JPH0221736U - - Google Patents

Info

Publication number
JPH0221736U
JPH0221736U JP9949588U JP9949588U JPH0221736U JP H0221736 U JPH0221736 U JP H0221736U JP 9949588 U JP9949588 U JP 9949588U JP 9949588 U JP9949588 U JP 9949588U JP H0221736 U JPH0221736 U JP H0221736U
Authority
JP
Japan
Prior art keywords
cavity
mold
heat plate
sealing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9949588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9949588U priority Critical patent/JPH0221736U/ja
Publication of JPH0221736U publication Critical patent/JPH0221736U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP9949588U 1988-07-27 1988-07-27 Pending JPH0221736U (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9949588U JPH0221736U (xx) 1988-07-27 1988-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9949588U JPH0221736U (xx) 1988-07-27 1988-07-27

Publications (1)

Publication Number Publication Date
JPH0221736U true JPH0221736U (xx) 1990-02-14

Family

ID=31326706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9949588U Pending JPH0221736U (xx) 1988-07-27 1988-07-27

Country Status (1)

Country Link
JP (1) JPH0221736U (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008068466A (ja) * 2006-09-13 2008-03-27 Sumitomo Heavy Ind Ltd モールド金型及びモールド方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008068466A (ja) * 2006-09-13 2008-03-27 Sumitomo Heavy Ind Ltd モールド金型及びモールド方法
JP4568258B2 (ja) * 2006-09-13 2010-10-27 住友重機械工業株式会社 モールド金型及びモールド方法

Similar Documents

Publication Publication Date Title
JPH0221736U (xx)
JPS5961923U (ja) 射出成形用金型
JPH01176928U (xx)
JPH0231129U (xx)
JPH01156016U (xx)
JPS63177039U (xx)
JPH0195734U (xx)
JPS631341U (xx)
JPS6341524U (xx)
JPH0415854U (xx)
JPS6139939U (ja) 半導体装置の樹脂封止成形金型装置
JPS6320446U (xx)
JPS6280331U (xx)
JPH0256610U (xx)
JPS6258044U (xx)
JPS6167113U (xx)
JPS63162529U (xx)
JPH0267639U (xx)
JPS6341525U (xx)
JPS6237937U (xx)
JPS6420728U (xx)
JPS645447U (xx)
JPH0316361U (xx)
JPH031535U (xx)
JPH0263547U (xx)