JPH0450216U - - Google Patents
Info
- Publication number
- JPH0450216U JPH0450216U JP9161890U JP9161890U JPH0450216U JP H0450216 U JPH0450216 U JP H0450216U JP 9161890 U JP9161890 U JP 9161890U JP 9161890 U JP9161890 U JP 9161890U JP H0450216 U JPH0450216 U JP H0450216U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing
- lead frame
- cavities
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9161890U JPH0450216U (xx) | 1990-09-03 | 1990-09-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9161890U JPH0450216U (xx) | 1990-09-03 | 1990-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0450216U true JPH0450216U (xx) | 1992-04-28 |
Family
ID=31827422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9161890U Pending JPH0450216U (xx) | 1990-09-03 | 1990-09-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0450216U (xx) |
-
1990
- 1990-09-03 JP JP9161890U patent/JPH0450216U/ja active Pending