JPH0451060B2 - - Google Patents
Info
- Publication number
- JPH0451060B2 JPH0451060B2 JP60140770A JP14077085A JPH0451060B2 JP H0451060 B2 JPH0451060 B2 JP H0451060B2 JP 60140770 A JP60140770 A JP 60140770A JP 14077085 A JP14077085 A JP 14077085A JP H0451060 B2 JPH0451060 B2 JP H0451060B2
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- semiconductor device
- semiconductor devices
- charging
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14077085A JPS622557A (ja) | 1985-06-27 | 1985-06-27 | 半導体デバイスの静電破壊防止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14077085A JPS622557A (ja) | 1985-06-27 | 1985-06-27 | 半導体デバイスの静電破壊防止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS622557A JPS622557A (ja) | 1987-01-08 |
| JPH0451060B2 true JPH0451060B2 (cs) | 1992-08-18 |
Family
ID=15276339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14077085A Granted JPS622557A (ja) | 1985-06-27 | 1985-06-27 | 半導体デバイスの静電破壊防止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622557A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756670B1 (en) | 1988-08-26 | 2004-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and its manufacturing method |
| JPH0642495B2 (ja) * | 1988-10-17 | 1994-06-01 | 株式会社半導体エネルギー研究所 | 電子装置及びその作製方法 |
| WO2015111028A1 (en) | 2014-01-27 | 2015-07-30 | Danieli & C. Officine Meccaniche S.P.A. | Station for inspecting rolled strips in coils |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58102545A (ja) * | 1981-12-15 | 1983-06-18 | Nec Corp | 混成集積回路 |
-
1985
- 1985-06-27 JP JP14077085A patent/JPS622557A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS622557A (ja) | 1987-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4821148A (en) | Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound | |
| Comizzoli et al. | Corrosion of electronic materials and devices | |
| US3585461A (en) | High reliability semiconductive devices and integrated circuits | |
| JPS63172746A (ja) | エポキシの除去方法 | |
| JP4056394B2 (ja) | ワイヤボンディングのための銅メタライゼーションダイの処理方法 | |
| US4423548A (en) | Method for protecting a semiconductor device from radiation indirect failures | |
| JP2002110613A (ja) | プラズマ洗浄装置及びプラズマ洗浄方法 | |
| JPH0451060B2 (cs) | ||
| Kubacki | Low temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost sealed chip-on-board (SCOB) assemblies | |
| JPS58199543A (ja) | 半導体装置のパツケ−ジ | |
| US3181229A (en) | Hermetically sealed semiconductor device and method for producing it | |
| US2807558A (en) | Method of sealing a semi-conductor device | |
| GB2235444A (en) | A method of producing insulating layers | |
| JPS6310547A (ja) | 半導体装置 | |
| JPH0198668A (ja) | 樹脂組成物 | |
| JPS61290740A (ja) | 半導体装置の製造方法 | |
| JPS6132810B2 (cs) | ||
| CN111621827A (zh) | 一种提升封装后的半导体器件抗盐雾能力的处理方法 | |
| Takaoka et al. | Development of Anti-ESD Backgrinding Tape | |
| JPH05152378A (ja) | テープキヤリアパツケージ | |
| JPS6051262B2 (ja) | 半導体装置 | |
| JPS5816549A (ja) | 半導体装置の容器 | |
| Kubacki | Low temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost Sealed Chip-on-Board (SCOB) assemblies | |
| JPS6021890A (ja) | セラミツク材料からのアルフア粒子の放出を減少させる方法 | |
| JPH0276249A (ja) | 電子装置およびその作製方法 |