JPH0452258A - Solder plating method by hot dipping - Google Patents
Solder plating method by hot dippingInfo
- Publication number
- JPH0452258A JPH0452258A JP16089490A JP16089490A JPH0452258A JP H0452258 A JPH0452258 A JP H0452258A JP 16089490 A JP16089490 A JP 16089490A JP 16089490 A JP16089490 A JP 16089490A JP H0452258 A JPH0452258 A JP H0452258A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wires
- molten solder
- lead wire
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 95
- 238000007747 plating Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims description 13
- 238000007598 dipping method Methods 0.000 title abstract description 4
- 230000004907 flux Effects 0.000 claims abstract description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000007654 immersion Methods 0.000 claims description 17
- 230000002950 deficient Effects 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、気密端子等のリード線ここ半田を浸漬鍍金す
るための半田浸漬鍍金方法に間する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a solder immersion plating method for immersion plating solder on lead wires of airtight terminals and the like.
例えば時計の基準周波数を発生させろための水晶振動子
は、第２図に示すように、音叉型の水晶片１を′ｙｃ’
ｔ； ＃１ｉ子２に取り付け、これをキヤ・ツブ３て覆
い密封する二とにより構成されている。気密端子２は、
金属外環２ａにガラス２ｂを介して２本のり一ト線２Ｃ
を封着したものである。そして、水晶片１は、この気密
端子２の上方側に突出したり一ト線２Ｃの先端部に導電
性接着剤等で固着される。また、キャップ３は、二の水
晶片ｌを覆うようにして、開口端を気密端子２の金属外
環２ａに外嵌し、圧入することにより内部を密封してい
る。For example, a crystal oscillator for generating the reference frequency of a watch uses a tuning fork-shaped crystal piece 1 as shown in Figure 2.
t; #1 is attached to the connector 2, and is covered and sealed with a cap 3. The airtight terminal 2 is
Two cables 2C are connected to the metal outer ring 2a through the glass 2b.
It is sealed. The crystal piece 1 protrudes above the airtight terminal 2 or is fixed to the tip of the single-tone wire 2C using a conductive adhesive or the like. Further, the cap 3 covers the second crystal piece l, and its open end is fitted onto the metal outer ring 2a of the airtight terminal 2, and the cap 3 is press-fitted to seal the inside.
上記水晶振動子は、気密端子２の下方側に突出したり一
ド線２Ｃをプリント基板に半田付けする二とにより実装
される。従って、気密端子２は、この半田付けを容易に
するために、予めリード線２ｃに半田の浸漬鍍金を施し
ている。この半田の浸漬鍍金は、まず前処理として第３
図（イ）に示すように、気密端子２の下方側に突出した
リード線２ｃをフラックス４ａを満たしたブラックス槽
４に浸漬する。リード線２Ｃをフラックス４ａにより前
処理するのは、二のリード線２Ｃの表面の酸化物等を取
り除き半田の馴染みがよくなるようにするためである。The crystal resonator is mounted by protruding downward from the airtight terminal 2 or by soldering the single lead wire 2C to the printed circuit board. Therefore, in order to facilitate this soldering, the airtight terminal 2 has the lead wire 2c dip-plated with solder in advance. This solder immersion plating is performed first as a pretreatment.
As shown in Figure (A), the lead wire 2c protruding downward from the airtight terminal 2 is immersed in a blacks tank 4 filled with flux 4a. The reason why the lead wire 2C is pretreated with the flux 4a is to remove oxides and the like from the surface of the second lead wire 2C so that the solder becomes more compatible with the solder.
このようにしてフラックス４ａによる前処理を絽えた気
密端子２は、次に同図（ロ）に示すように、リード線２
Ｃを溶融半田５ａを満たした半田槽５に浸漬する。そし
、て、これを引き上げろと、同図（ハ）に示すように、
気密端子２の下方側：こ突出したり−ト線２ｃに半田鍍
金６が施される二とになる。As shown in FIG.
C is immersed in a solder bath 5 filled with molten solder 5a. Then, as shown in the same figure (c), pull this up.
