JPH0448656U - - Google Patents
Info
- Publication number
- JPH0448656U JPH0448656U JP1990091438U JP9143890U JPH0448656U JP H0448656 U JPH0448656 U JP H0448656U JP 1990091438 U JP1990091438 U JP 1990091438U JP 9143890 U JP9143890 U JP 9143890U JP H0448656 U JPH0448656 U JP H0448656U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- laser device
- electrode surface
- heat sinks
- liquid metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/341—Dispositions of die-attach connectors, e.g. layouts
- H10W72/347—Dispositions of multiple die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
- H10W72/527—Multiple bond wires having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091438U JPH0448656U (enFirst) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990091438U JPH0448656U (enFirst) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448656U true JPH0448656U (enFirst) | 1992-04-24 |
Family
ID=31827068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990091438U Pending JPH0448656U (enFirst) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448656U (enFirst) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045274A (ja) * | 2008-08-18 | 2010-02-25 | Seiko Epson Corp | レーザ光源装置、プロジェクタ、モニタ装置 |
| JP2010067731A (ja) * | 2008-09-10 | 2010-03-25 | Nec Corp | 光モジュール及び光伝送方法 |
| JP2012527754A (ja) * | 2009-05-22 | 2012-11-08 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | パルス制御される高出力レーザダイオード用のヒートシンク |
| JP2014060452A (ja) * | 2013-12-18 | 2014-04-03 | Seiko Epson Corp | 固体光源装置、プロジェクタ、モニタ装置 |
| JP2015099388A (ja) * | 2015-02-02 | 2015-05-28 | セイコーエプソン株式会社 | 固体光源装置、プロジェクタ、モニタ装置 |
-
1990
- 1990-08-31 JP JP1990091438U patent/JPH0448656U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010045274A (ja) * | 2008-08-18 | 2010-02-25 | Seiko Epson Corp | レーザ光源装置、プロジェクタ、モニタ装置 |
| JP2010067731A (ja) * | 2008-09-10 | 2010-03-25 | Nec Corp | 光モジュール及び光伝送方法 |
| JP2012527754A (ja) * | 2009-05-22 | 2012-11-08 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | パルス制御される高出力レーザダイオード用のヒートシンク |
| JP2014060452A (ja) * | 2013-12-18 | 2014-04-03 | Seiko Epson Corp | 固体光源装置、プロジェクタ、モニタ装置 |
| JP2015099388A (ja) * | 2015-02-02 | 2015-05-28 | セイコーエプソン株式会社 | 固体光源装置、プロジェクタ、モニタ装置 |