JPH0450779A - High-temperature acceleration testing machine incorporated type device - Google Patents
High-temperature acceleration testing machine incorporated type deviceInfo
- Publication number
- JPH0450779A JPH0450779A JP2160138A JP16013890A JPH0450779A JP H0450779 A JPH0450779 A JP H0450779A JP 2160138 A JP2160138 A JP 2160138A JP 16013890 A JP16013890 A JP 16013890A JP H0450779 A JPH0450779 A JP H0450779A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- test
- heating
- testing machine
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 32
- 230000001133 acceleration Effects 0.000 title abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 230000007547 defect Effects 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、半導体集積回路の高温加熱試験機に関し、特
に試験装置に内蔵された高温加速試験機内蔵型装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high-temperature heating tester for semiconductor integrated circuits, and more particularly to a built-in high-temperature accelerated tester built into a tester.
［従来の技術］
従来、半導体集積回路が組み込まれた装置の高温過熱加
速試験の実施手段としては、製品、あるいは、半製品の
状態で専用の高温加速装置でエージングを行なっていた
。[Prior Art] Conventionally, as a means of performing a high-temperature accelerated overheating test on a device in which a semiconductor integrated circuit is incorporated, a product or a semi-finished product is subjected to aging in a dedicated high-temperature accelerator.
［発明が解決しようとする課題］
上述した従来の半導体集積回路における高温加速試験は
主として加速試験装置での試験、ある（１は、装置実装
状態での高温試験でしか考慮されていない。したがって
加速試験装置、ある℃）は、装置実装時における高温発
生装置あるいは温度試験室を長期間占宵、あるいは、専
用装置が必要であるという欠点がある。[Problems to be Solved by the Invention] The above-mentioned conventional high-temperature accelerated testing of semiconductor integrated circuits is mainly a test using an accelerated testing device. The disadvantage of testing equipment (at a certain temperature) is that it requires a high-temperature generator or a temperature test chamber for a long period of time when the equipment is mounted, or that it requires dedicated equipment.
本発明の目的は、通電中の半導体集積回路搭載装置その
ものを試験期間中高温に自動的に変化および維持させる
ことにより、半導体集積回路の初期不良を除去し高品質
、高信頼度が得られるように構成した高温加速試験機内
蔵型装置を提供することにある。An object of the present invention is to eliminate initial defects in semiconductor integrated circuits and obtain high quality and reliability by automatically changing and maintaining a high temperature of a device equipped with a semiconductor integrated circuit during a test period. An object of the present invention is to provide a device with a built-in high-temperature accelerated testing machine configured as follows.
［課題を解決するための手段］
本発明の高温加速試験機内蔵型装置は、半導体集積回路
において存在する初期不良を早期に摘出するための手段
を有する装置であって、素子を高温に設定する加熱手段
と、設定温度を維持する温度調整手段と、高温加熱を制
御する制御手段とを具備することを特徴とする。[Means for Solving the Problems] The device with a built-in high-temperature accelerated tester of the present invention is a device that has a means for early extraction of initial defects present in semiconductor integrated circuits, and includes a device that sets an element to a high temperature. It is characterized by comprising a heating means, a temperature adjustment means for maintaining a set temperature, and a control means for controlling high temperature heating.
［実施例コ 次に本発明について図面を参照して説明する。[Example code] Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の高温加速手段を示すブロッ
ク図であり、第２図は高温加速試験機内蔵型装置の実施
例を示すレイアウト図である。第１図において、１は高
温加速制御回路、２−１〜２−ｎ ｉ （ｎ＝ Ｌ
２．・・・・・・・・・ ｉ＝Ｌ ２＋ ・・・・・
・・・・）は温度センサー ３−１〜３−ｎｉは加熱回
路である。FIG. 1 is a block diagram showing a high temperature acceleration means according to an embodiment of the present invention, and FIG. 2 is a layout diagram showing an embodiment of an apparatus with a built-in high temperature acceleration tester. In FIG. 1, 1 is a high temperature acceleration control circuit, 2-1 to 2-ni (n=L
2.・・・・・・・・・ i=L 2+ ・・・・・・
...) is a temperature sensor, and 3-1 to 3-ni are heating circuits.
第１図において、高温加速制御回路１は高温加速試験を
制御するための回路であり、温度センサー２−１〜２−
ｎｉは集積回路搭載装置の温度を検出する回路で、加熱
回路３−１〜３−ｎｉは温度センサー２−１〜２−ｎｉ
の出力により、集積回路搭載装置を加熱し高温加速試験
を実施するための条件を含む回路である。In FIG. 1, a high temperature acceleration control circuit 1 is a circuit for controlling a high temperature acceleration test, and temperature sensors 2-1 to 2-
ni is a circuit that detects the temperature of the integrated circuit mounted device, and heating circuits 3-1 to 3-ni are temperature sensors 2-1 to 2-ni.