Lower side of the airtight terminal 2: This is where the solder plating 6 is applied to the protruding or negative wire 2c.
しかし・ながら、このようなり一ト線２Ｃの半田鍍金６
は、各種のニーソング等の加熱工程後にプリント基板等
への半田付は性を十分に確保しようとすると、少なくと
も３μｍ以上の膜厚が必要になる。そこで従来は、半田
槽５の温度を例えば、半田の液相線温度より２０℃程度
高い温度に設定すると共に、リード線２ｃの半田槽５か
らの引き上げ速度を速くすることにより、この３μｍ以
上の厚い膜厚の半田鍍金６を形成していた。半田槽５の
温度を低くすると、溶融半田５ａの粘度が高くなるため
、半田鍍金６の膜厚も厚くなる。また、）−Ｆ線２ｃの
引き上げ速度を速くシ・た場合にも、溶融半田５ａが流
れ落ちる前に凝固するので、半田鍍金６の膜厚が厚くな
る。However, like this, one line 2C solder plating 6
In order to ensure sufficient solderability to a printed circuit board or the like after various knee-song heating processes, a film thickness of at least 3 μm or more is required. Conventionally, the temperature of the solder bath 5 is set to, for example, about 20 degrees Celsius higher than the liquidus temperature of the solder, and the speed at which the lead wire 2c is pulled out of the solder bath 5 is increased. A thick solder plating 6 was formed. When the temperature of the solder bath 5 is lowered, the viscosity of the molten solder 5a increases, so that the film thickness of the solder plating 6 also increases. Further, even when the pulling speed of the )-F wire 2c is increased, the molten solder 5a solidifies before flowing down, so that the film thickness of the solder plating 6 becomes thicker.
ところが、上記従来の方法では、半田槽５の温度を低く
するために、溶融半田５ａがリード線２Ｃに馴染み難く
なり、二のり一ト線２Ｃに半田鍍金６がうまく付着し・
なくなって鍍金不良が多発するという問題が生していた
。However, in the above-mentioned conventional method, in order to lower the temperature of the solder bath 5, the molten solder 5a becomes difficult to adapt to the lead wire 2C, and the solder plating 6 does not adhere well to the second and first lead wires 2C.
This caused problems such as frequent occurrence of plating defects.
また、このような問題を解消するためには、リード線２
ｃを半田槽５に浸漬する前に予熱しておく方法が考えら
れる。しかし、この予熱を温風ブロー等によって行った
のでは、フラックスによってリード線の表面が充分に活
性化される温度に達し難い等の問題が生し・る。In addition, in order to solve this problem, lead wire 2
A conceivable method is to preheat the solder c before dipping it into the solder bath 5. However, if this preheating is performed by blowing hot air or the like, problems arise such as difficulty in reaching a temperature at which the surface of the lead wire is sufficiently activated by the flux.
なお、上記問題点は、水晶振動子のり−ト線２Ｃに限ら
ず、半田の浸漬鍍金を施すリード線一般に共通するもの
である。The above-mentioned problem is not limited to the crystal resonator glue wire 2C, but is common to lead wires that are dip-plated with solder.
上記問題を解決するために、本発明は、リード線をフラ
ックスにより前処理した後に溶融半田に浸漬し半田の浸
漬鍍金を行う半田浸漬鍍金方法において、リード線の先
端部のみを溶融半田に浸漬して−旦保持して予熱した後
に、リード線の鍍金子定部分を全て溶融半田に浸漬して
半田の浸漬鍍金を行うことを特徴としている。In order to solve the above problems, the present invention provides a solder immersion plating method in which a lead wire is pretreated with flux and then immersed in molten solder to perform solder immersion plating. After the lead wire is held and preheated, the entire plated portion of the lead wire is immersed in molten solder to perform solder immersion plating.
