
JPH0397792A JPH0397792A (en) 1991-04-23
JPH0453920B2 true JPH0453920B2 (en) 1992-08-27

Family

ID=17004313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23668989A Granted JPH0397792A (en) 1989-09-11 1989-09-11 Liquid detergent for solder flux

Country Status (1)

Country Link
JP (1) JPH0397792A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2789046B2 (en) * 1989-11-08 1998-08-20 荒川化学工業株式会社 Cleaning agent for rosin solder flux
JPH0768547B2 (en) * 1989-11-21 1995-07-26 花王株式会社 Cleaning composition
JPH03198395A (en) * 1989-12-27 1991-08-29 Toho Chem Ind Co Ltd Composition of cleaning agent
JPH0457898A (en) * 1990-06-27 1992-02-25 Kao Corp Aqueous detergent composition
JP2774205B2 (en) * 1991-04-16 1998-07-09 三和油化工業株式会社 Oil / water separation method for polymer and oil
JPH0624170A (en) * 1992-03-25 1994-02-01 Sanyo Chem Ind Ltd Cleansing agent for screen printing plate
JP2652298B2 (en) * 1992-04-30 1997-09-10 花王株式会社 Cleaning composition for precision parts or jigs
JP2893497B2 (en) * 1992-04-30 1999-05-24 花王株式会社 Cleaning composition for precision parts or jigs
GB2281909B (en) * 1993-09-21 1997-06-04 Asahi Chemical Ind Propylene glycol cyclohexyl ether derivatives, method of producing same and uses thereof
CN111117797A (en) * 2020-01-17 2020-05-08 重庆理工大学 Multifunctional universal water-based cleaning agent and cleaning method
EP4386073A1 (en) * 2021-08-10 2024-06-19 NOF Corporation Cleaning agent for electroconductive paste and method for cleaning electroconductive paste

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040126A (en) * 1973-08-15 1975-04-12
US3886099A (en) * 1972-03-13 1975-05-27 Griffin Bros Inc Water soluble flux remover
JPS54158409A (en) * 1978-06-05 1979-12-14 Kao Corp Liquid detergent composition
JPS59134891A (en) * 1983-01-21 1984-08-02 メック株式会社 Printed circuit cleaner
JPS63159500A (en) * 1986-12-24 1988-07-02 ライオン株式会社 Gel detergent

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649299A (en) * 1987-06-30 1989-01-12 Lion Corp Liquid detergent composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3886099A (en) * 1972-03-13 1975-05-27 Griffin Bros Inc Water soluble flux remover
JPS5040126A (en) * 1973-08-15 1975-04-12
JPS54158409A (en) * 1978-06-05 1979-12-14 Kao Corp Liquid detergent composition
JPS59134891A (en) * 1983-01-21 1984-08-02 メック株式会社 Printed circuit cleaner
JPS63159500A (en) * 1986-12-24 1988-07-02 ライオン株式会社 Gel detergent

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