JPH0448690U - - Google Patents
Info
- Publication number
- JPH0448690U JPH0448690U JP9058990U JP9058990U JPH0448690U JP H0448690 U JPH0448690 U JP H0448690U JP 9058990 U JP9058990 U JP 9058990U JP 9058990 U JP9058990 U JP 9058990U JP H0448690 U JPH0448690 U JP H0448690U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- protrusions
- protrusion
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 210000000078 claw Anatomy 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9058990U JPH0448690U (sl) | 1990-08-28 | 1990-08-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9058990U JPH0448690U (sl) | 1990-08-28 | 1990-08-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0448690U true JPH0448690U (sl) | 1992-04-24 |
Family
ID=31825478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9058990U Pending JPH0448690U (sl) | 1990-08-28 | 1990-08-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0448690U (sl) |
-
1990
- 1990-08-28 JP JP9058990U patent/JPH0448690U/ja active Pending
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