上記構成により、フラックスの前処理を終えたノート線
は、まず先端部のみが溶融半田に浸漬されて、その状態
で一旦保持される。すると、二のり一ト線に溶融半田の
熱が伝わり予熱される。そして、この後にリード線の鍍
金子定部分を全て溶融半田に浸漬すれば、溶融半田の温
度が比較的低い場合にもリード線に十分に馴染み確実に
半田が付着して鍍金されることになる。With the above configuration, only the tip of the notebook wire that has been pretreated with flux is dipped in molten solder, and is temporarily held in that state. Then, the heat of the molten solder is transferred to the second line and the first line, and it is preheated. After this, if all the plated parts of the lead wires are immersed in molten solder, even if the temperature of the molten solder is relatively low, the solder will fully adhere to the lead wires and be plated. .
従来のようにリード線を一気に溶融半田に浸（質すると
、このり一ト線の表面を覆うフラックスが溶融半田との
間で層をなし、かえって半田の付着を阻止する原因とな
る。しかし、本発明のようにリード線の一部のみを溶融
半田に浸漬して予熱すれば、この間にフラフクスが十分
に活性化されるため、後の鍍金子定部分全ての浸漬工程
で半田の付着を促進する二とができるようになる。また
、このような予熱を行うには、リード線を溶融半田に接
近させて浸漬は行わないという方法も考えられる。ただ
し、比較的温度の低い溶融半田からの間接的な熱のみに
よって予熱を行ったのでは、フラックスが十分に活性化
せず、必ずしも確実な効果を得ることができない。If you immerse the lead wire in the molten solder all at once as in the past, the flux covering the surface of the lead wire will form a layer with the molten solder, which will actually prevent the solder from adhering.However, If only a part of the lead wire is immersed in molten solder and preheated as in the present invention, the flux is sufficiently activated during this time, which promotes solder adhesion in the subsequent dipping process of all the plated parts. In addition, to perform this kind of preheating, it is possible to bring the lead wire close to the molten solder without immersing it. If preheating is performed only by indirect heat, the flux will not be activated sufficiently and a reliable effect cannot necessarily be obtained.
従って、本発明の半田浸漬鍍金方法によれば、比較的温
度の低い溶融半田を使用して膜厚の厚い半田鍍金を行う
場合にも、半田を確実にｆす着させることができるよう
になる。Therefore, according to the solder immersion plating method of the present invention, even when performing a thick solder plating using molten solder at a relatively low temperature, the solder can be reliably deposited. .
以下、図面を参照し・ながら、本発明の実施例を詳述す
る。Embodiments of the present invention will be described in detail below with reference to the drawings.
１１図（イ）〜（二〉は本発明の一実施例を示すもので
あって、それぞれ気密端子のり一ト線に半田の浸漬鍍金
を施す方法の各工程を示す縦断面図である。なお、第３
図に示した従来例と同様の１ｍ能を有する構成部材には
同じ番号を付記する。Figures 11(A) to 11(2) show one embodiment of the present invention, and are longitudinal cross-sectional views showing each step of a method of applying solder immersion plating to an airtight terminal glued wire. , 3rd
Components having a 1 m capacity similar to those of the conventional example shown in the figure are given the same numbers.
本実施例は、前記３１！２図に示した水晶振動子に使用
する気密端子２のリード線２Ｃに半田の浸漬鍍金を施す
場合について説明する。、二の気！Ｍ子２は、金属外環
２ａにガラス２ｂを介して２本のり一ト線２Ｃを封着し
たものである。リード線２Ｃは、コバール合金や鉄・ニ
ッケル合金からなり、それぞれ気密端子２のガラス２ｂ
を上方から下方ζ：貫通するように封着されている。そ
して、二の気密端子２の上方側に突出したリード線２Ｃ
には、水晶片１が取り付けられ、下方側に突出したり一
ト線２ｃがプリント基板への半田付けのために半田の浸
漬鍍金が施されることになる。In this embodiment, a case will be described in which the lead wire 2C of the airtight terminal 2 used in the crystal resonator shown in FIGS. 31 and 2 is immersed in solder. , second mind! The M element 2 is made by sealing two straight wires 2C to a metal outer ring 2a via a glass 2b. The lead wires 2C are made of Kovar alloy or iron-nickel alloy, and are connected to the glass 2b of the airtight terminal 2.