This is a circuit that includes the conditions for heating an integrated circuit equipped device and performing a high temperature accelerated test using the output of .
次に第１図の高温加速試験回路の動作について具体的に
説明する。高温加速制御回路１が高温加速試験指示を受
けると温度センサー２−１〜２−ｎｉに試験指示を出す
。温度センサー２−１〜２−ｎｉは試験指示を受けると
、高温加速試験設定温度と、集積回路搭載装置自体の温
度を比較し、集積回路搭載装置の温度が試験温度設定値
より低い場合は、高温加速制御回路が加熱指示を加熱回
路に出力し、高い場合は出力しない。加熱回路３−１〜
３−ｎｉは加熱指示を受けている間、集積回路搭載装置
を加熱する。このことにより集積回路搭載装置が高温に
、また、一定温度に設定されていることがわかる。Next, the operation of the high temperature accelerated test circuit shown in FIG. 1 will be specifically explained. When the high temperature acceleration control circuit 1 receives a high temperature acceleration test instruction, it issues a test instruction to the temperature sensors 2-1 to 2-ni. When temperature sensors 2-1 to 2-ni receive a test instruction, they compare the high temperature accelerated test set temperature with the temperature of the integrated circuit mounted device itself, and if the temperature of the integrated circuit mounted device is lower than the test temperature set value, The high temperature acceleration control circuit outputs a heating instruction to the heating circuit, and does not output if the temperature is high. Heating circuit 3-1~
3-ni heats the integrated circuit mounted device while receiving the heating instruction. This shows that the integrated circuit mounted device is set at a high temperature and at a constant temperature.
［発明の効果コ
以上説明したように本発明は、高温加速制御回路と温度
センサーと加熱回路を集積回路搭載装置上に構成するこ
とにより、集積回路を専用試験室または専用試験機を必
要とせず任意に、いつでも高温加速試験ができるという
効果を奏する。[Effects of the Invention] As explained above, the present invention configures a high temperature acceleration control circuit, a temperature sensor, and a heating circuit on an integrated circuit mounting device, thereby making it possible to test integrated circuits without the need for a dedicated testing room or dedicated testing machine. This has the effect of allowing high temperature accelerated testing to be carried out at any time.
第１図は本発明の一実施例のブロック図、第２図は第１
図に示す高温加速制御回路のレイアウト図である。
１・・・高温加速制御回路、２−１〜２−ｎｉ・・・温
度センサー ３−１〜３−ｎｉ・・・加熱回路。FIG. 1 is a block diagram of one embodiment of the present invention, and FIG. 2 is a block diagram of an embodiment of the present invention.
FIG. 3 is a layout diagram of the high temperature acceleration control circuit shown in the figure. 1... High temperature acceleration control circuit, 2-1 to 2-ni... Temperature sensor 3-1 to 3-ni... Heating circuit.
Claims (1)
摘出するための手段を有する装置であって、素子を高温
に設定する加熱手段と、設定温度を維持する温度調整手
段と、高温加熱を制御する制御手段とを具備することを
特徴とする高温加速試験機内蔵型装置。 ２、前記加熱手段、温度調整手段、制御手段を集積回路
搭載装置上に構成したことを特徴とする請求項１記載の
高温加速試験機内蔵型装置。[Scope of Claims] 1. An apparatus having means for early extraction of initial defects existing in a semiconductor integrated circuit, comprising a heating means for setting an element to a high temperature, and a temperature adjustment means for maintaining the set temperature. 1. A high-temperature accelerated testing device built-in device, comprising: a control means for controlling high-temperature heating. 2. The device with a built-in high-temperature accelerated tester according to claim 1, wherein the heating means, temperature adjustment means, and control means are constructed on an integrated circuit mounted device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160138A JPH0450779A (en) | 1990-06-19 | 1990-06-19 | High-temperature acceleration testing machine incorporated type device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160138A JPH0450779A (en) | 1990-06-19 | 1990-06-19 | High-temperature acceleration testing machine incorporated type device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0450779A true JPH0450779A (en) | 1992-02-19 |
Family
ID=15708696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2160138A Pending JPH0450779A (en) | 1990-06-19 | 1990-06-19 | High-temperature acceleration testing machine incorporated type device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0450779A (en) |
-
1990
- 1990-06-19 JP JP2160138A patent/JPH0450779A/en active Pending
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