JPH04756U - - Google Patents

Info

Publication number
JPH04756U
JPH04756U JP1990040378U JP4037890U JPH04756U JP H04756 U JPH04756 U JP H04756U JP 1990040378 U JP1990040378 U JP 1990040378U JP 4037890 U JP4037890 U JP 4037890U JP H04756 U JPH04756 U JP H04756U
Authority
JP
Japan
Prior art keywords
lsi
heat dissipation
dissipation fin
fin block
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990040378U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990040378U priority Critical patent/JPH04756U/ja
Publication of JPH04756U publication Critical patent/JPH04756U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
JP1990040378U 1990-04-16 1990-04-16 Pending JPH04756U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990040378U JPH04756U (enFirst) 1990-04-16 1990-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990040378U JPH04756U (enFirst) 1990-04-16 1990-04-16

Publications (1)

Publication Number Publication Date
JPH04756U true JPH04756U (enFirst) 1992-01-07

Family

ID=31550118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990040378U Pending JPH04756U (enFirst) 1990-04-16 1990-04-16

Country Status (1)

Country Link
JP (1) JPH04756U (enFirst)

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