From upper to lower ζ: Sealed to penetrate. Then, a lead wire 2C protrudes above the second airtight terminal 2.
A crystal piece 1 is attached to the crystal piece 1, and a solder dip plating is applied to the downwardly protruding one-tone wire 2c for soldering to a printed circuit board.
この半田の浸漬鍍金を行うには、まず前処理とし、て第
１図（イ）に示すように、気密端子２の下方側に突出し
たリード線２Ｃをフラックス４ａを満たしたフラックス
槽４に浸漬する。次に、り一ト線２Ｃをフラックス槽４
から引き上げた後に、同図（ロ）に示すように、このり
−ト線２Ｃの下端部のみを半田槽５の溶融半田５ａに浸
漬し一旦深持する。二の半田槽５の溶融半田５ａは、液
相線温度より２０℃程度高い温度に設定されている。To carry out this solder immersion plating, first, as a pretreatment, the lead wire 2C protruding downward from the airtight terminal 2 is immersed in the flux tank 4 filled with flux 4a, as shown in FIG. 1(A). do. Next, connect the wire 2C to the flux tank 4.
After pulling it up from the solder bath 5, only the lower end of the wire 2C is immersed in the molten solder 5a of the solder bath 5 and held there deeply, as shown in FIG. The temperature of the molten solder 5a in the second solder tank 5 is set to about 20° C. higher than the liquidus temperature.
従って、二のり一ト線２ｃは、下端部から溶融半田５ａ
の熱が伝わり、２００°Ｃ程度に予熱されて、前処理で
リード線２Ｃの表面に付着したフラックス４ａが十分に
活性化する。そこで、同図（ハ）に示すように、二のリ
ード線２Ｃの鍍金子′定部分を全て溶融半田５ａに浸漬
させる。すると、活性化したフラックス４ａにより、こ
の溶融半田５ａがリード線２ｃに十分；こ馴染み半田が
確実に付着することになる。そして、このり一ト線２Ｃ
を半田槽５から２０〜４ Ｑ（ｍ／ｓｅｃ程度の速度で
急速に引き上げれば、同図（ニ）に示すように、気密端
子２の下方側に突出したり一ト線２Ｃに半田鍍金６が施
される。この際、半田槽５の溶融半田５ａは、比較的低
い温度に設定されているために粘度が高い。また、リー
ド線２Ｃの引き上げ速度が速いために、付着した溶融半
田５ａは流れ落ちる前に急冷されて凝固する。このため
、リード線２ｃの半田鍍金６は、膜厚が３μｍ以上の厚
いものとなり、後の水晶振動子の実装時にプリント基板
への半田付は性を十分に確保することができるようにな
る。Therefore, the second line 1-to-line 2c is connected to the molten solder 5a from the lower end.
The heat is transmitted and preheated to about 200° C., and the flux 4a attached to the surface of the lead wire 2C in the pretreatment is sufficiently activated. Therefore, as shown in FIG. 3C, the plated portion of the second lead wire 2C is entirely immersed in the molten solder 5a. Then, the activated flux 4a ensures that the molten solder 5a adheres sufficiently to the lead wire 2c. And Konori Itto Line 2C
If the wire is rapidly pulled up from the solder tank 5 at a speed of about 20 to 4 Q (m/sec), the solder plated wire 6 will protrude below the airtight terminal 2 and the solder plated wire 2C will be removed as shown in Figure (d). At this time, the molten solder 5a in the solder bath 5 has a high viscosity because it is set at a relatively low temperature.Also, since the pulling speed of the lead wire 2C is fast, the adhered molten solder 5a is rapidly cooled and solidified before flowing down.For this reason, the solder plating 6 of the lead wire 2c has a thickness of 3 μm or more, and it is difficult to solder it to the printed circuit board later when mounting the crystal resonator. will be able to secure it.
