JPH0453567U - - Google Patents
Info
- Publication number
- JPH0453567U JPH0453567U JP9622890U JP9622890U JPH0453567U JP H0453567 U JPH0453567 U JP H0453567U JP 9622890 U JP9622890 U JP 9622890U JP 9622890 U JP9622890 U JP 9622890U JP H0453567 U JPH0453567 U JP H0453567U
- Authority
- JP
- Japan
- Prior art keywords
- less
- intervals
- rectangular
- test pattern
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000013508 migration Methods 0.000 claims 1
- 230000005012 migration Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
Description
第１図は本考案の試験パターン平面図、第２図
は第１図のＡ−Ａ断面図である。
１……長方形貫通穴、２……基板、３……銀ペ
ースト、４……銅箔接着剤。
FIG. 1 is a plan view of a test pattern of the present invention, and FIG. 2 is a sectional view taken along line AA in FIG. 1... Rectangular through hole, 2... Board, 3... Silver paste, 4... Copper foil adhesive.
Claims (1)
長さ５mm以上幅２mm以下の長方形貫通穴の複数個
を等間隔平行に並列して設け、その間隔を２．５
mm以下として該貫通穴の内壁に銀ペーストを注入
して成る銀マイグレーシヨン試験パターン。 A printed wiring board to be tested is used as a substrate, and a plurality of rectangular through holes with a length of 5 mm or more and a width of 2 mm or less are arranged in parallel at equal intervals, and the intervals are 2.5 mm.
A silver migration test pattern formed by injecting silver paste into the inner wall of the through hole to a diameter of less than mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9622890U JPH0453567U (en) | 1990-09-13 | 1990-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9622890U JPH0453567U (en) | 1990-09-13 | 1990-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0453567U true JPH0453567U (en) | 1992-05-07 |
Family
ID=31835580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9622890U Pending JPH0453567U (en) | 1990-09-13 | 1990-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453567U (en) |
-
1990
- 1990-09-13 JP JP9622890U patent/JPH0453567U/ja active Pending