以上説明したようここ、本実施例の半田浸漬鍍金方法に
よれば、比較的温度の低い溶融半田５ａを使用し、て膜
厚の厚い半田鍍金を行う場合にも、半田をリード＆Ｉ２
ｃに確実；こ付着させろことができろようになる。As explained above, according to the solder immersion plating method of this embodiment, even when performing thick solder plating using the molten solder 5a having a relatively low temperature, the solder can be used as lead & I2.
Make sure to attach it to the c.
本実施例の方法と予熱を行わない従来の方法とにより実
際にリード線に半田の浸漬鍍金を行った結果、半田がこ
のり−ト線に十分に付着せずに鍍金不良となった割合が
従来は１．０％であったのに対し、て、本実施例て；よ
０．１％まで低減させることができた。As a result of actually immersion plating lead wires with solder using the method of this example and the conventional method that does not involve preheating, the percentage of plating failures due to insufficient adhesion of solder to the lead wires was reduced. While it was 1.0% in the conventional case, this embodiment was able to reduce it to 0.1%.
以上の説明から明かなように、本発明の半田浸漬鍍金方
法は、比較的温度の低い溶融半田を使用して半田鍍金の
膜厚を厚くした場合にも、この半田のリード線への付着
を確実にし・、鍍金不良を防止することができろという
効果を奏する。As is clear from the above description, the solder immersion plating method of the present invention prevents the adhesion of this solder to the lead wires even when the solder plating film is thickened using molten solder at a relatively low temperature. This has the effect of ensuring reliability and preventing plating defects.
第１図（イ）〜（ニ）は本発明の一実施例を示すもので
あって、それぞれ気密端子のり一ト線に半田の浸漬鍍金
を施す方法の各工程を示す縦断面図、第２図は水晶振動
子の構造を示すための縦断面図、第３図（イ）〜（ハ）
は従来例を示すものであって、それぞれ気密端子のり一
ト線に半田の浸漬鍍金を施す方法の各工程を示す縦断面
図である。
２ｃ・・・リード線、
４ａ・・・フラックス、
５ａ・・・溶融半田、
６・・・半田鍍金。
特 許 出 願 人
関西日本電気株式会社
藁１図
第２図1(A) to 1(D) show one embodiment of the present invention, and FIG. 1(A) to FIG. The figure is a vertical cross-sectional view to show the structure of the crystal resonator, Figures 3 (a) to (c)
1A and 1B are longitudinal cross-sectional views showing each step of a method of immersion plating solder on a glued wire of an airtight terminal, respectively, showing a conventional example. 2c... Lead wire, 4a... Flux, 5a... Molten solder, 6... Solder plating. Patent application Kansai NEC Corporation Figure 1 Figure 2
Claims (1)
半田に浸漬し半田の浸漬鍍金を行う半田浸漬鍍金方法に
おいて、 リード線の先端部のみを溶融半田に浸漬して一旦保持し
て予熱した後に、リード線の鍍金子定部分を全て溶融半
田に浸漬して半田の浸漬鍍金を行うことを特徴とする半
田浸漬鍍金方法。(1) In the solder immersion plating method in which the lead wire is pretreated with flux and then immersed in molten solder to perform solder immersion plating, only the tip of the lead wire is immersed in molten solder and held once for preheating. A solder immersion plating method characterized by performing solder immersion plating by immersing all the plated parts of lead wires in molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16089490A JPH0452258A (en) | 1990-06-19 | 1990-06-19 | Solder plating method by hot dipping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16089490A JPH0452258A (en) | 1990-06-19 | 1990-06-19 | Solder plating method by hot dipping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452258A true JPH0452258A (en) | 1992-02-20 |
Family
ID=15724663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16089490A Pending JPH0452258A (en) | 1990-06-19 | 1990-06-19 | Solder plating method by hot dipping |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452258A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6739044B2 (en) * | 2002-07-16 | 2004-05-25 | Unit Industries, Inc. | Electrical terminal tinning process |
-
1990
- 1990-06-19 JP JP16089490A patent/JPH0452258A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6739044B2 (en) * | 2002-07-16 | 2004-05-25 | Unit Industries, Inc. | Electrical terminal tinning process |
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